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    • 65. 发明申请
    • PROCESS FOR ION EXCHANGE IN AQUEOUS SOLUTIONS BY MEANS OF ION EXCHANGE RESINS AND INSTALLATION FOR IMPLEMENTING THE PROCESS
    • 通过离子交换树脂进行水溶液离子交换的工艺和安装过程
    • WO1992005871A1
    • 1992-04-16
    • PCT/DE1991000795
    • 1991-10-04
    • SCHERING AKTIENGESELLSCHAFTPROSKE, Reinhard
    • SCHERING AKTIENGESELLSCHAFT
    • B01J47/00
    • B01J49/10B01J47/012B01J47/11
    • The invention is based on a process for ion exchange in aqueous solutions by means of ion exchange resins (hereinafter abbreviated to 'resins') in ion exchangers in which the resins are alternately charged, regenerated, and possibly treated and rinsed. In order to be able to remove the solution concerned without problems and also more economically, the process first provides for containers (18) with the resin (19) to be taken into a treatment chamber (17) whereafter the aqueous solution is introduced into the container and directed through the resin. Then, by lifting the container and holding it above the treatment chamber, the solution in the container and resin is caused to run off. Thereupon the container is taken to one or more chamber(s) (34, 36, 37, 37') of a regenerating, treating or rinsing station into which it is lowered and treated with the regenerating solution. Then, once again, by lifting the container and holding it above the regeneration chamber, the remaining regenerating solution is caused to run out of the container and the resin. Finally the container is taken to a further chamber for charging or regeneration. The invention also concerns an installation for implementing the process.
    • 本发明是基于离子交换树脂交替填充,再生和可能的处理和漂洗的离子交换树脂在离子交换树脂(以下简写为“树脂”)中在水溶液中进行离子交换的方法。 为了能够在没有问题的情况下更经济地去除有关的解决方案,该方法首先提供容器(18),使树脂(19)进入处理室(17),之后将水溶液引入 容器并引导通过树脂。 然后,通过提起容器并将其保持在处理室的上方,导致容器和树脂中的溶液流出。 于是容器被带到再生,处理或漂洗站的一个或多个室(34,36,37,37'),再次下水处理或冲洗站用再生溶液处理。 然后,再次通过提起容器并将其保持在再生室上方,使剩余的再生溶液从容器和树脂中流出。 最后,将容器带到另一个室进行充电或再生。 本发明还涉及用于实现该过程的安装。
    • 67. 发明申请
    • PROCESS AND DEVICE FOR CONTROLLING THE FLOW OF OPERATIONS IN ELECTROPLATING PLANTS
    • 控制电镀厂操作流程的过程和设备
    • WO1991008327A1
    • 1991-06-13
    • PCT/DE1990000943
    • 1990-11-30
    • SCHERING AKTIENGESELLSCHAFTBLÄSING, HorstMAURER, ManfredSCHRÖDER, Rolf
    • SCHERING AKTIENGESELLSCHAFT
    • C25D21/12
    • C25D21/12C25D17/12H05K3/241
    • A process is useful for controlling the flow of operations in electroplating plants with horizontal throughflow in which the parts to be electroplated, in particular plate-shaped parts, pass through the plant in succession and are electroplated by means of currents applied by anodes. In order to prevent undesirable, increased precipitation on the front faces or edges of parts to be electroplated which follow each other at undesirable distances apart, or at least to reduce this precipitation to an acceptable level, the position of the parts (1) which pass through the plant in succession and/or the distances (a1, a2) between these parts are detected and the application of the electroplating currents is controlled in function of these positions and/or distances by switching the anodes (4, 7) on and off, in such a manner that the flux density is approximately the same in all regions of the parts (1). The invention also concerns an arrangement for implementing the process.
    • PCT No.PCT / DE90 / 00943 Sec。 371日期:1992年6月18日 102(e)日期1992年6月18日PCT 1990年11月30日PCT PCT。 公开号WO91 / 08327 日期1991年6月13日。公开了一种用于控制具有水平通流的电镀设备中的操作流程的工艺和设备,其中待电镀的部件,特别是板形部件依次通过设备并通过 由阳极施加的电流的手段。 为了防止在不希望的距离处彼此相邻的要电镀的部件的正面或边缘上的不期望的增加的沉淀,或者至少将该沉淀降低至可接受的水平,通过工厂的部件的位置 连续地和/或这些部件之间的距离被检测,并且通过以这样的方式切换阳极来控制电镀电流的施加作为这些位置和/或距离的函数,即磁通密度近似为 在所有地区的零件相同。