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31. 发明申请

WO1998056074A1 SPIRAL LEAF SPRING CONTACT 审中-公开
标题翻译：螺旋叶弹簧接触
公开(公告)号：WO1998056074A1
公开(公告)日：1998-12-10
申请号：PCT/US1997009899
申请日：1997-06-06
申请人： PARTICLE INTERCONNECT CORPORATION
发明人： PARTICLE INTERCONNECT CORPORATION , DiFRANCESCO, Louis
IPC分类号： H01R04/48
CPC分类号： H01R13/2407 , H01R12/52 , H05K3/326
摘要： A contact (151) comprising an electrically conductive material plate defining a central planar contact base (152). A plurality of integral leaves (154) extend spirally from the base, and a plurality of integral mounting tabs (159) extend radially from the base. The leaves are mechanically deformed from the plane of the base to form independent spring contacts. The tabs are coplanar with the base. A particle containing metal plating (156, 155) is provided on the contact base (152) and leaves (154), respectively.
摘要翻译：包括限定中心平面接触基底（152）的导电材料板的触点（151）。多个整体叶片（154）从底座螺旋地延伸，并且多个整体安装凸片（159）从基部径向延伸。叶片从基座的平面机械变形，形成独立的弹簧接点。标签与基座共面。分别在接触基部（152）和叶片（154）上设置含有金属电镀（156,155）的颗粒。

32. 发明申请

WO9638858A3 CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS 审中-公开
标题翻译：联系人（TILES）用于具有弹簧触点的人口大型基底
公开(公告)号：WO9638858A3
公开(公告)日：1997-03-20
申请号：PCT/US9608117
申请日：1996-05-24
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETEAN L , DOZIER THOMAS H , SMITH WILLIAM D
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETEAN L , DOZIER THOMAS H , SMITH WILLIAM D
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L21/68 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R33/76 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40 , H01L
CPC分类号： B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/4015 , H01L2924/00
摘要： A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mounted and connected to a relatively large electronic component substrate (706), thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level bum-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

33. 发明申请

WO1996016440A1 INTERCONNECTION ELEMENTS FOR MICROELECTRONIC COMPONENTS 审中-公开
标题翻译：微电子元件的互连元件
公开(公告)号：WO1996016440A1
公开(公告)日：1996-05-30
申请号：PCT/US1995014843
申请日：1995-11-13
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L.
IPC分类号： H01L23/02
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (220) (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (210). A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (210). The elongate element (216) may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element (210) to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts.
摘要翻译：通过将软材料（例如金）的细长元件（芯）（216）成形为具有弹性形状来形成用于电子部件的用于显示期望的机械特性（例如弹性，用于形成压力接触）的互连元件（210）（包括悬臂梁，S形，U形），并用硬质材料（220）（例如镍及其合金）涂覆成形的细长元件，以赋予所得复合互连件所需的弹簧（弹性）特性元件（210）。可以对复合互连元件（210）施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。细长元件（216）可以由导线或从片材（例如，金属箔）形成。所形成的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外涂层材料将复合互连元件（210）锚定到电子部件上的端子等）上，可以安装到支撑基板上以用作插入件，并且可以安装到用作探针卡或探针卡插入件的基板。

34. 发明申请

WO1993022795A1 INTERCONNECTION SYSTEM FOR HIGH PERFORMANCE ELECTRONIC HYBRIDS 审中-公开
标题翻译：高性能电子杂交互连系统
公开(公告)号：WO1993022795A1
公开(公告)日：1993-11-11
申请号：PCT/US1993003974
申请日：1993-04-28
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY
发明人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , HERNDON, Terry, O. , RAFFEL, Jack, I.
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L23/49811 , H01L24/72 , H01L25/18 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H05K3/303 , H05K3/326 , H05K3/4007
摘要： An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits. The micro-machined features may include posts (109) for connecting to bonding pads of standard components and may also include rails for alignment of components and connections to specially made components.
摘要翻译：用于高性能电子混合器的互连系统在基板上使用微加工特征直接连接到诸如集成电路的微型电子部件。微加工的特征可以包括用于连接到标准部件的接合焊盘的柱（109），并且还可以包括用于将部件对准的轨道和与特定构件的连接。

35. 发明申请

WO1993012560A1 METHOD OF JOINING CONNECTION PLATES 审中-公开
标题翻译：连接板的方法
公开(公告)号：WO1993012560A1
公开(公告)日：1993-06-24
申请号：PCT/SE1992000852
申请日：1992-12-10
申请人： KATONA, Sandor
IPC分类号： H01R04/06
CPC分类号： H01R12/69 , H01R4/06 , H01R43/0484 , H05K1/118 , H05K3/326 , H05K3/4084 , H05K2201/091 , H05K2201/10401 , H05K2201/1059 , H05K2201/10962
摘要： The present invention relates to a method of securing connection tags to electrical conductors in thermal foils and the like in which a contact plate is riveted in place near a hole passing through plastic layers (1, 2) and a metal part (3). In this method the contact plate (9) is riveted in place near a hole (4) passing through the plastic layers and a metal foil (3) arranged adjacent to the layers (1, 2), by means of a hollow rivet (6) which is passed through the hole. On the opposite side of the hole the rivet has been bent around an upset (8) at the lower edge of the hole, the hole (4) having been made with the aid of a mandrel (5), suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet (6), the central part has been formed to an exposed cylindrical metal contact surface (7) against the rivet (6), and the lower side to a sealing upset (8), preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface.
摘要翻译：本发明涉及一种将连接标签固定在热箔等中的电导体的方法，其中接触板在通过塑料层（1,2）和金属部件（3）的孔附近被铆接就位。在该方法中，接触板（9）通过穿过塑料层的孔（4）和邻近层（1,2）布置的金属箔（3）铆接在中空铆钉（6））通过孔。在孔的相对侧，铆钉已经在孔的下边缘处的镦锻（8）周围弯曲，孔（4）已经借助于心轴（5）制成，适当地热并且至少部分地使得孔的上边缘与铆钉（6）的凹入的密封面法兰连接，中心部分已经形成为暴露的圆柱形金属接触表面（7）抵靠铆钉（6），并且优选在边缘加强的密封镦粗（8）的下侧增加接触压力并气密地密封接触表面周围的区域。

36. 发明申请

WO1992022996A1 ELECTRICAL DEVICE WITH AT LEAST ONE CONTACT PIN AND CONDUCTOR TRACK SHEET 审中-公开
标题翻译：具有至少一个触点引脚和导体跟踪片的电气设备
公开(公告)号：WO1992022996A1
公开(公告)日：1992-12-23
申请号：PCT/DE1992000381
申请日：1992-05-12
申请人： ROBERT BOSCH GMBH , MAYER, Rolf , SIEGEL, Heinz , DERINGER, Helmut , SCHURR, Volker
发明人： ROBERT BOSCH GMBH
IPC分类号： H05K03/34
CPC分类号： H01R12/67 , B60T8/3675 , H01R4/02 , H01R4/2404 , H05K1/118 , H05K3/0058 , H05K3/308 , H05K3/326 , H05K3/3447 , H05K2201/091 , H05K2201/1003 , H05K2201/10303 , H05K2201/10878 , H05K2203/1189
摘要： The aim of the invention is to produce a mechanically and electrically secure solder bond between a contact pin and a solder eyelet on a conductor track sheet. With respect to its end (29), the contact pin (14) has a reduced section, in the form of a constriction (32) for instance, in which lodge sheet sections (28) which protrude out from the plane of the conductor track sheet (18) and which are formed when the contact pin pierces the initially virgin solder eyelet (23). The solder (25) connects the conducting film (21) of the solder eyelet (23) and sheet sections (28) with the contact pin (14).

37. 发明申请

WO1986002518A1 INJECTION MOLDED MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING SAME 审中-公开
标题翻译：注射成型多层电路板及其制造方法
公开(公告)号：WO1986002518A1
公开(公告)日：1986-04-24
申请号：PCT/US1985002036
申请日：1985-10-11
申请人： METTLER, Rollin, W., Jr. , METTLER, John, H. , IMPEY, John
发明人： METTLER, Rollin, W., Jr. , METTLER, John, H.
IPC分类号： H05K01/14
CPC分类号： H05K3/462 , H05K1/0284 , H05K1/119 , H05K3/326 , H05K3/42 , H05K3/4623 , H05K2201/09045 , H05K2201/09118 , H05K2201/09536 , H05K2201/096 , H05K2201/1059 , H05K2203/063 , Y10T29/49126 , Y10T29/49158
摘要： A multi-layer circuit board comprised of two or more circuit board substrates (10, 12) shaped by injection molding with mating interconnecting pins (22) and holes (24) and banded together with an electrically insulated adhesive material (28). Circuit leads (14, 16, 18, 20) are provided on both sides of each substrate recessed into channels (85) formed in the surface of the substrate during the molding process. Electrical interconnection of the layers of circuitry occurs where the conductive materials of the circuit leads (14, 16) passes down through component lead holes (26) axially located in the interconnecting pins (22) and around the exterior of the interconnecting pins where contact is made with the conductive material coating on the interior of the interconnecting holes (24). A method of making the multi-layer board includes injection molding the substrates (10, 12) in a suitable shaped mold (74, 76) plating substantially all of the surface of the substrates with the conductive material (82) masking with a plating resist (84), plating again with conductive material (88), removing the plating resist and flash-etching to remove the conductive material (82) initially plated and masked by the plating resist (84) so as to define the circuit leads (14, 16, 18, 20). The preferred method uses a roller to apply the plating resist to some surfaces of the substrates.

38. 发明申请

WO2016040389A3 STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF 审中-公开
标题翻译：包括用于可佩戴装置的电极及其形成的带束层
公开(公告)号：WO2016040389A3
公开(公告)日：2016-06-02
申请号：PCT/US2015049037
申请日：2015-09-08
申请人： ALIPHCOM , SINGLETON CHRIS , MOHAMMED ILYAS , SAVALIA PIYUSH , PANCHALAN PRASAD , NABANJA SHEILA , SHARMA SUMIT , HOU-YAN CHENG SYLVIA
发明人： SINGLETON CHRIS , MOHAMMED ILYAS , SAVALIA PIYUSH , PANCHALAN PRASAD , NABANJA SHEILA , SHARMA SUMIT , HOU-YAN CHENG SYLVIA
IPC分类号： H05K3/30
CPC分类号： H05K1/181 , A61B5/053 , A61B5/6831 , A61B2562/043 , A61B2562/125 , A61B2562/222 , H05K1/0283 , H05K1/0326 , H05K1/0393 , H05K1/118 , H05K3/0058 , H05K3/305 , H05K3/326 , H05K2201/042 , H05K2201/058 , H05K2201/10151 , H05K2201/10166 , H05K2203/1147 , H05K2203/1305
摘要： A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band.
摘要翻译：描述了包括具有与电极耦合的电极和导线的柔性导线总线的条带。导线总线可以包括在通过模制内部条带，将导线总线安装在内部条带中形成的条带中，以及在内部条带和导线总线上注塑外部条带以形成条带。电极可以定位在内带上以适应带带可以佩戴在身体部分的目标范围。绑带的材料和导线总线的材料可以被选择为允许导线总线和绑带之间的低摩擦系数，使得施加到绑带的载荷不会与导线总线耦合或导致导线损坏由于拉带和/或施加在带带上的扭转负载力。

39. 发明申请

WO2014002277A1 試作用回路基板审中-公开
标题翻译：电路板试制
公开(公告)号：WO2014002277A1
公开(公告)日：2014-01-03
申请号：PCT/JP2012/066802
申请日：2012-06-29
申请人：株式会社キビテク , 新山摩梨花
发明人：新山　摩梨花
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0287 , H05K3/326 , H05K2201/0133
摘要：【課題】人の手で変形させることが可能な程度に柔軟な回路基板であって、かつ、人の手による回路部品の挿抜が可能で、回路部品が容易には回路基板から外れることのない回路基板を構成すること。【解決手段】　複数の電気伝導性のある部材と、前記電気伝導性のある部材を互いに接触しない位置関係で保持するエラストマーからなる部材と、で回路基板を構成する。
摘要翻译： [问题]为了构成可以由人手进行变形的这种柔性电路板的电路板，能够通过人的手插入和移除电路部件，并且防止电路部件容易地从电路板。电路板由具有导电性的多个构件构成，并且由弹性体制成的构件保持构件之间不具有接触位置关系的导电性构件。

40. 发明申请

WO2012120032A2 BAUGRUPPE MIT EINEM TRÄGER, EINEM SMD-BAUTEIL UND EINEM STANZGITTERTEIL 审中-公开
标题翻译：与载体，A SMD组件和PUNCH格构部ASSEMBLY
公开(公告)号：WO2012120032A2
公开(公告)日：2012-09-13
申请号：PCT/EP2012/053887
申请日：2012-03-07
申请人： CONTINENTAL AUTOMOTIVE GMBH , WALLRAFEN, Werner
发明人： WALLRAFEN, Werner
CPC分类号： H02K11/0094 , H01G2/06 , H01G4/248 , H02K5/225 , H05K1/183 , H05K3/326 , H05K2201/0311 , H05K2201/0397 , H05K2201/09118 , H05K2201/1006 , H05K2201/10636 , Y02P70/611
摘要： Die Erfindung betrifft eine Baugruppe mit einem Träger aus einem elektrisch isolierenden Material, einem SMD-Bauteil, das seitliche Kontaktflächen aufweist, und einem Stanzgitterteil aus Metall, das an dem Träger befestigt ist und zur Herstellung von elektrischen Verbindungen zwischen den seitlichen Kontaktflächen des SMD-Bauteils und weiteren Funktionselementen der Baugruppe dient, wobei das Stanzgitterteil Kontaktzungen aufweist, die federnd an den seitlichen Kontaktflächen anliegen und stoffschlüssig mit den seitlichen Kontaktflächen verbunden sind.
摘要翻译：本发明涉及一种包括支撑一个电绝缘材料，一个SMD元件，它包括侧面的接触面，和金属构成的引线框架部分，其固定到载体的组件和用于SMD部件的侧面的接触面之间进行电连接的使用量和组件，其中所述引线框架部分具有接触舌，其弹性地抵靠在侧面的接触面和一体地连接到所述侧面的接触面的其它功能元件。

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