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41. 发明申请

WO00054561A1 METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS 审中-公开
标题翻译：方法增加了生产安全焊料连接
公开(公告)号：WO00054561A1
公开(公告)日：2000-09-14
申请号：PCT/DE2000/000377
申请日：2000-02-08
IPC分类号： B23K1/20 , B23K1/00 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/24 , H05K3/34 , H05K3/40 , H01L23/498
CPC分类号： H05K3/403 , H05K1/092 , H05K3/0052 , H05K3/248 , H05K3/3442 , H05K3/4061 , H05K2201/035 , H05K2201/09181 , H05K2201/10909 , Y02P70/613
摘要： The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).
摘要翻译：本发明涉及一种用于陶瓷基板（1）和电路板（10）之间增加焊点（7）的生产可靠性。它包括陶瓷基板（1）和第二随后压印上施加第一ablegierungsbeständigen金属化层（5）的步骤中，润湿行为增强金属化层（6）的第一金属化层（5）上。从而增加了Gesamtmetallisierungsschichtdicke（5,6）在边缘区域（8）的焊料接头的（7）是可以实现的，这又使焊接接头（7）的光学Lothochstieg全自动控制。

42. 发明申请

WO00018202A1 MULTILAYER BUILD-UP WIRING BOARD 审中-公开
标题翻译：多层建筑接线板
公开(公告)号：WO00018202A1
公开(公告)日：2000-03-30
申请号：PCT/JP1999/004895
申请日：1999-09-08
IPC分类号： H05K1/02 , H05K3/06 , H05K3/24 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H01L29/40 , H01L21/4763 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/0224 , H05K1/0253 , H05K1/03 , H05K3/064 , H05K3/244 , H05K3/382 , H05K3/403 , H05K3/4602 , H05K2201/0347 , H05K2201/062 , H05K2201/093 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09645 , H05K2201/09681 , H05K2203/1178
摘要： The insulation of an interlayer resin insulating layer (50) is not degraded since the mesh hole (35a) of an upper solid layer (35) is aligned with the mesh hole (59a) of an upper solid layer (59). The diameter of the mesh holes is preferably 75 to 300 mu m. If the diameter is below 75 mu m, it is difficult to align the holes; if the diameter is over 300 mu m, the insulation of the interlayer resin insulating layer degrades. The distance between the holes is preferably 100 to 2000 mu m. If the distance is below 100 mu m, the solid layers do not produce their functions; if the distance is over 2000 mu m, the insulation of the interlayer resin insulating layer degrades.
摘要翻译：由于上固体层（35）的网孔（35a）与上固体层（59）的网孔（59a）对准，所以层间树脂绝缘层（50）的绝缘不会劣化。网孔的直径优选为75〜300μm。如果直径小于75μm，则难以对准孔; 如果直径超过300μm，则层间树脂绝缘层的绝缘性降低。孔之间的距离优选为100〜2000μm。如果距离在100亩以下，固体层不起作用; 如果距离超过2000μm，则层间树脂绝缘层的绝缘性降低。

43. 发明申请

WO99051071A1 SMD-CAPABLE HYBRID CIRCUIT 审中-公开
标题翻译： SMD启用混合电路
公开(公告)号：WO99051071A1
公开(公告)日：1999-10-07
申请号：PCT/DE1999/000842
申请日：1999-03-22
IPC分类号： H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H05K3/366 , H05K3/3442 , H05K3/403 , H05K2201/09172
摘要： Hybrid circuit with a ceramic circuit carrier (1) having the shape of a plate that can be mounted on a mother board (3), on which a series of contact surfaces (2) (lotpads) are provided near one lower edge for contacting the circuits to the terminal connections (5) of the mother board (3). The contact surfaces (2) extend up to the lower edge and form an SMD terminal connection for direct soldering to the contact points (5) of the mother board (3).
摘要翻译：混合电路安装到垂直于母板（3）的板状的陶瓷电路载体（1）上，其邻近的下边缘的一系列垫（2）（焊料焊盘）提供用于与终端的电路接触主板（5）（3）。连接面（2）的每个向下延伸至底部，形成用于直接焊接的SMD连接到接触焊盘母板的（5）（3）。

44. 发明申请

WO1998027588A1 A VIA STRUCTURE 审中-公开
标题翻译：威尼斯结构
公开(公告)号：WO1998027588A1
公开(公告)日：1998-06-25
申请号：PCT/SE1997002188
申请日：1997-12-19
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (publ)
发明人： TELEFONAKTIEBOLAGET LM ERICSSON (publ) , HESSELBOM, Hjalmar , BODÖ, Peter
IPC分类号： H01L23/485
CPC分类号： H01L23/5384 , H01L21/486 , H01L23/481 , H01L23/5389 , H01L23/66 , H01L25/0652 , H01L2224/16225 , H01L2224/16227 , H01L2924/3011 , H05K3/403 , H05K3/4644 , H05K2201/09645 , H05K2201/09809 , H05K2201/09827
摘要： A via structure is obtained by etching a through-hole (3) in a substrate (1) on the via location and placing transmission lines (25) on declining or sloping sidewalls (8) of the hole (3). The lines (25) continue to conductors (17) on the other surface of the substrate (1) through vias (29) located in a free portion of a thin film structure at the bottom side of the substrate. The free portion is so strong and large, that several vias (29) can be made therein for connection to a plurality of parallel lines (25) forming e.g. a bus structure. The large free portion can be additionally supported by a thick support layer (33) applied on top of the layers in the hole (3). By applying an isolated ground plane (19) and a dielectric layer (23) between the substrate (1) and the transmission lines (25), the transmission lines on the sloping sidewalls (8) of the via hole structure can be made impedance matched. The sloping sidewalls (8) of the via hole can easily be obtained using a V-groove etch for a monocrystalline Si-substrate (1). The via structure obtained is especially well suited for data transmission buses, which do not need to reduce their transmission line density through the via structure.
摘要翻译：通过蚀刻通孔位置的基板（1）中的通孔（3）并将传输线（25）放置在孔（3）的下降或倾斜的侧壁（8）上来获得通孔结构。线（25）通过位于衬底底部的薄膜结构的自由部分中的通孔（29）继续在衬底（1）的另一个表面上的导体（17）。自由部分是如此强大和大，可以在其中制造几个通孔（29）以连接到多个平行线（25），形成例如总线结构。大的自由部分可以另外由施加在孔（3）中的层的顶部上的厚的支撑层（33）支撑。通过在衬底（1）和传输线（25）之间施加隔离的接地平面（19）和电介质层（23），可以使通孔结构的倾斜侧壁（8）上的传输线阻抗匹配。通过用于单晶Si衬底（1）的V沟蚀刻可以容易地获得通孔的倾斜侧壁（8）。获得的通孔结构特别适用于不需要通过通孔结构降低其传输线密度的数据传输总线。

45. 发明申请

WO1997047087A1 PROXIMITY SWITCHES WITH MECHANICAL DECOUPLING OF TERMINAL PINS AND PLUG-IN UNIT 审中-公开
标题翻译：与终端销和插件使用机械解耦探测器
公开(公告)号：WO1997047087A1
公开(公告)日：1997-12-11
申请号：PCT/DE1997001066
申请日：1997-05-26
申请人： SIEMENS AKTIENGESELLSCHAFT , BÄUML, Alfred , SCHMITT, Manfred , GASSNER, Robert
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H03K17/95
CPC分类号： H03K17/9505 , H05K1/182 , H05K3/403
摘要： The invention relates to a proximity switch in which the plug-in unit (10) and the terminal pins (4) are not securely connected to each other. Said terminal pins (4) are only held by a printed circuit board (2), apart from a casting compound (9) filling the housing (6), thereby achieving simple assembly. No forces are transmitted to a sensor element (3) via the printed circuit board (2).
摘要翻译：本发明的接近开关插头插入件（10）和端子销（4）没有被固定到彼此。端子销（4），除了一个外壳（6）填充浇铸化合物（9），只有一个印刷电路板（2）被保持。这便于安装，而且它不会在印刷电路板（2）传递力到传感器元件（3）。

46. 发明申请

WO1997006011A1 THERMAL PRINT HEAD 审中-公开
标题翻译：热打印头
公开(公告)号：WO1997006011A1
公开(公告)日：1997-02-20
申请号：PCT/JP1996002216
申请日：1996-08-06
申请人： ROHM CO., LTD. , NAGAHATA, Takaya , SATO, Tadayoshi
发明人： ROHM CO., LTD.
IPC分类号： B41J02/335
CPC分类号： B41J2/3352 , B41J2/3357 , B41J2/33575 , H01R4/48 , H01R12/721 , H05K3/36 , H05K3/403
摘要： The printing cost is minimized by reducing the number of parts of a thermal print head used for printers, for such as a facsimile, and the quality of a printed product is improved by preventing the warpage of the thermal print head. A base plate mounting surface of a heat radiation plate (2) is provided with a longitudinally extending mounting surface dividing groove (5). A head base plate (3) having a heating resistor (6) for printing and a circuit board (4) having a connector (10) for external connection are fixed on the base plate mounting surface. The two plates (3, 4) are arranged so as to be opposed to each other with the mounting surface dividing groove positioned therebetween. Terminal electrodes (8, 11) provided on groove-side edge portions of the head base plate and circuit board are connected together by a terminal lead (9). An edge portion of at least one of the head base plate and circuit board projects to a position above the mounting surface dividing groove and forms a projecting edge portion, which is held from the upper and lower sides thereof by one end portion (9a, 9b) of the terminal lead.
摘要翻译：通过减少用于诸如传真机的打印机用的热打印头的部件数量来最小化打印成本，并且通过防止热打印头的翘曲来改善打印产品的质量。散热板（2）的基板安装表面设置有纵向延伸的安装表面分隔槽（5）。具有用于印刷的加热电阻器（6）和具有用于外部连接的连接器（10）的电路板（4）的头基板（3）固定在基板安装表面上。两个板（3,4）被布置成彼此相对，其中安装表面分隔槽位于它们之间。设置在头基板和电路板的槽侧边缘部分上的端子电极（8,11）由端子引线（9）连接在一起。头基板和电路板中的至少一个的边缘部分突出到安装表面分隔槽上方的一个位置，并形成一个突出边缘部分，该突出边缘部分的上侧和下侧由一个端部（9a，9b））的终端引线。

47. 发明申请

WO1995008176A1 ELECTRICAL ASSEMBLY COMPRISING A PTC RESISTIVE ELEMENT 审中-公开
标题翻译：包含PTC电阻元件的电气组件
公开(公告)号：WO1995008176A1
公开(公告)日：1995-03-23
申请号：PCT/US1994010137
申请日：1994-09-13
申请人： RAYCHEM CORPORATION
发明人： RAYCHEM CORPORATION , FANG, Shou-Mean , SIDEN, Dennis , THOMPSON, Mark , ZHANG, Michael
IPC分类号： H01C01/14
CPC分类号： H01C17/28 , H01C1/1406 , H01C7/027 , H01C17/06586 , H05K1/182 , H05K3/0097 , H05K3/403 , H05K2201/09181 , H05K2201/10469 , H05K2201/10666
摘要： Laminar electrical devices, in particular circuit protection devices, contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. This permits connection to both electrodes from the same side of the device. It also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.
摘要翻译：层状电气装置，特别是电路保护装置，包含两个层状电极，它们之间具有PTC元件，并且穿过该装置的厚度并且仅与两个电极中的一个接触的交叉导体。这允许从设备的相同侧连接到两个电极。它还可以在组装件对应于多个单独装置的组件上执行用于制备这种装置的步骤，并将组件划分为最终步骤。

48. 发明申请

WO1992017994A1 MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE 审中-公开
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：WO1992017994A1
公开(公告)日：1992-10-15
申请号：PCT/SU1991000055
申请日：1991-04-01
申请人： FILIAL VSESOJUZNOGO NAUCHNO-ISSLEDOVATELSKOGO ... , ADASKO, Vladimir Iosifovich , VARDENBURG, Arnold Kurtovich , EMELYANOV, Alexandr Lvovich , EMELYANOV, Viktor Lvovich , SELIVERSTOV, Lev Alexeevich , SLONIMSKY, Alexandr Davydovich , SKLYAROV, Nikolai Alexeevich , TIKHONOV, Vladimir Ivanovich , ROGOZHIN, Jury Fedorovich , PILIPOSIAN, Pogos Mkrtychevich
发明人： FILIAL VSESOJUZNOGO NAUCHNO-ISSLEDOVATELSKOGO ...
IPC分类号： H05K03/46
CPC分类号： H05K3/403 , H05K1/056 , H05K1/113 , H05K1/117 , H05K3/0023 , H05K3/4076 , H05K3/445 , H05K3/4608 , H05K3/4644 , H05K3/467 , H05K2201/0209 , H05K2201/0317 , H05K2201/09563 , H05K2201/096 , H05K2203/105 , H05K2203/1355
摘要： A multilayer printed circuit board has a metal base (1) with openings (12), the surface of the base and the walls of the openings being covered with an insulation layer (8) obtained by means of applying and mechanical processing, in turn, on both sides, a coating of a powder epoxy composition. An insulation relief (16) of a photo sensitive composition is obtained on the insulation coating, which is then filled with a metal by vacuum deposition. Conductors (4) and contact points (5) of the layer (3) of conducting pattern are obtained by removing the metal from the protruding parts of the relief (16). Then insulation relief (18) is formed corresponding to the location of the contact points (11) and of the commutation bars (10) connecting the layers (3, 6) of the conducting patterns, and is covered with a metal layer. After the removal of the metal from the protruding parts an insulation layer (9) is obtained in which are located the commutation bars (10) and the contact points (11). Then an insulation relief (19) is formed corresponding to the configuration of the layer (6) of the conducting pattern, the metal is applied and mechanically processed so as to obtain conductors (7) with contact points (8) of the layer (6) of the conducting pattern.
摘要翻译：多层印刷电路板具有带有开口（12）的金属基底（1），基底的表面和开口壁被覆盖有通过施加和机械加工获得的绝缘层（8）在两面上涂布粉末环氧组合物。在绝缘涂层上获得光敏组合物的绝缘浮雕（16），然后通过真空沉积用金属填充。通过从浮雕（16）的突出部分去除金属，可获得导电图案层（3）的导体（4）和接触点（5）。然后，相应于连接导电图案的层（3,6）的接触点（11）和换向条（10）的位置形成绝缘凸缘（18），并被金属层覆盖。在从突出部分移除金属之后，获得其中位于换向棒（10）和接触点（11）的绝缘层（9）。然后，与导电图案的层（6）的构造相对应地形成绝缘放电（19），金属被施加并机械处理，以获得具有层（6）的接触点（8）的导体（7））的导电图案。

49. 发明申请

WO1989001389A1 REGISTRATION OF HOLE CENTRES FOR CUTTING PRINTED BOARD SAMPLES 审中-公开
标题翻译：用于切割印刷板样品的孔中心注册
公开(公告)号：WO1989001389A1
公开(公告)日：1989-02-23
申请号：PCT/SE1988000402
申请日：1988-08-09
申请人： HESSELGREN, Tore
IPC分类号： B23Q17/22
CPC分类号： G01R1/04 , G01R31/2805 , H05K3/0008 , H05K3/0052 , H05K3/403 , H05K3/42 , H05K2203/025 , H05K2203/162 , H05K2203/167 , Y10T29/49778 , Y10T29/49789 , Y10T29/4998 , Y10T29/49998
摘要： The present invention relates generally to control of printed boards and especially to a method of preparation of samples to be able to estimate the quality of printed boards with metallized holes. At hole plating of printed boards, levelness and thickness of the metal plating are most important. The method for registration of hole centres in printed boards is carried out in such a way that each test piece (11) of the printed board (1), the holes (14, 22) which are to be investigated, has at least two grooves (21) in the outer contour of the piece, the test pieces (11) in question being inserted and fixed in a casting mould (15) with help of said indexing grooves (21) and the test packages being cut, guided by the index grooves (21), through the test holes (14, 22) so that the cut (26) will mainly be along the diameter of the test holes.
摘要翻译：本发明一般涉及印刷电路板的控制，尤其涉及一种制备样品的方法，以便能够估计具有金属化孔的印刷电路板的质量。在印刷电路板的电镀中，金属电镀的水平度和厚度是最重要的。在印刷电路板上对准孔中心的方法是这样一种方式：印刷电路板（1）的每个测试片（11），待研究的孔（14,22）具有至少两个凹槽（21）在所述件的外轮廓中，所述待测试件（11）借助于所述分度槽（21）和所述测试包被切割而被插入并固定在铸模（15）中，由所述索引槽（21）通过测试孔（14,22），使得切割部（26）将主要沿测试孔的直径。

50. 发明申请

WO2016178978A1 SELECTIVE DEPOSITION OF THIN FILM DIELECTRICS USING SURFACE BLOCKING CHEMISTRY 审中-公开
标题翻译：薄膜电化学选择性沉积使用表面阻塞化学
公开(公告)号：WO2016178978A1
公开(公告)日：2016-11-10
申请号：PCT/US2016/030057
申请日：2016-04-29
申请人： APPLIED MATERIALS, INC.
发明人： THOMPSON, David , SALY, Mark , BHUYAN, Bhaskar Jyoti
IPC分类号： C23C16/455 , C23C16/02 , C23C16/34 , C23C16/56 , C23C16/54
CPC分类号： H05K1/0296 , C07F7/00 , C23C16/04 , C23C16/455 , C23C16/45525 , C23C16/50 , G03G15/50 , G03G15/80 , G03G21/1652 , H01L21/0217 , H01L21/02211 , H01L21/0228 , H01L21/02307 , H01L21/3105 , H01L21/31133 , H01L21/32 , H01L21/67207 , H05K1/0269 , H05K1/117 , H05K3/4015 , H05K3/403 , H05K2201/0394 , H05K2201/09063 , H05K2201/09181 , H05K2201/10287 , H05K2201/10363
摘要： Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.
摘要翻译：相对于第二衬底表面在第一衬底表面上选择性地沉积膜的方法。方法包括将含有羟基末端的底物表面与甲硅烷胺浸泡以形成甲硅烷基醚终止并将膜沉积在甲硅烷基醚封端的表面以外的表面上。

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