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51. 发明申请

WO2002069682A2 A COMPACT, HIGH EFFICIENCY, HIGH ISOLATION POWER AMPLIFIER 审中-公开
标题翻译：高精度，高隔离功率放大器
公开(公告)号：WO2002069682A2
公开(公告)日：2002-09-06
申请号：PCT/US2002/005939
申请日：2002-02-27
申请人： ANDREW CORPORATION
发明人： KOOKER, Robert, W. , WHITE, Paul, E. , BACHMAN, Thomas, A., II
IPC分类号： H05K5/00
CPC分类号： H05K9/0037
摘要： A power feedforward amplifier (10) uses integral cavities (228-244, 252-264, 268-278) to provide RF isolation between subcircuits of the power amplifier. The chassis (202) includes a main chassis body (206) and a lid structure (204) adapted to couple with the chassis body (206) and define the subcircuit cavities. The inner lid (204) includes an amplifier dividing wall (218) and interstage walls (227, 280) adapted to isolate the main and error amplifier subcircuits of the feedforward power amplifier (10) and further to isolate individual components of the subcircuits. In one embodiment, the amplifier subcircuits are mounted on a single circuit board (221) and isolated from each other by the dividing wall (218a). A delay line subcircuit portion (290) is integral with the main chassis body and is coupled beneath the error amplifier subcircuit (216) to contain and electromagnetically shield a delay line filter subcircuit (290) while providing direct connection (330) with the error amplifier (216).
摘要翻译：功率前馈放大器（10）使用集成腔（228-244,252-264,268-278）来在功率放大器的子电路之间提供RF隔离。底盘（202）包括主底盘主体（206）和适于与底架主体（206）联接并限定子电路腔的盖结构（204）。内盖（204）包括放大器分隔壁（218）和级间壁（227,280），其适于隔离前馈功率放大器（10）的主和误差放大器子电路，并进一步隔离子电路的各个部件。在一个实施例中，放大器子电路安装在单个电路板（221）上，并通过分隔壁（218a）彼此隔离。延迟线分支部分（290）与主机架主体成一体，并且被耦合在误差放大器子电路（216）的下方，以容纳和电磁屏蔽延迟线路滤波器子电路（290），同时与误差放大器直接连接（330）（216）。

52. 发明申请

WO0165901A3 ELECTRONIC DEVICE AND SHIELD 审中-公开
标题翻译：电子设备和屏蔽
公开(公告)号：WO0165901A3
公开(公告)日：2002-03-14
申请号：PCT/JP0101555
申请日：2001-03-01
申请人： SONY COMPUTER ENTERTAINMENT INC
发明人： MURASAWA OSAMU
IPC分类号： H05K9/00
CPC分类号： H05K9/0037
摘要： An entertainment device has a metal shielding member that covers the CPU and image processing unit and a flexible sheet that is interposed between the CPU and metal shielding member. The metal shielding member contains metal oxide magnetic particles for cutting off electromagnetic radiation generated from the CPU and image processing unit, while the flexible sheet is positioned to radiate heat away from the CPU and image processing unit.
摘要翻译：娱乐装置具有覆盖CPU和图像处理单元的金属屏蔽构件以及介于CPU和金属屏蔽构件之间的柔性片。金属屏蔽部件包含用于切断由CPU和图像处理部产生的电磁辐射的金属氧化物磁性粒子，同时将柔性片定位成从CPU和图像处理部散发热量。

53. 发明申请

WO01065902A1 CONDUCTIVE COATING ARRANGEMENT FOR EMI SHIELD 审中-公开
标题翻译： EMI屏蔽的导电涂层布置
公开(公告)号：WO01065902A1
公开(公告)日：2001-09-07
申请号：PCT/SE2001/000445
申请日：2001-03-02
IPC分类号： H05K9/00 , C23F13/00
CPC分类号： H05K9/0037 , H05K9/0015
摘要： The present invention concerns a reinforced conductive layer (7). The layer is applied at a part (3a, b) of an electrical unit, e.g. a mobile telephone, which is to come into contact with another part (3a, b). The layer (7) will protect the covered material against corrosion due to formation of a galvanic element. In a preferred embodiment of the invention the layer (7) is made of the same material as the part (3a, b) which it will come into contact with. Furthermore, spaces (16) may be formed in assembly of a mobile telephone, which spaces (16) are surrounded by conductive material.
摘要翻译：本发明涉及增强导电层（7）。该层施加在电气单元的一部分（3a，b）上，例如即与另一部分（3a，b）接触的移动电话。层（7）将保护覆盖材料免受由于形成电流元件的腐蚀。在本发明的优选实施例中，层（7）由与其将接触的部分（3a，b）相同的材料制成。此外，空间（16）可以形成在移动电话的组装中，移动电话的空间（16）被导电材料包围。

54. 发明申请

WO01017327A1 LOW COST CONFORMAL EMI/RFI SHIELD 审中-公开
标题翻译：低成本一致的EMI / RFI屏蔽
公开(公告)号：WO01017327A1
公开(公告)日：2001-03-08
申请号：PCT/US2000/023764
申请日：2000-08-29
IPC分类号： H05K3/32 , H05K9/00
CPC分类号： H05K9/003 , H05K3/321 , H05K9/0022 , H05K9/0037
摘要： An EMI/RFI shield includes a shell made from a metalized polymeric material with a shape that is predetermined to form within at least one shielded cavity. The shell has sidewalls that terminate in a flange extending at an angle to the sidewalls. The flange has a lower surface for electrically coupling the shell to a predetermined electrical potential and an upper surface for engaging a structure, preferably a protruding rib from a cover, that exerts a compressive force on the top surface for urging the lower surface into an electrical coupling arrangement with an underlying planar conductor carrying the predetermined electrical potential (e.g., ground). The lower surface can include or be placed upon a layer of electrically conductive compliant material, such as a conductive adhesive. At least one of the sidewalls can include a projecting fluted structure having a size and location that is predetermined to engage a side of the structure that exerts the compressive force.
摘要翻译： EMI / RFI屏蔽包括由金属化的聚合物材料制成的壳体，其具有预定的形状以形成在至少一个屏蔽空腔内。壳体具有端接在与侧壁成一定角度延伸的凸缘中的侧壁。凸缘具有用于将壳体电耦合到预定电位的下表面和用于接合结构的上表面，优选地，来自盖的突出肋，其在顶表面上施加压缩力，以将下表面推入电耦合布置与承载预定电位（例如，接地）的底层平面导体。下表面可以包括或放置在导电柔性材料层上，例如导电粘合剂。侧壁中的至少一个可以包括突出的凹槽结构，其具有预定的尺寸和位置，以接合施加压缩力的结构的一侧。

55. 发明申请

WO00049845A1 APPARATUS, AND ASSOCIATED METHOD, FOR SHIELDING EMI-GENERATIVE COMPONENTS OF AN ELECTRICAL DEVICE 审中-公开
标题翻译：装置和相关方法，用于电气设备的屏蔽EMI成分组件
公开(公告)号：WO00049845A1
公开(公告)日：2000-08-24
申请号：PCT/US1999/031036
申请日：1999-12-28
IPC分类号： H04B15/00 , H05K9/00
CPC分类号： H05K9/0037 , H04B15/00
摘要： An assembly (36) having first and second compartments (42, 44), an isolation block (56) positioned between a first floor wall (48) of the first compartment and a second floor wall (52) of the second compartment, a duct (62) formed between the isolation block and the first and second floor walls to permit an electrical connection between a first component portion (32) and a second component portion (34).
摘要翻译：具有第一和第二隔室（42,44）的组件（36），位于第一隔室的第一底壁（48）和第二隔室的第二底壁（52）之间的隔离块（56），管道（62），形成在隔离块与第一和第二底壁之间，以允许第一部件部分（32）和第二部件部分（34）之间的电连接。

56. 发明申请

WO1998019507A1 METHOD FOR MANUFACTURING A HOUSING PART WITH A SCREENING EFFECT FOR RADIO COMMUNICATION EQUIPMENT 审中-公开
标题翻译：工艺生产具有画面效果用于无线的壳体部分
公开(公告)号：WO1998019507A1
公开(公告)日：1998-05-07
申请号：PCT/DE1997002530
申请日：1997-10-30
申请人： SIEMENS AKTIENGESELLSCHAFT , JOCHHEIM, Edgar
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H05K09/00
CPC分类号： H05K9/0047 , B29C45/14778 , B29K2995/0011 , B29L2031/3437 , H04B1/3833 , H05K9/0037 , Y10T29/49988
摘要： The invention relates to a method for manufacturing a housing part with screening functions and a housing part with screening functions for a radiocommunication equipment having saucer-type housing parts with overlying, facing open sides to lodge the radiocommunications device. To shorten the manufacturing process by one step, a wire web which has been cut according to the inner contours of the housing part is introduced in an injection mould for the screening housing part. In said wire web, all contact surfaces and their counterparts are coated with a foil corresponding to the dimensions of the desired contact surface. The foils are removed after subsequent injection moulding with insulating material.
摘要翻译：本发明涉及一种方法，用于生产具有遮阳功能并且与屏蔽功能用于与杯形无线电装置的壳体部分的壳体部分，与他们的开口侧彼此面对的水平设置的壳体部分，用于接收无线电的设备。为了制造步骤的保存到所述壳体部分的内轮廓对应于定制金属丝网是在注射模具的产品，以结束屏蔽壳体部分的介绍，在其中所有的接触表面为与膜接触伙伴相应地与所期望的接触区域的质量都包括在内，和随后的注射成型用绝缘后材料，该膜被除去。

57. 发明申请

WO1997012505A1 GASKET SYSTEM FOR EMI ISOLATION 审中-公开
标题翻译：用于EMI隔离的垫片系统
公开(公告)号：WO1997012505A1
公开(公告)日：1997-04-03
申请号：PCT/US1996015472
申请日：1996-09-23
申请人： ERICSSON INC.
发明人： ERICSSON INC. , GLOVER, Hugh, Brian
IPC分类号： H05K09/00
CPC分类号： H05K9/0037
摘要： An electromagnetic interference (EMI) gasket system which segregates EMI sensitive circuits from EMI generating circuits is disclosed. The gasket system comprises a pair of deflectable leg members disposed relative to each other, which deflect vertically and horizontally when said gasket system is positioned between two opposing substrates and the substrates are drawn together. The leg members provide dual contact with one of the substrates to ensure EMI attenuation without any compression of said gasket.
摘要翻译：公开了一种将EMI敏感电路与EMI产生电路隔离的电磁干扰（EMI）垫片系统。衬垫系统包括一对相对于彼此设置的可偏转的腿部构件，当一个衬垫系统位于两个相对的衬底之间并将衬底拉在一起时，该一对可偏转腿构件垂直和水平地偏转。腿构件与其中一个衬底提供双重接触，以确保EMI衰减，而不会对所述衬垫进行任何压缩。

58. 发明申请

WO1992004743A1 MICROWAVE MULTI-STAGE AMPLIFIER 审中-公开
标题翻译：微波多级放大器
公开(公告)号：WO1992004743A1
公开(公告)日：1992-03-19
申请号：PCT/JP1991001172
申请日：1991-09-02
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , DEKI, Akihito , KASHIMA, Yukiro , FUJISAKI, Hirotaka
发明人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
IPC分类号： H01P03/08
CPC分类号： H05K9/0037 , H01P1/16
摘要： A microwave multi-stage amplifier having amplifiers (5, 6) disposed on both sides of a partition (7) integrally formed in a shielding case, and an upper cover (11) fastened to the partition (7) with screws. The space in the case (8) is divided into two to suppress the generation of surface wave modes propagating in a dielectric substrate. Accordingly, the isolation of the amplifiers can be secured.

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