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31. 发明申请

WO2004010752A1 METHOD FOR FASTENING MICROTOOL COMPONENTS TO OBJECTS 审中-公开
标题翻译：用于将微型元件组件紧固到对象上的方法
公开(公告)号：WO2004010752A1
公开(公告)日：2004-01-29
申请号：PCT/CH2002/000631
申请日：2002-11-21
申请人： ELMICRON AG , GALSTER, Norbert , EGGER, Ignaz , STEIERT, Philippe , PALM, Gerhard
发明人： GALSTER, Norbert , EGGER, Ignaz , STEIERT, Philippe , PALM, Gerhard
IPC分类号： H05K3/04
CPC分类号： H05K3/107 , B22F7/064 , B22F2999/00 , B23K20/021 , B23K20/16 , B23K20/24 , B23K35/004 , B23K35/025 , B30B15/02 , H01L24/75 , H01L2224/75315 , H01L2224/75343 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01079 , H05K3/0014 , H05K3/005 , H05K2203/0108 , H05K2203/1131 , H05K2203/1572 , H05K2203/167 , B22F7/08 , H01L2924/00014
摘要： A microtool for embossing structures into a substrate is fastened to an object, such as a press plate, by sintering, preferably pressure sintering. An insight underlying the invention is the fact that such a sintering or pressure sintering method provides a sufficiently reliable, strong, heat conducting and/or dimensionally stable connection, even for a hot embossing process, where at elevated temperatures, pressures of 10-300 bar and tensile forces of up to 100-200 bar may act upon the connection, and where a dimensional stability of down to the micrometer scale may be required. According to a preferred embodiment, the forming temperature of a pressure sintered connection equals the embossing temperature, i.e. the working temperature of the tool.
摘要翻译：通过烧结，优选加压烧结，将用于将基板压花结构的微型工具固定到诸如压板的物体上。本发明的一个深刻之处在于，即使对于热压花过程，这种烧结或压力烧结方法提供了足够可靠，强的导热和/或尺寸稳定的连接，其中在高温下，10-300巴的压力并且高达100-200巴的拉伸力可能作用在连接上，并且其中可能需要低于千分尺的尺寸稳定性。根据优选实施例，压力烧结连接的成形温度等于压花温度，即工具的工作温度。

32. 发明申请

WO2004010226A2 MACHINE FOR EXPOSING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：打印印刷电路板的机器
公开(公告)号：WO2004010226A2
公开(公告)日：2004-01-29
申请号：PCT/FR0302256
申请日：2003-07-17
申请人： AUTOMA TECH SA , VIBET GILLES , LE BOUCHER ARNAUD
发明人： VIBET GILLES , LE BOUCHER ARNAUD
IPC分类号： G03F7/20 , H05K3/00
CPC分类号： G03F7/2032 , G03F7/2014 , H05K3/0082 , H05K2203/085 , H05K2203/1572
摘要： The invention concerns a machine for exposing printed circuit boards, comprising: a support (26) for said printed circuit board (24); a mobile printing plate support (10) including a substantially rectangular frame (12) and a transparent plate (14) adapted to receive said printing plate; means for peripheral sealing; means for generating a vacuum; at least one deformable sealed casing (30, 32) arranged between said support and said transparent plate around at least part of said printed circuit board; a pressurized gas source at a pressure higher than the value of said vacuum to feed said casing whereby, when a vacuum is generated in said volume, the periphery of said transparent plate is applied on said casing.
摘要翻译：本发明涉及一种用于暴露印刷电路板的机器，包括：用于所述印刷电路板（24）的支撑件（26）; 包括适于接纳所述印版的大致矩形框架（12）和透明板（14）的移动印版支撑件（10）周边密封方式用于产生真空的装置; 至少一个可变形的密封壳体（30,32），围绕所述印刷电路板的至少一部分布置在所述支撑件和所述透明板之间; 压力气体源，其压力高于所述真空值以供给所述壳体，由此当在所述容积中产生真空时，所述透明板的周边被施加在所述壳体上。

33. 发明申请

WO2003081966A2 PROCESS AND APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：制造印刷电路板的工艺和装置
公开(公告)号：WO2003081966A2
公开(公告)日：2003-10-02
申请号：PCT/US2003/007734
申请日：2003-03-12
申请人： BERG, N., Edward
发明人： BERG, N., Edward
IPC分类号： H05K
CPC分类号： H05K3/061 , H05K1/0266 , H05K3/0079 , H05K3/108 , H05K3/1275 , H05K2203/0113 , H05K2203/013 , H05K2203/0517 , H05K2203/0534 , H05K2203/0783 , H05K2203/105 , H05K2203/1173 , H05K2203/1545 , H05K2203/1572 , H05K2203/163
摘要： A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The direct printing methods include correcting positional errors in a printing apparatus by ascertaining the errors in the printer through comparison of a printed pattern and a known standard pattern. Printer inputs are manipulated to compensate for the ascertained errors of the printer. The pattern mask applied by the corrected printer may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may by a plating mask with conductive pathways being formed by a plating operation. The invention is applicable to forming both single-sided and double-sided printed circuit boards.
摘要翻译：一种使用直接印刷方法生产印刷电路的方法和装置，用于将图案掩模施加到基板上。直接打印方法包括通过比较打印图案和已知标准图案来确定打印机中的错误来校正打印装置中的位置错误。操作打印机输入以补偿确定的打印机错误。由校正的打印机施加的图案掩模可以是用于通过蚀刻工艺形成导电通路的抗蚀剂掩模，或者图案掩模可以由具有通过电镀操作形成的导电路径的电镀掩模。本发明适用于形成单面和双面印刷电路板。

34. 发明申请

WO2003073506A2 A MODULAR INTEGRATED CIRCUIT CHIP CARRIER 审中-公开
标题翻译：模块化集成电路芯片载体
公开(公告)号：WO2003073506A2
公开(公告)日：2003-09-04
申请号：PCT/US2003/005359
申请日：2003-02-21
申请人： LEGACY ELECTRONICS, INC. , KLEDZIK, Kenneth , ENGLE, Jason, C.
发明人： KLEDZIK, Kenneth , ENGLE, Jason, C.
IPC分类号： H01L25/065
CPC分类号： H05K1/141 , H01L25/0652 , H01L25/0657 , H01L2224/16 , H01L2225/06517 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/3011 , H05K1/0231 , H05K1/0268 , H05K1/0298 , H05K1/144 , H05K1/182 , H05K1/183 , H05K3/3436 , H05K2201/045 , H05K2201/049 , H05K2201/09036 , H05K2201/09954 , H05K2201/10515 , H05K2201/10734 , H05K2203/1572 , H01L2924/00 , H01L2224/48 , H01L2924/01005
摘要： An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remote the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.
摘要翻译：公开了允许在电路板上布置三维阵列半导体芯片的装置和方法。公开了一种独特的芯片载体，其中任何IC芯片可以在电路板上定位在另一个上。此外，载波允许在载波上并在其下测试IC芯片，而不必将载波和芯片远离系统，即使它们是BGA或CSP类型。运营商包括暴露的测试点，以便现场测试。

35. 发明申请

WO2003072855A1 VERFAHREN UND VORRICHTUNGEN ZUR ELEKTROLYTISCHEN METALLISIERUNG VON LOCHWÄNDEN UND STRUKTUREN 审中-公开
标题翻译：方法和孔壁与结构的电解金属器件
公开(公告)号：WO2003072855A1
公开(公告)日：2003-09-04
申请号：PCT/DE2003/000153
申请日：2003-01-21
申请人： HÜBEL, Egon
发明人： HÜBEL, Egon
IPC分类号： C25D7/00
CPC分类号： H05K3/423 , C25D5/02 , C25D5/18 , C25D7/0621 , C25D17/005 , C25D21/12 , H05K3/07 , H05K2203/1476 , H05K2203/1492 , H05K2203/1509 , H05K2203/1572
摘要： Die Erfindung betrifft Verfahren und Vorrichtungen zur Galvanisierung von Löchern, Sacklöchern und Strukturen bevorzugt in und auf Leiterplatten. Bei den bekannten Verfahren zur Galvanisierung der Löcher werden die Oberflächen überwiegend metallisiert. Dies ist unerwünscht.Die Erfindung kombiniert die elektrolytische Wirkung von unterschiedlichen Anoden/Kathodenabständen mit jeweils unterschiedlichen Polaritäten des Badstromes in zwei Behandlungsschritten. In den Figuren sind die beiden Schritte mit den Abständen der Elektroden und die Polaritäten der Badstromquelle eingezeichnet. Bei großem Anoden/Kathodenabstand des Gutes 1 von der Elektrode 2 werden die Oberfläche und die Löcher metallisiert. Bei kleinem Anoden/Kathodenabstand wird die Oberfläche überwiegend entmetallisiert, nicht jedoch die Löcher. Als Ergebnis werden überwiegend die Löcher metallisiert und nicht die Oberflächen.
摘要翻译：本发明涉及一种用于孔，盲孔，并且在优选结构的电镀方法和装置以及在印刷电路板上。在用于空穴的电镀的已知方法中，表面被主要金属化。这是unerwünscht.Die发明结合不同的阳极/阴极的间距，每个具有不同的极性的电解槽电流分成两个处理步骤的电解作用。在附图中，这两个步骤与电极的距离和浴电流源的极性被示出。在从电极2的材料1的大阳极/阴极的距离，在表面和孔被金属化。用小阳极/阴极分离，表面主要是剥离，但不是孔。其结果是，孔主要是金属化的，而不是表面。

36. 发明申请

WO2003045122A1 METHOD OF MAKING AN INTERPOSER 审中-公开
标题翻译：制造插销器的方法
公开(公告)号：WO2003045122A1
公开(公告)日：2003-05-30
申请号：PCT/US2002/036726
申请日：2002-11-15
申请人： R-TEC CORPORATION , CLAYTON, Gary , HASTINGS, Douglas, G.
发明人： CLAYTON, Gary , HASTINGS, Douglas, G.
IPC分类号： H05K3/32
CPC分类号： H01R13/2414 , H01L23/49827 , H01L23/49883 , H01L2924/0002 , H05K3/325 , H05K3/4069 , H05K2201/0166 , H05K2201/0314 , H05K2201/10378 , H05K2203/0568 , H05K2203/0769 , H05K2203/1572 , H01L2924/00
摘要： A method of making an improved interposer for use in forming an electrical connection between electrical components. The interposer includes a bi-lobate contact pad made of an elastomeric material embedded with conductive metallic granules.
摘要翻译：一种制造用于形成电气部件之间的电连接的改进型插入器的方法。插入器包括由嵌入有导电金属颗粒的弹性体材料制成的双叶接触垫。

37. 发明申请

WO2003024167A1 PIN-FREE SOCKET COMPATIBLE WITH OPTICAL-ELECTRICAL INTERCONNECTS 审中-公开
标题翻译：无PIN插座与光电互连兼容
公开(公告)号：WO2003024167A1
公开(公告)日：2003-03-20
申请号：PCT/US2002/025080
申请日：2002-08-07
申请人： INTEL CORPORATION (a Delaware Corporation)
发明人： LI, Yuang-Liang
IPC分类号： H05K1/02
CPC分类号： H05K1/141 , G02B6/4249 , G02B6/43 , H01L2224/16225 , H05K1/0219 , H05K1/0263 , H05K1/0274 , H05K3/368 , H05K7/1053 , H05K2201/10189 , H05K2201/10378 , H05K2201/10734 , H05K2203/1572
摘要： A socket that includes: a housing, one or more power conductors, and one or more ground conductors. The power conductors and ground conductors are conductive bars imbedded in one or more walls of the housing in a checkerboard pattern providing a low inductance and low resistance current path. The housing may contain an opening in the center and has a top side and a bottom side. The power conductors and the ground conductors are electrically connectable to an electronic package on the top side of the housing and a printed circuit board to the bottom side of the housing. The socket is pin-free and compatible with electronic packages that transfer information over optical interconnects on a printed circuit board.
摘要翻译：一种插座，包括：外壳，一个或多个电源导体和一个或多个接地导体。电源导体和接地导体是嵌入在壳体的一个或多个壁中的导电棒，其格栅图案提供低电感和低电阻电流路径。壳体可以在中心包含开口，并且具有顶侧和底侧。电源导体和接地导体可以电连接到外壳顶部的电子封装和位于外壳底部的印刷电路板。插座是无引脚的，与电子封装兼容，通过印刷电路板上的光学互连传输信息。

38. 发明申请

WO2003023388A1 SENSOR SUBSTRATE AND METHOD OF FABRICATING SAME 审中-公开
标题翻译：传感器基板及其制造方法
公开(公告)号：WO2003023388A1
公开(公告)日：2003-03-20
申请号：PCT/US2002/028020
申请日：2002-09-04
申请人： MEDTRONIC MINIMED, INC.
发明人： PENDO, Shaun , SHAH, Rajiv , CHERNOFF, Edward
IPC分类号： G01N27/30
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate (16) with hermetically sealed vias (18) extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One sideof the substrate may include a sensing element (12) and another side of the substrate may include sensing electronics (14).
摘要翻译：具有从衬底的一侧延伸到另一侧的密封过孔（18）的衬底（16）及其制造方法。通孔可以填充有导电材料，例如无熔块墨水。由导电材料形成的导电路径有助于将衬底的一侧与另一侧密封。衬底的一侧可以包括感测元件（12），衬底的另一侧可以包括感测电子器件（14）。

39. 发明申请

WO2002067646A1 ARRANGEMENT WITH AN INTEGRATED CIRCUIT MOUNTED ON A BEARING MEANS AND A POWER SUPPLY MODULE ARRANGEMENT 审中-公开
标题翻译：安装在轴承装置上的集成电路和电源模块布置的布置
公开(公告)号：WO2002067646A1
公开(公告)日：2002-08-29
申请号：PCT/IB2002/000434
申请日：2002-02-13
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , PHILIPS CORPORATE INTELLECTUAL PROPERTY GMBH , DUERBAUM, Thomas , ELFERICH, Reinhold
发明人： DUERBAUM, Thomas , ELFERICH, Reinhold
IPC分类号： H05K7/10
CPC分类号： H05K7/1092 , H01L2224/16225 , H01L2924/00014 , H01L2924/0002 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H05K1/0231 , H05K1/0263 , H05K1/141 , H05K1/182 , H05K2201/045 , H05K2201/10515 , H05K2201/10636 , H05K2201/10734 , H05K2203/1572 , Y02P70/611 , H01L2924/00 , H01L2224/0401
摘要： The invention relates to arrangements for the power supply of integrated circuits. Various solutions are proposed with a view to guaranteeing a power supply satisfying all the technical requirements with regard to ever greater permissible load jumps, greater permissible current change rates and ever tighter tolerances regarding the constancy of the supply voltage in question. In particular an arrangement with an integrated circuit (2) mounted on a bearing means (1) and a power supply module arrangement (3) is proposed, which is placed on the combination of bearing means (1) and integrated circuit (2) and whose base extends at least partially over the base of the integrated circuit (2) and/or all around the base of the integrated circuit (2).
摘要翻译：本发明涉及集成电路的电源的配置。提出了各种解决方案，以确保满足关于越来越大的允许负载跳跃，更大的允许电流变化率以及关于所讨论的电源电压的恒定性的更严格的公差的所有技术要求的电源。特别地，提出了安装在轴承装置（1）和电源模块装置（3）上的集成电路（2）的布置，其被放置在轴承装置（1）和集成电路（2）的组合上，并且其基极至少部分地延伸到集成电路（2）的底部和/或整个集成电路（2）的基极周围。

40. 发明申请

WO02030168A1 PC CARD 审中-公开
标题翻译： PC卡
公开(公告)号：WO02030168A1
公开(公告)日：2002-04-11
申请号：PCT/GB2001/004216
申请日：2001-09-20
IPC分类号： H05K1/14 , H05K1/18 , H05K5/02 , H05K3/34
CPC分类号： H05K5/0269 , H05K1/14 , H05K1/181 , H05K2201/09972 , H05K2201/0999 , H05K2203/1572 , Y02P70/611
摘要： A PC card (11) comprises a casing (12) and a PCB (15) mounted within the casing to extend from one end portion (13) thereof towards the opposite end portion (14) thereof. The PCB (15) is mounted within the casing (12) in such a manner that small components can be mounted on the PCB at a first side thereof at said one end portion (13) of the casing and at the second side of the PCB at said other end portion (14) of the casting, and such that taller components can be mounted on the PCB at the first side thereof at said other end portion of the casing and at the second side of the PCB at said one end portion of the casing.
摘要翻译： PC卡（11）包括壳体（12）和安装在壳体内的PCB（15），以从其一个端部（13）向其相对端部（14）延伸。 PCB（15）以这样的方式安装在壳体（12）内，使得小的部件可以在壳体的所述一个端部（13）的第一侧和PCB的第二面处安装在PCB上在所述铸件的所述另一端部（14）处，并且使得较高的部件可以在其第一侧的所述壳体的所述另一端部处以及所述PCB的所述第二侧的所述一个端部套管。

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