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    • 30. 发明申请
    • COMPOSITION FOR CLEANING CHEMICAL MECHANICAL PLANARIZATION APPARATUS
    • 清洁化学机械平面设备的组合物
    • WO02013242A2
    • 2002-02-14
    • PCT/US2001/024515
    • 2001-08-03
    • C11D1/68C11D3/20C11D3/30C11D11/00C23G1/06C23G1/18H01L21/304H01L21/306H01L21/00
    • H01L21/02052C11D3/30C11D11/0047C23G1/061C23G1/18
    • The present invention relates to chemical compositions and methods of use for cleaning CMP equipment, including the interiors of delivery conduits carrying CMP slurry to the necessary sites. The chemical compositions of the present invention are also useful for post-CMP cleaning of the wafer itself. Three classes of cleaning compositions are described, all of which are aqueous solutions. One class operates in a preferable pH range from about 11 to about 12 and preferably contains one or more non-ionic surfactants, one or more simple amines, a surfactant or sticking agent such as one or more soluble dialcohol organic compounds and one or more quaternary amines. A second class of cleaning composition operates in a preferable pH range of approximately 8.5 and contains citric acid and oxalic acid. A third class of compositions is acidic, having a preferable pH range from about 1.5 to about 3, preferably containing at least one oxidizing acid, at least one chelating agent, at least one sticking agent and at least one anionic surfactant. HF and KOH are substantially absent from the preferred compositions of the present invention. Some compositions of the present invention are shown to be advantageously used for cleaning the slurry distribution system of CMP apparatus.
    • 本发明涉及用于清洁CMP设备的化学组成和方法,包括将CMP浆料输送到必要场所的输送管道的内部。 本发明的化学组成也可用于晶片本身的CMP后清洗。 描述了三类清洁组合物,所有这些都是水溶液。 一类在约11至约12的优选pH范围内操作,并且优选含有一种或多种非离子表面活性剂,一种或多种简单胺,表面活性剂或粘着剂,例如一种或多种可溶性二醇有机化合物和一种或多种季铵 胺。 第二类清洁组合物在约8.5的优选pH范围内操作,并且含有柠檬酸和草酸。 第三类组合物是酸性的,具有约1.5至约3的优选pH范围,优选含有至少一种氧化酸,至少一种螯合剂,至少一种粘着剂和至少一种阴离子表面活性剂。 HF和KOH基本上不存在于本发明的优选组合物中。 显示出本发明的一些组合物有利地用于清洁CMP装置的浆料分配系统。