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21. 发明申请

WO2009152066A4 GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS 审中-公开
标题翻译：用于减少线接合操作中的氧化的气体输送系统
公开(公告)号：WO2009152066A4
公开(公告)日：2010-04-29
申请号：PCT/US2009046535
申请日：2009-06-08
申请人： KULICKE AND SOFA IND INC , GILLOTTI GARY S , SZCZESNIAK STANLEY , VAN EMMERIK PETER J
发明人： GILLOTTI GARY S , SZCZESNIAK STANLEY , VAN EMMERIK PETER J
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , B23K20/007 , B23K2201/42 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85043 , H01L2224/85045 , H01L2224/85075 , H01L2224/85205 , H01L2924/00014 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
摘要翻译：提供引线接合机。引线接合机包括接合工具和电极，用于在延伸穿过接合工具的引线端部形成无空气球，其中无空气球形成在引线接合机的无空气球形成区域处。引线接合机还包括用于在引线接合操作期间保持半导体器件的接合部位区域。引线接合机还包括气体输送机构，该气体输送机构构造成提供覆盖气体以：（1）粘合部位区域，由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘合部位区域，以及（2））无空气球形成区域。

22. 发明申请

WO2010005427A1 WIRE BONDING TOOL WITH IMPROVED TRANSDUCER INTERFACE 审中-公开
标题翻译：具有改进的传感器接口的电线连接工具
公开(公告)号：WO2010005427A1
公开(公告)日：2010-01-14
申请号：PCT/US2008/069382
申请日：2008-07-08
申请人： KULICKE AND SOFFA INDUSTRIES, INC. , POLLAK, Avraham
发明人： POLLAK, Avraham
IPC分类号： B23K20/10 , H01L21/607
CPC分类号： B23K20/007 , B23K2201/40 , H01L24/78 , H01L24/85 , H01L2224/78302 , H01L2224/78308 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2224/48 , H01L2224/45099 , H01L2924/00
摘要： A bonding tool for bonding a wire to a bonding location is provided. The bonding tool includes a first portion formed from a conductive material, the first portion configured for engagement with a transducer of a wire bonding machine. The bonding tool further includes a second portion formed from a non-conductive material, the second portion being separate from, and configured to be connected to, the first portion. The second portion extends from the first portion towards a tip end of the bonding tool when connected to the first portion.
摘要翻译：提供了用于将导线接合到接合位置的接合工具。接合工具包括由导电材料形成的第一部分，第一部分被配置为与引线接合机的换能器接合。接合工具还包括由非导电材料形成的第二部分，第二部分与第一部分分离并且构造成连接到第一部分。当连接到第一部分时，第二部分从接合工具的第一部分延伸到顶端。

23. 发明申请

WO2009110355A1 実装構造およびその製造方法审中-公开
标题翻译：安装结构及其制造方法
公开(公告)号：WO2009110355A1
公开(公告)日：2009-09-11
申请号：PCT/JP2009/053277
申请日：2009-02-24
申请人：日本電気株式会社 , 小林寛嗣
发明人：小林寛嗣
IPC分类号： H05K9/00 , H01L21/60 , H01L23/12 , H05K1/02 , H05K1/18 , H05K3/00
CPC分类号： H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/81136 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/1532 , H05K1/0219 , H05K1/0271 , H05K3/3436 , H05K2201/10287 , H05K2201/10378 , H05K2201/10424 , H01L2224/48
摘要：　基板とその上に搭載された半導体パッケージとを含む実装構造において、不要な電磁波放射の抑制と耐落下衝撃性の向上を実現できる実装構造と、その製造方法を提供する。基板１は、表面に、半導体パッケージを搭載するための複数の電極パッド１２と、電源・グラウンド層１７に電気的に接続された複数の電極パッド１３を持つ。基板１の表面に、電極パッド１３に少なくとも２点で機械的・電気的に接続された導電線材３１を設け、基板１の表面の剛性を高くする。半導体パッケージ４は、電極パッド１２を用いて基板１の表面に機械的・電気的に接続される。導電線材３１により、伝送信号から発生する不要な電磁波放射の抑制と耐落下衝撃性の向上が実現する。
摘要翻译：提供一种安装结构，其包括基板和安装在其上的半导体封装，其能够抑制不必要的电磁辐射和提高耐滴落冲击强度及其制造方法。基板（1）上设置有用于安装半导体封装件的多个电极焊盘（12）和与其表面上的电源/接地层（17）电连接的多个电极焊盘（13）。在基板（1）的表面上设置有至少两个点机械地和电连接到电极焊盘（13）的导线（31），以提高基板（1）表面的刚度。半导体封装（4）通过电极焊盘（12）机械地和电连接到衬底（1）的表面。通过导电线（31）实现抑制从传输信号产生的不必要的电磁辐射和提高耐跌落冲击强度。

24. 发明申请

WO2009108800A2 METHOD AND APPARTUS FOR FABRICATING COMPOSITE SUBSTRATES FOR THIN FILM ELECTRO-OPTICAL DEVICES 审中-公开
标题翻译：制造用于薄膜电光器件的复合衬底的方法和装置
公开(公告)号：WO2009108800A2
公开(公告)日：2009-09-03
申请号：PCT/US2009/035322
申请日：2009-02-26
申请人： SUNLIGHT PHOTONICS INC. , FROLOV, Sergey , CYRUS, Michael
发明人： FROLOV, Sergey , CYRUS, Michael
IPC分类号： H01L31/042
CPC分类号： H01L31/022433 , H01L31/022466 , H01L31/0392 , H01L31/03926 , H01L31/043 , H01L31/0543 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/207 , Y02E10/52 , H01L2924/00 , H01L2224/48 , H01L2924/0002
摘要： A method is provided for producing an electro-optic device having at least one optically transparent conducting layer with low electrical resistance. The method includes providing a composite substrate that includes an optically transparent and electrically insulating base substrate and an electrically conducting grid disposed in grooves located in the base substrate. Also provided is an electro-optical module having at least one transparent conducting layer. The composite substrate is attached onto the electro-optic module such that electrical contact is established between the grid and the transparent conducting layer of the electro-optic module.
摘要翻译：提供了一种用于制造具有至少一个具有低电阻的光学透明导电层的电光器件的方法。该方法包括提供复合衬底，该复合衬底包括光学透明且电绝缘的基础衬底以及设置在位于基础衬底中的凹槽中的导电栅格。还提供了具有至少一个透明导电层的电光模块。将复合衬底附着到电光模块上，使得电栅和电光模块的透明导电层之间建立电接触。

25. 发明申请

WO2009079114A2 THERMAL MECHANICAL FLIP CHIP DIE BONDING 审中-公开
标题翻译：热机械翻转芯片模结合
公开(公告)号：WO2009079114A2
公开(公告)日：2009-06-25
申请号：PCT/US2008/082972
申请日：2008-11-10
申请人： SKYWORKS SOLUTIONS, INC. , LIANG, Steve, X.
发明人： LIANG, Steve, X.
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/13 , H01L21/56 , H01L21/563 , H01L22/12 , H01L23/3121 , H01L24/03 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11901 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/274 , H01L2224/48 , H01L2224/73203 , H01L2224/81013 , H01L2224/81201 , H01L2224/81205 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , H01L2924/15311 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A thermal mechanical process for bonding a flip chip die to a substrate. The flip chip die includes a plurality of copper pillar bumps, each copper pillar bump of the plurality of copper pillar bumps having a copper portion attached to the die and a bonding cap attached to the copper portion. The process includes positioning the die on the substrate such that the bonding cap of each copper pillar bump of the plurality of copper pillar bumps contacts a corresponding respective one of a plurality of bonding pads on the substrate, and thermosonically bonding the die to the substrate.
摘要翻译：用于将倒装芯片管芯接合到衬底的热机械工艺。倒装芯片管芯包括多个铜柱形凸块，多个铜柱形凸块中的每个铜柱形凸块具有附着到管芯的铜部分和附着到铜部分的结合帽。该工艺包括将管芯定位在衬底上，使得多个铜柱形凸块中的每个铜柱形凸块的接合帽接触衬底上的多个接合焊盘中的对应的一个接合焊盘，并且将芯片热声地接合到衬底。

26. 发明申请

WO2009045716A1 PROXIMITY COMMUNICATION PACKAGE FOR PROCESSOR, CACHE AND MEMORY 审中-公开
标题翻译：处理器，缓存和存储器的接近通信包
公开(公告)号：WO2009045716A1
公开(公告)日：2009-04-09
申请号：PCT/US2008/076603
申请日：2008-09-17
申请人： SUN MICROSYSTEMS, INC. , CUNNINGHAM, John E. , KRISHNAMOORTHY, Ashok V. , LANDIN, Anders
发明人： CUNNINGHAM, John E. , KRISHNAMOORTHY, Ashok V. , LANDIN, Anders
IPC分类号： H01L25/18 , H01L23/48
CPC分类号： H01L25/18 , H01L23/48 , H01L24/73 , H01L25/0652 , H01L2224/1403 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2225/06513 , H01L2225/06531 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/48
摘要： A "sombrero" bridge transports signals between a processor (104) and one or more cache memories (106, 108). The bridge (114) surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections (110, 112). The bridge communicates with the processor via conductive connections and optionally proximity connections. Spacing between opposing pads of the proximity connection (s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses (552, 553) in an opposing surface (514) of the bridge, and a ball (550, 551) for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter (s) constrain a minimum distance between opposing pads of the proximity connection (s).
摘要翻译：一个“sombrero”桥在处理器（104）和一个或多个高速缓存存储器（106,108）之间传送信号。桥（114）围绕处理器的周边，并且包括与处理器相对的孔，通过该孔可以从另一设备将功率和数据提供给处理器。桥接器经由电容耦合的接近连接（110,112）与高速缓冲存储器交换信号。桥接器通过导电连接和可选的接近连接与处理器通信。桥接器和高速缓冲存储器之间的接近连接的相对焊盘之间的间隔可由高速缓存存储器的表面中的凹槽提供，桥的相对表面（514）中的相应凹部（552,553）以及每个匹配的一对对应的高速缓冲存储器和桥接凹口的球（550,551）。球配合在匹配对中的凹槽之间。凹陷深度和球直径约束邻近连接的相对焊盘之间的最小距离。

27. 发明申请

WO2008153558A3 A SEMICODUCTOR TESTING DEVICE WITH ELASTOMER INTERPOSER 审中-公开
标题翻译：具有弹性体插入器的半导体测试装置
公开(公告)号：WO2008153558A3
公开(公告)日：2009-04-09
申请号：PCT/US2007069896
申请日：2007-05-29
申请人： TOUCHDOWN TECHNOLOGIES INC
发明人： KARKLIN KEN , GARABEDIAN RAFFI
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , H01L24/45 , H01L2224/45144 , H01L2924/00014 , H01L2924/0105 , H01L2924/01079 , H01L2924/1461 , H01L2224/48 , H01L2924/00
摘要： A novel device for testing semiconductor chips is disclosed A benefit with all the embodiments described herein is that the device may expepence zero (or near zero) nascent force The device may be comppsed of a printed circuit board (PCB)that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer When the PCB piercing structure and the substrate piercing structure pierce the elastomer, the PCB becomes electrically connected to the probe contactor Instead of the piercing structure, the PCB or the probe contractor substrate may be adhered to the elastomer by an adhesive, such that the PCB becomes electrically connected to the probe contactor
摘要翻译：公开了一种用于测试半导体芯片的新型器件。本文所述的所有实施例的优点在于，器件可以超过零（或近零）新生力。该器件可以由具有至少一个PCB的印刷电路板（PCB）穿孔结构，具有至少一个基板穿孔结构的探针接触器基板，其中所述基板穿孔结构电连接到探针接触器，以及具有至少一个由导电弹性体制成的电通路的插入件当所述PCB穿孔结构和基板刺穿结构刺穿弹性体，PCB变得电连接到探针接触器代替穿孔结构，PCB或探针承载基底可以通过粘合剂粘附到弹性体上，使得PCB变得电连接到探针接触

28. 发明申请

WO2009022252A2 SMALL-SIZE LAYOUT FOR THE PLANAR FINAL METAL DIE ATTACH PADS OF AN INTEGRATED CIRCUIT´S CSP-TYPE SEMICONDUCTOR CHIP DEVICE ASSEMBLEY 审中-公开
标题翻译：集成电路CSP型半导体芯片器件组件的平面最终金属连接板的小尺寸布局
公开(公告)号：WO2009022252A2
公开(公告)日：2009-02-19
申请号：PCT/IB2008/053093
申请日：2008-08-01
申请人： NXP B.V. , SYRE, Jörg
发明人： SYRE, Jörg
IPC分类号： H01L23/485
CPC分类号： H01L23/522 , H01L23/3114 , H01L24/02 , H01L24/10 , H01L24/13 , H01L24/45 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04953 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2224/48 , H01L2924/00
摘要： The present invention is related to die bonding technology, in particular to a small- size layout for the surface areas of the planar final metal die attach pads (9) in a novel CSP-type semiconductor integrated circuit chip device assembly, wherein each planar final metal die attach pad (9) contained in this assembly layout has a surface area that is smaller in size than those of conventional semiconductor integrated circuit chips that are to be mounted on a printed circuit board's substrate in chip-scale package technology. For applications with a restricted upper tolerable limit for the total capacitance of the integrated circuit, parasitic metal-silicon capacitance, which occurs between each planar final metal die attach pad (9) and the substrate (8), is detrimental. For mechanical robust CSP products, on the other hand, it is a necessary requirement that the planar metal die attach pad area surfaces are larger in size than their associated under-bump metallization (UBM) areas (5). Reducing said parasitic metal-silicon capacitance, which can easily be achieved by using metal die attach pads (9) with smaller surface areas, is very lifetime-critical in cases where metal bonding wires (1) are required and results in that the semiconductor chip device might possibly fail during mechanical stress. A significant problem concerning the robustness of the assembly are the edges of the under-bump metallization areas (5), which is because there are usually high stress forces along these edges during the lifetime of said chip-scale packaged semiconductor chip device assembly. The present invention therefore proposes a chip-scale packaged semiconductor chip device assembly bonded onto planar final metal die attach pad layers (9) on a printed circuit board (8) by means of solder bumps, wherein the surface areas of the planar final metal die attach pad layers (9) are smaller in size than their associated under-bump metallization layers (5). For die-to-die bond wiring, very thin and hard electrically conductive materials are proposed which - according to a refinement of the present invention - may be used as surface-mounted ohmic resistors. In this case, the mechanical stability of the bump-chip connection is still given, and, at the same time, parasitic metal-silicon capacitances of the die attach pads to the substrate are reduced.
摘要翻译：本发明涉及芯片接合技术，特别涉及一种用于新型CSP型半导体集成电路芯片器件组件中的平面最终金属芯片附接焊盘（9）的表面区域的小尺寸布局，其中每个平面最终包含在该组装布局中的金属管芯附接垫（9）的尺寸小于以芯片级封装技术安装在印刷电路板的基板上的常规半导体集成电路芯片的尺寸。对于对于集成电路的总电容具有限制的上限容许限制的应用，在每个平面的最终金属管芯附着焊盘（9）和衬底（8）之间发生的寄生金属 - 硅电容是有害的。对于机械坚固的CSP产品，另一方面，平面金属管芯安装焊盘区域表面的尺寸要大于其相关的凸块下金属化（UBM）区域（5）的必要要求。通过使用具有较小表面积的金属管芯附接焊盘（9）可以很容易地实现所述寄生金属 - 硅电容的减小，在需要金属接合线（1）的情况下是非常长寿命的关键，并导致半导体芯片装置在机械应力时可能会失效。关于组件的鲁棒性的一个重大问题是凸起下金属化区域（5）的边缘，这是因为在所述芯片级封装半导体芯片器件组件的寿命期间通常沿着这些边缘通常具有高应力。因此，本发明提出了一种芯片级封装的半导体芯片器件组件，其通过焊料凸块接合到印刷电路板（8）上的平面最终金属管芯附着垫层（9）上，其中平面最终金属裸片的表面积附着垫层（9）的尺寸小于其相关的凸块下金属化层（5）。对于管芯到管芯的接合布线，提出非常薄且硬的导电材料，根据本发明的改进，可以将其用作表面安装的欧姆电阻器。在这种情况下，仍然给出凸块芯片连接的机械稳定性，并且同时，将芯片附着焊盘的寄生金属 - 硅电容减少到衬底。

29. 发明申请

WO2009009566A2 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：WO2009009566A2
公开(公告)日：2009-01-15
申请号：PCT/US2008069479
申请日：2008-07-09
申请人： TEXAS INSTRUMENTS INC , MASUMOTO MUTSUMI
发明人： MASUMOTO MUTSUMI
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/12 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48 , H01L2224/73203 , H01L2224/73204 , H01L2224/83104 , H01L2224/83862 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention includes a method for manufacturing a semiconductor device by which implementation of a finer pitch for a semiconductor chip (10) can be handled, and the creation of voids inside an under-filling resin can be reduced in order to realize highly reliable flip-chip mounting. It involves a step in which multiple electrodes arranged two-dimensionally on one side of a semiconductor chip are connected to corresponding conductive regions on a substrate (16); a step in which an under-filling resin (20) is injected between the one surface of the semiconductor chip and the substrate; and a step in which the under-filling resin is melted at a temperature higher than its glass transition temperature while under a prescribed pressure and cured.
摘要翻译：本发明包括一种用于制造半导体器件的方法，通过该方法可以处理半导体芯片（10）的更精细间距，并且可以减少在未填充树脂内产生空隙，从而实现高度可靠的倒装芯片芯片安装。它包括将在半导体芯片的一侧上二维排列的多个电极连接到衬底（16）上的相应导电区域的步骤; 在半导体芯片的一个表面与基板之间注入未填充树脂（20）的工序; 以及在规定的压力下使下填充树脂在高于其玻璃化转变温度的温度下熔融并固化的步骤。

30. 发明申请

WO2008151964A1 BONDKOPF FUER EINEN WIRE BONDER 审中-公开
标题翻译： BOND头引线接合器
公开(公告)号：WO2008151964A1
公开(公告)日：2008-12-18
申请号：PCT/EP2008/056812
申请日：2008-06-03
申请人： OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN , FELBER, Armin
发明人： FELBER, Armin
IPC分类号： B23K20/10 , B23K20/00
CPC分类号： B23K20/106 , B23K20/007 , H01L24/78 , H01L24/85 , H01L2224/78301 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/19042 , H01L2924/19043 , H01L2224/48 , H01L2224/45099
摘要： Ein Bondkopf für einen Wire Bonder umfasst eine in einer horizontalen Ebene bewegliche Plattform (2), auf der eine um eine erste horizontale Achse (3) drehbare Wippe (4) angeordnet ist. An der Wippe (4) ist ein um eine zweite horizontale Achse (7) drehbar gelagerter Ultraschall Transducer (6) befestigt. In der Nähe der ersten horizontalen Achse (3) ist ein Linearmotor angeordnet, mit dem die Drehlage des Ultraschall Transducers (6) relativ zur Wippe (4) verstellbar ist. Ein Sensor liefert ein Ausgangssignal, aus dem die Drehlage des Ultraschall Transducers (6) ableitbar ist. Ein Regler (17), dem das Ausgangssignal des Sensors (16) zugeführt wird, regelt die Position des Linearmotors und damit die Drehlage des Ultraschall Transducers (6). Der Regler (17) ist auch eingerichtet, den Linearmotor mit einem vorbestimmten Strom zu beaufschlagen, um während des Bondens die erforderliche Bondkraft zu erzeugen.
摘要翻译：的接合头的导线接合器包括在一水平面内的可动平台（2），其上布置有绕第一水平轴（3）可转动的摇臂（4）。可旋转地安装超声换能器（6）固定到一个大约在摇臂（4）的第二水平轴（7）。在第一水平轴（3）的附近，线性电机被设置，与该超声波振子（6）相对于所述摇臂（4）的旋转位置是可调节的。传感器提供了从该超声波换能器（6）的旋转位置导出的输出信号。控制器（17），以使传感器（16）的输出信号被馈送，控制直线电机的位置，从而所述超声换能器的旋转位置（6）。该控制器（17）还布置有一个预定电流接合时产生所需的接合力作用于直线电机上。

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