专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

WO2007049376A1 高周波モジュール审中-公开
标题翻译：高频模块
公开(公告)号：WO2007049376A1
公开(公告)日：2007-05-03
申请号：PCT/JP2006/311593
申请日：2006-06-09
申请人：株式会社村田製作所 , 渡辺邦広
发明人：渡辺邦広
IPC分类号： H01Q13/08 , H01L25/00 , H01Q1/24 , H01Q1/52 , H01Q23/00
CPC分类号： H01Q1/526 , H01L24/48 , H01L25/162 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/19106 , H01L2924/3025 , H01Q9/0485 , H01Q23/00 , H05K1/0218 , H05K1/141 , H05K3/284 , H05K2201/0715 , H05K2201/09772 , H05K2201/10242 , H05K2203/1572 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要：小型化を図ることができ、かつアンテナからの放射電磁界による特性の劣化が生じ難い、高周波モジュールを提供する。　第２の基板３の第１の主面３ａ上にアンテナ素子５が設けられており、第１の基板２の第１の主面２ａと、第２の基板３の第２の主面３ｂとが対向されており、かつ両者が導電性接続部材８により接合されており、第１の基板２の第１の主面２ａ上に電子部品としてのＩＣチップ１６などが実装されており、第１の基板２にグラウンド電極２３，２４が形成されており、第２の基板３がグラウンド電極４，９を有し、導電性接続部材８がグラウンド電位に接続されており、従って、ＩＣチップ１６が、第１，第２の基板２，３に設けられたグラウンド電極４，９，２３，２４と、導電性接続部材８とで囲まれている、高周波モジュール１。
摘要翻译：高频模块可以被小型化并且由于来自天线的辐射电磁场而受到特性劣化的影响。在高频模块（1）中，天线元件（5）设置在第二基板（3）的第一主表面（3a）上，第一基板（2）的第一主表面（2a）和第二基板第二基板（3）的第二主表面（3b）彼此相对，两者通过导电连接构件（8）连接，作为电子部件等的IC芯片（16）安装在第一基板（2）的第一主表面（2a），接地电极（23,24）形成在第一基板（2）上，第二基板（3）具有接地电极（4,9），并且导电连接构件（8）连接到地电位。因此，IC芯片（16）被设置在第一基板（2）和第二基板（3）上的接地电极（4,9,23,24）和导电连接部件（8）所包围。

62. 发明申请

WO2007048300A1 FLEXIBLE PRINTED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：柔性印刷电路及其制造方法
公开(公告)号：WO2007048300A1
公开(公告)日：2007-05-03
申请号：PCT/CN2006/001886
申请日：2006-07-28
申请人： BYD COMPANY LIMITED , ZHANG, Hua
发明人： ZHANG, Hua
IPC分类号： H05K9/00 , H05K3/38 , C09J7/00
CPC分类号： H05K3/38 , H05K1/0218 , H05K1/118 , H05K3/0058 , H05K2201/0355 , H05K2201/0715 , H05K2201/09909 , H05K2201/2009 , H05K2203/0191 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by printing the ink onto the silver foil and then attaching the reinforcement plate, especially printing the ink in the form of a dot, strip or mesh, the total thickness of the flexible printed circuit will not increase while the surface roughness of the silver foil increases, resulting in increase of adhesion of the reinforcement plate. This strengthens the attachment between the reinforcement plate and the silver foil, meeting the requirement of peeling-resistant strength between the reinforcement plate and the silver foil.
摘要翻译：公开了一种柔性印刷电路，其包括基板，以及依次安装在所述基板上的银箔和加强板，其中在所述银箔和所述加强板之间存在墨层。根据本发明，通过将油墨印刷到银箔上，然后连接加强板，特别是以点状，带状或网状形式印刷油墨，柔性印刷电路的总厚度将不会增加，而表面粗糙度的银箔增加，导致增强板的附着力增加。这加强了加强板和银箔之间的连接，满足了加强板和银箔之间的耐剥离强度要求。

63. 发明申请

WO2006060383A2 MULTILAYERED CIRCUIT BOARD FOR HIGH-SPEED, DIFFERENTIAL SIGNALS 审中-公开
标题翻译：用于高速，差分信号的多层电路板
公开(公告)号：WO2006060383A2
公开(公告)日：2006-06-08
申请号：PCT/US2005/043117
申请日：2005-11-30
申请人： LITTON SYSTEMS, INC. , BENHAM, John E.
发明人： BENHAM, John E.
IPC分类号： H05K7/06
CPC分类号： H05K1/115 , H05K1/0237 , H05K3/308 , H05K2201/0715 , H05K2201/09236 , H05K2201/09536 , H05K2201/09627 , H05K2201/09718 , H05K2201/10189 , H05K2201/1059
摘要： The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications.
摘要翻译：本发明提供一种可用于高密度和高速电子应用的多层电路板。

64. 发明申请

WO2005119765A3 ASSEMBLY INCLUDING VERTICAL AND HORIZONTAL JOINED CIRCUIT PANELS 审中-公开
标题翻译：组装包括垂直和水平接合电路板
公开(公告)号：WO2005119765A3
公开(公告)日：2006-03-09
申请号：PCT/US2005019319
申请日：2005-06-02
申请人： TESSERA INC , GREEN RONALD , KRISHNAN SRIDHAR , WILSON STUART E , SHOOK JAMES GILL , TSAI MING , STAVROS ANDY
发明人： GREEN RONALD , KRISHNAN SRIDHAR , WILSON STUART E , SHOOK JAMES GILL , TSAI MING , STAVROS ANDY
IPC分类号： H05K3/36 , H01L23/34 , H05K1/14 , H05K3/00 , H05K3/34 , H05K3/40
CPC分类号： H05K3/368 , H05K1/145 , H05K3/0052 , H05K3/3442 , H05K3/366 , H05K3/403 , H05K3/4092 , H05K2201/0397 , H05K2201/048 , H05K2201/0715 , H05K2201/09036 , H05K2201/09181 , H05K2201/09845 , H05K2201/0999 , H05K2201/10484
摘要： An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.
摘要翻译：提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。此外，第二电路板具有底表面，第二电介质元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及布置在电介质元件上的多个互连迹线。互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通互连线。

65. 发明申请

WO2002103839A1 TRANSMISSION STRUCTURE WITH AN AIR DIELECTRIC 审中-公开
标题翻译：传输结构与空气电介质
公开(公告)号：WO2002103839A1
公开(公告)日：2002-12-27
申请号：PCT/US2002/016201
申请日：2002-05-21
申请人： SILICON PIPE, INC.
发明人： FJELSTAD, Joseph, Charles
IPC分类号： H01P3/08
CPC分类号： H01P3/088 , H05K1/024 , H05K2201/0715
摘要： The dielectric constant and loss tangent of a transmission line structure is lowered by sandwiching a conductor (Cdn) between two dielectric structures (110, 120), one or both of which have a series of openings. The conductor (CDn) is formed across the each opening of the dielectric structures (110, 120). The dielectric structures (110, 120) provide structural support for the conductor while exposing a significant portion of the transmission line structure to air, thereby providing a largely air dielectric structure.
摘要翻译：通过将导体（Cdn）夹在两个电介质结构（110,120）之间，其中一个或两个具有一系列开口来降低传输线结构的介电常数和损耗角正切。导体（CDn）横跨电介质结构（110,120）的每个开口形成。电介质结构（110,120）为导体提供结构支撑，同时将传输线结构的大部分暴露于空气，从而提供大的空气介质结构。

66. 发明申请

WO01080347A1 SUSPENDED TRANSMISSION LINE WITH EMBEDDED AMPLIFIER 审中-公开
标题翻译：具有嵌入式放大器的悬挂传输线
公开(公告)号：WO01080347A1
公开(公告)日：2001-10-25
申请号：PCT/US2001/011277
申请日：2001-04-06
IPC分类号： H01P3/08 , H05K1/02 , H05K1/18
CPC分类号： H01P3/087 , H05K1/0219 , H05K1/0243 , H05K1/185 , H05K2201/0715 , H05K2201/09618 , H05K2201/09672 , H05K2201/10166
摘要： A suspended transmission line with an embedded amplifier includes a support layer and a conductor supported on the support layer between first and second plates each having a ground plane. The conductor includes an input section and an output section. A propagation structure is disposed between the first and second plates to substantially encompass an electric field generated by a signal transmitted on the conductor. An amplifier is coupled to the input and output sections of the conductor and is at least substantially disposed between the first and second plates. The amplifier operates to amplify an input signal received on the input section to generate an output signal on the output section.
摘要翻译：具有嵌入式放大器的悬挂传输线包括支撑层和支撑在第一和第二板之间的支撑层上的导体，每个具有接地平面。导体包括输入部分和输出部分。传播结构设置在第一和第二板之间，以基本上包围由在导体上传输的信号产生的电场。放大器耦合到导体的输入和输出部分，并且至少基本上设置在第一和第二板之间。放大器用于放大在输入部分上接收的输入信号，以在输出部分上产生输出信号。

67. 发明申请

WO01063996A2 ELECTRONIC PRINTED-CIRCUIT BOARD FOR ELECTRONIC DEVICES, ESPECIALLY COMMUNICATIONS TERMINALS 审中-公开
标题翻译：电子平板模块用于电子设备，特别是通信终端
公开(公告)号：WO01063996A2
公开(公告)日：2001-08-30
申请号：PCT/DE2001/000711
申请日：2001-02-23
IPC分类号： H05K1/02 , H05K1/14 , H05K3/32 , H05K3/34 , H05K3/36 , H05K7/00
CPC分类号： H05K1/141 , H05K1/0243 , H05K3/323 , H05K3/3436 , H05K3/368 , H05K2201/068 , H05K2201/0715
摘要： The aim of the invention is to improve the modular assembly technique used for assembling electronic printed-circuit boards (FBG1, FBG2) for electronic devices in order to incorporate the printed-circuit boards in electronic devices with electronic printed-circuit boards of the type mentioned above more flexibly in terms of the printed-circuit board material, in accordance with the respective field of application, size and weight requirements and manufacturing costs of the devices. To this end, the electronic devices are modularly assembled in terms of the printed-circuit board construction, with at least two printed-circuit boards (FBG1, FBG2) consisting of different materials with different temperature and length-related expansion coefficients. The individual printed-circuit boards are fixed with electroconductive fixing means (LB) in such a way that when they are in their fixed state, inner electrical, mechanically stable connections are provided between the two printed-circuit boards, concealed by the printed-circuit boards, in an intermediate assembly gap (MZR) formed by the printed-circuit boards. The different temperature and length-related expansion coefficients associated with the materials ensure that there are no material stresses that could destroy the connections.
摘要翻译：为了用于电子设备，以提高应用的模块化设计技术的电子印刷电路板（FBG1，FBG2）的结构，使得在电子印刷电路板的电子设备 - 类型的上述 - 这取决于应用和要求，在所述装置的尺寸，重量和制造成本相对于所述印刷电路板材料，可以灵活地利用印刷电路板的，相对于所述施工概念多氯联苯模块式电子装置，具有至少两个由具有不同温度和构造长度相关的膨胀系数的印刷电路板组件（FBG1，FBG2）与各个印刷电路板是通过电连接不同的材料导电固定装置（LB）被固定在掩盖一方面紧密电通过在由所述印刷电路板在印刷电路板组件的固定状态安装空间（MZR）和所形成的空间的印刷电路板组件的方式出现另一方面，两个印刷电路板组件之间，并且由于有损耗材料不同的温度，并且不发生长度相关的膨胀系数，所述化合物损坏材料应力稳定的机械连接。

68. 发明申请

WO00030206A1 ADAPTERS FOR RF CONNECTORS 审中-公开
标题翻译：射频连接器适配器
公开(公告)号：WO00030206A1
公开(公告)日：2000-05-25
申请号：PCT/US1999/027405
申请日：1999-11-17
IPC分类号： H01R13/646 , H01R31/06 , H05K1/02 , H05K1/14 , H05K3/34 , H01P5/02
CPC分类号： H01R24/50 , H01R31/06 , H01R2103/00 , H05K1/0243 , H05K1/141 , H05K3/3447 , H05K2201/049 , H05K2201/0715
摘要： A plurality of adapters (100) connects RF connectors (123) to a printed circuit board (104). The adapters each include a foot print for receiving the RF connector and a plurality of pins for mounting the connector to a prototyping board. The output signal of the RF connector may be coupled to a controlled impedance transmission line (127), and each adapter is also configured with a ground plane (101). The adapters may be configured for use with connectors such as SMA and BNC connectors. The adapters support easy connection of the RF connector to the prototyping board and minimize the noise associated with the input of the RF signal.
摘要翻译：多个适配器（100）将RF连接器（123）连接到印刷电路板（104）。适配器各自包括用于接收RF连接器的脚印和用于将连接器安装到原型板的多个销。 RF连接器的输出信号可以耦合到受控阻抗传输线（127），并且每个适配器还配置有接地平面（101）。适配器可以配置为与诸如SMA和BNC连接器的连接器一起使用。适配器支持将RF连接器轻松连接到原型设计板，并将与RF信号的输入相关联的噪声降至最低。

69. 发明申请

WO1998019393A1 METHOD FOR PRODUCING AN ELECTRICAL COMPONENT AND RESULTING COMPONENT 审中-公开
标题翻译：用于生产电气部件和结果部件的方法
公开(公告)号：WO1998019393A1
公开(公告)日：1998-05-07
申请号：PCT/FR1997001911
申请日：1997-10-24
申请人： SECRE COMPOSANTS , MARCOU, Loïc , COUDIERE, Francis
发明人： SECRE COMPOSANTS
IPC分类号： H03H03/00
CPC分类号： H05K9/0016 , H01F41/041 , H03H7/0115 , H03H2001/0085 , H05K1/162 , H05K1/165 , H05K3/429 , H05K2201/0715 , H05K2201/09436
摘要： The invention concerns a method for producing an electrical component (10) consisting of a plurality of circuits (16, 18, 20, 22; 40, 42, 44, 46) printed on a corresponding plurality of flat insulating substrates (12, 14; 30, 32; 34, 36) stacked on one another to form a multilayered monolithic wafer, the printed circuits being mutually connected. The substrates are separated from one another by an insulating material (24), and each of the printed circuits having at least one zone for connection (50, 52, 54, 56, 58, 60) to at least another printed circuit, the connecting zones of two circuits to be mutually electrically connected being substantially in straight line with each other for being bored by a hole (70) for the passage of an electric conductor. The holes (70) are bored over the whole thickness of the wafer after the substrates have been stacked.
摘要翻译：本发明涉及一种用于制造电气部件（10）的方法，所述电气部件（10）由印刷在相应的多个平坦绝缘基板（12,14; 44）上的多个电路（16,18,20,22; 40,42,44,46）组成。 30,32,34,36）彼此堆叠以形成多层单片晶片，印刷电路相互连接。基板通过绝缘材料（24）彼此分开，并且每个印刷电路具有至少一个用于连接的区域（50,52,54,56,58,60）到至少另一个印刷电路，所述连接要彼此电连接的两个电路的区域彼此基本上彼此直线，以便由用于导电体通过的孔（70）钻孔。在堆叠基板之后，孔（70）在晶片的整个厚度上钻孔。

70. 发明申请

WO1997036340A1 BIDIRECTIONAL NON-SOLID IMPEDANCE CONTROLLED REFERENCE PLANE 审中-公开
标题翻译：双向非固体阻抗控制参考平面
公开(公告)号：WO1997036340A1
公开(公告)日：1997-10-02
申请号：PCT/US1997004108
申请日：1997-03-05
申请人： AST RESEARCH, INC.
发明人： AST RESEARCH, INC. , SUSKI, Edward, D.
IPC分类号： H01P03/08
CPC分类号： H01P3/088 , H05K1/0224 , H05K1/0253 , H05K1/0393 , H05K2201/0715 , H05K2201/09681
摘要： A circuit board includes a plurality of signal conductors (60, 62, 64) and a grid (20). The grid (20) has a pattern of conductive material which forms cell structures oriented along a first axis (Y). The grid pattern is configured so that when the signal conductors (60, 62, 64) are oriented parallel to the first axis (Y), they overlay a substantially constant area of the conductive material regardless of where the signal conductors (60, 62, 64) are positioned. The capacitance of the signal conductors (60, 62, 64) is thereby controlled so that the impedances of the signal conductors (60, 62, 64) can be maintained at a high level.
摘要翻译：电路板包括多个信号导体（60,62,64）和电网（20）。格栅（20）具有形成沿着第一轴线（Y）取向的单元结构的导电材料图案。格栅图案被配置为使得当信号导体（60,62,64）平行于第一轴线（Y）定向时，它们覆盖导电材料的基本恒定的区域，而不管信号导体（60,62,64） 64）。由此控制信号导体（60,62,64）的电容，使得信号导体（60,62,64）的阻抗能够保持在高电平。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式