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51. 发明申请

WO99052210A1 COMPONENT CARRIER 审中-公开
标题翻译：组件载体
公开(公告)号：WO99052210A1
公开(公告)日：1999-10-14
申请号：PCT/US1999/007653
申请日：1999-04-06
IPC分类号： H01R13/66 , H01G4/35 , H01R13/719 , H03H1/00 , H03H7/01 , H03H9/02 , H04B3/28 , H05K1/02 , H05K1/18 , H03H7/00 , H03H9/00
CPC分类号： H01R13/719 , H05K1/0237 , H05K1/18 , H05K1/181
摘要： The present invention is a component carrier consisting of a plate or disk (132) of insulating material having a plurality of apertures (148) for accepting the leads of a thru-hole differential and common mode filter (130). The overall configuration of the circuitry combines as an electrical circuit conditioning assembly to optimize component carriers for differential and common mode filters. The component carrier (132) provides increased physical support and protection, and substantially improves the electrical characteristics of the filters due to the increased shielding that is provided by the carriers.
摘要翻译：本发明是一种由绝缘材料的板或盘（132）组成的部件载体，其具有用于接纳通孔差分和共模滤波器（130）的引线的多个孔（148）。电路的整体结构组合为电路调节组件，以优化用于差分和共模滤波器的分量载波。分量载体（132）提供增加的物理支持和保护，并且由于由载体提供的增加的屏蔽，基本上改善了滤波器的电特性。

52. 发明申请

WO99037008A1 PAIRED MULTI-LAYERED DIELECTRIC INDEPENDENT PASSIVE COMPONENT ARCHITECTURE RESULTING IN DIFFERENTIAL AND COMMON MODE FILTERING WITH SURGE PROTECTION IN ONE INTEGRATED PACKAGE 审中-公开
标题翻译：配对的多层电介质独立的被动组件结构在一个集成的包中进行差分和共同模式过滤与防护
公开(公告)号：WO99037008A1
公开(公告)日：1999-07-22
申请号：PCT/US1999/001040
申请日：1999-01-16
IPC分类号： H01F27/28 , H01G4/35 , H02H9/04 , H03H1/00 , H03H7/09 , H05K1/14 , H05K1/16 , H05K3/34 , H02H9/00
CPC分类号： H01G4/35 , H03H1/0007 , H03H7/427 , H05K1/141 , H05K1/162 , H05K3/3436
摘要： The present invention relates to a passive electronic component architecture (10) employed in conjunction with various dielectric (16) and combinations of dielectric materials to provide one or more differential and common mode filters (12) for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components (22) to be assembled within a single package (10) such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.
摘要翻译：本发明涉及与各种电介质（16）结合使用的无源电子部件结构（10）和电介质材料的组合，以提供用于抑制电磁辐射和浪涌保护的一个或多个差模和共模滤波器（12）。该架构允许将单个或多个组件（22）组装在诸如集成电路或连接器的单个封装（10）内。该组件的架构是电介质独立的，并且提供单个组件内的各种电气特性的集成，以单独或组合地执行滤波，去耦，熔断和浪涌抑制的功能。

53. 发明申请

WO2022225517A1 CERAMIC FEEDTHROUGH ASSEMBLIES FOR ELECTRONIC DEVICES WITH METAL HOUSINGS 审中-公开
公开(公告)号：WO2022225517A1
公开(公告)日：2022-10-27
申请号：PCT/US2021/028336
申请日：2021-04-21
申请人： KYOCERA INTERNATIONAL, INC.
发明人： KIM, Franklin , EBLEN, Mark , MAKINO, Hiroshi , HIRA, Shinichi
IPC分类号： H01G4/35 , H01G4/12 , H05K5/00
摘要： A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

54. 发明申请

WO2022042946A1 EMV-Filter für ein Steuergerät 审中-公开
公开(公告)号：WO2022042946A1
公开(公告)日：2022-03-03
申请号：PCT/EP2021/070153
申请日：2021-07-19
申请人： ROBERT BOSCH GMBH
发明人： FACKLER, Rupert , HEIMBURGER, Stefan , GROSS, Michel
IPC分类号： H01G4/35 , H05K1/16
摘要： Die Erfindung betrifft ein EMV-Filter für ein Steuergerät. Das Filter weist einen Mehrlagen-Schaltungsträger, umfassend elektrisch leitfähige Schichten, insbesondere Kupferschichten, und elektrisch isolierende Leiterplattenschichten auf. Erfindungsgemäß bildet der Schaltungsträger der eingangs genannten Art wenigstens zwei Filterkondensatoren, wobei die Filterkondensatoren jeweils durch in dem Schaltungsträger ausgebildete und einander gegenüberliegende und/oder parallel beabstandete elektrisch leitfähige Schichten gebildet sind.

55. 发明申请

WO2022003437A1 SOLDER COLUMN GRID ARRAY CAPACITORS 审中-公开
公开(公告)号：WO2022003437A1
公开(公告)日：2022-01-06
申请号：PCT/IB2021/054293
申请日：2021-05-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM (CHINA) INVESTMENT COMPANY LTD. , IBM DEUTSCHLAND GMBH
发明人： BERGE, Layne , DOYLE, Matthew , DANGLER, John , SCHONECK, Kyle , LIANG, Thomas , WALTHER, Matthew , BJORGAARD, Jason
IPC分类号： H01G2/06 , H01G4/232 , H01G4/28 , H05K1/18 , H05K1/11 , H01L23/488 , H01G4/35 , H01L28/60 , H05K1/0231 , H05K1/162
摘要： A grid array capacitor (108) can be used to physically and electrically couple an integrated circuit (IC) package (106) to a printed circuit board (PCB) (114). The grid array capacitor (108) includes an inner conductor (118) and an inner dielectric (120) coaxially surrounding the inner conductor (118). A secondary conductor (122) can be located to surround, in a coaxial orientation, the inner dielectric (120). Both the inner conductor (118) and the secondary conductor (122) can be electrically connected to the integrated circuit package (106) and to the printed circuit board (114). In certain applications, the structure of the inner conductor (118), inner dielectric (120), and secondary conductor (122) can provide capacitance used to decouple electronic circuits.

56. 发明申请

WO2021239540A1 CAPACITOR ASSEMBLY 审中-公开
公开(公告)号：WO2021239540A1
公开(公告)日：2021-12-02
申请号：PCT/EP2021/063297
申请日：2021-05-19
申请人： TDK ELECTRONICS AG
发明人： BECK, Fabian , NIKLAS, Karl , RAMBOW, Wolfgang
IPC分类号： H01G4/30 , H01G4/35 , H01G4/38
摘要： The present invention concerns a capacitor assembly comprising DC link capacitor (1) and a class-Y capacitor (Cy) wherein the DC link capacitor (1) comprises a plurality of first electrodes (2) and a plurality of second electrodes (3), wherein the first electrodes (2) and second electrodes (3) are stacked alternately. The DC link capacitor (1) comprises also a plurality of dielectric layers (4) which are is disposed between each of the first electrodes (2) and second electrodes (3). The first electrodes (2), the second electrodes (3) and the dielectric layers (4) form flat surfaces.

57. 发明申请

WO2021099075A1 CONDENSER CORE WITH GROUNDED CONDUCTIVE FOILS IN A CAPACITIVE LAYER 审中-公开
公开(公告)号：WO2021099075A1
公开(公告)日：2021-05-27
申请号：PCT/EP2020/080171
申请日：2020-10-27
申请人： ABB POWER GRIDS SWITZERLAND AG
发明人： KANJE-NORDBERG, Jens , SJÖBERG, Peter , JOHANSSON, Kenneth
IPC分类号： H01G4/16 , H01G4/242 , H01G4/32 , H01G4/35 , H01B17/28
摘要： The present disclosure relates to a condenser core configured for surrounding an electrical conductor. The condenser core comprises an insulation material and a plurality of electrically conducting capacitive layers (5) for modifying electrical fields formed by a current flowing in the electrical conductor. At least one of the electrically conducting capacitive layers comprises a first foil (5a) and a second foil (5b). Each of the first and second foils of an outermost capacitive layer is connected with a grounding arrangement (10a, 10b) for grounding the foils.

58. 发明申请

WO2019090301A1 EMI FEEDTHROUGH FILTER TERMINAL ASSEMBLY CONTAINING A RESIN COATING OVER A HERMETICALLY SEALING MATERIAL 审中-公开
公开(公告)号：WO2019090301A1
公开(公告)日：2019-05-09
申请号：PCT/US2018/059369
申请日：2018-11-06
申请人： AVX CORPORATION
发明人： DOLLAR, JR., Donald E. , PLASCENCIA, Rigoberto Rios
IPC分类号： H01G4/236 , H01G4/35
摘要： The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers and a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; a feedthrough ferrule; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; a hermetically sealing material between the insulator and the feedthrough ferrule; and a resin coating over the hermetically sealing material.

59. 发明申请

WO2017151040A1 INTERPOSER WITH A NANOSTRUCTURE ENERGY STORAGE DEVICE 审中-公开
标题翻译：具有纳米结构能量存储装置的插入器
公开(公告)号：WO2017151040A1
公开(公告)日：2017-09-08
申请号：PCT/SE2017/050177
申请日：2017-02-24
申请人： SMOLTEK AB
发明人： KABIR, M Shafiqul , JOHANSSON, Anders , AMIN SALEEM, Muhammad , ENOKSSON, Peter , DESMARIS, Vincent , ANDERSSON, Rickard
IPC分类号： H01L23/498 , H01G4/35 , H01L23/50
摘要： An interposer device comprising an interposer substrate;a plurality of conducting vias extending through the interposer substrate;a conductor pattern on the interposer substrate, and a nanostructure energy storage device. The nanostructure energy storage device comprises at least a first plurality of conductive nanostructures formed on the interposer substrate;a conduction controlling material embedding each nanostructure in the first plurality of conductive nanostructures;a first electrode connected to each nanostructure in the first plurality of nanostructures; and a second electrode separated from each nanostructure in the first plurality of nanostructures by the conduction controlling material,wherein the first electrode and the second electrode are configured to allow electrical connection of the nanostructure energy storage device to the integrated circuit.
摘要翻译：一种中介层装置，包括中介层基板;延伸穿过中介层基板的多个导电过孔;中介层基板上的导体图案以及纳米结构能量存储装置。所述纳米结构能量存储装置包括至少第一多个导电纳米结构，所述第一多个导电纳米结构形成在所述中介层基底上;导电控制材料，将每个纳米结构嵌入所述第一多个导电纳米结构中;第一电极，连接到所述第一多个纳米结构中的每个纳米结构; 以及通过所述传导控制材料与所述第一多个纳米结构中的每个纳米结构分离的第二电极，其中所述第一电极和所述第二电极被配置为允许所述纳米结构能量存储装置与所述集成电路电连接。

60. 发明申请

WO2017103755A1 CAPACITOR, CAPACITIVE VOLTAGE SENSOR AND METHOD FOR MANUFACTURING A CAPACITOR 审中-公开
标题翻译：电容器，电容式电压传感器及制造电容器的方法
公开(公告)号：WO2017103755A1
公开(公告)日：2017-06-22
申请号：PCT/IB2016/057494
申请日：2016-12-09
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： STOLLWERCK, Gunter A. J. , GRAVERMANN, Mark , WEICHOLD, Jens , SABO, Andreea
IPC分类号： H01G4/35 , G01R15/16
CPC分类号： H01G4/258 , G01R15/06 , G01R15/16 , H01G4/20 , H01G4/255 , H01G4/28 , H01G4/35
摘要： A capacitor comprises an electrically conductive cylinder, an electrically conductive or semi-conductive cylindrical shell or shell segment arranged concentrically around the electrically conductive cylinder, and a dielectric arranged between the electrically conductive cylinder and the electrically conductive or semi-conductive cylindrical shell or shell segment. The dielectric comprises at least one dielectric layer having a positive thermal coefficient of relative permittivity, and at least one compensation dielectric layer having a negative thermal coefficient of relative permittivity. The thermal coefficient of relative permittivity is thereby selected such that the capacitance value of the capacitor is constant within a stability margin over a predefined temperature interval.
摘要翻译：电容器包括导电圆柱体，围绕导电圆柱体同心布置的导电或半导体圆柱形壳体或壳体部分，以及布置在导电圆柱体和导电圆柱体之间的电介质半导体圆柱壳或壳段。电介质包括具有相对介电常数正热系数的至少一个电介质层和具有负相对电容率热系数的至少一个补偿电介质层。由此选择相对介电常数的热系数，使得电容器的电容值在预定温度区间内的稳定裕度内恒定。

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