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    • 26. 发明申请
    • ELECTROPLATING CONTACTS WITH SILVER-ALLOYS IN A BASIC BATH
    • 在基础浴中镀银合金的电镀接触
    • WO2014179506A1
    • 2014-11-06
    • PCT/US2014/036260
    • 2014-04-30
    • TYCO ELECTRONICS CORPORATION
    • ZHENG, MinGAZDA, Jerzy
    • C25D3/64H01H1/023
    • C25D3/64C25D5/50C25D7/00H01H1/023
    • A method for silver-alloy plating an electrical contact (56) and a silver-alloy plated electrical contact are provided. The method includes cleaning the electrical contact by removing contaminates and exposing the electrical contact to at least one of an acid or base. The method includes preparing a sliver-alloy plating bath including water, a silver complex, and a metal complex, the metal complex being at least one of nickel or cobalt. The method includes silver-alloy plating the electrical contact in the silver-alloy plating bath, wherein the plating bath has a pH of greater than 7. The metal complex forms about 0.3% to about 50% by weight of a content of a silver-alloy plated deposit.
    • 提供了一种用于银合金电镀触点(56)和镀银电镀触点的方法。 该方法包括通过去除污染物并将电接触暴露于酸或碱中的至少一种来清洁电接触。 该方法包括制备包含水,银络合物和金属络合物的银合金电镀浴,所述金属络合物是镍或钴中的至少一种。 该方法包括银合金电镀银合金电镀浴中的电接触,其中电镀浴具有大于7的pH。金属络合物形成约0.3重量%至约50重量%的银 - 合金镀层沉积物。