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21. 发明申请

WO2015023585A1 SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES 审中-公开
标题翻译：具有背面冷却槽的喷射目标
公开(公告)号：WO2015023585A1
公开(公告)日：2015-02-19
申请号：PCT/US2014/050539
申请日：2014-08-14
申请人： APPLIED MATERIALS, INC.
发明人： WEST, Brian T. , COX, Michael S. , OH, Jeonghoon
IPC分类号： C23C14/34
CPC分类号： H01J37/3405 , C23C14/3407 , C23C14/35 , H01J37/3423 , H01J37/3426 , H01J37/3429 , H01J37/3435 , H01J37/347 , H01J37/3491 , H01J37/3497
摘要： Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
摘要翻译：本公开的实施例涉及用于处理衬底的溅射室的溅射靶。在一个实施方案中，提供了用于溅射室的溅射靶。溅射靶包括具有径向内部，中部和外部区域的背面的溅射板和安装到溅射板的环形背板。背面具有多个彼此间隔开的圆形槽，以及至少一个弧形通道，其切割圆形槽并且从径向内部区域延伸到溅射板的径向外部区域。环形背板限定暴露溅射板的背面的敞开的环状空间。

22. 发明申请

WO2020139605A1 POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL 审中-公开
公开(公告)号：WO2020139605A1
公开(公告)日：2020-07-02
申请号：PCT/US2019/066597
申请日：2019-12-16
申请人： APPLIED MATERIALS, INC.
发明人： GURUSAMY, Jay , ZUNIGA, Steven M. , OH, Jeonghoon
IPC分类号： B24B37/20 , B24B37/34 , B24B37/30
摘要： A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

23. 发明申请

WO2020005749A1 TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING 审中-公开
公开(公告)号：WO2020005749A1
公开(公告)日：2020-01-02
申请号：PCT/US2019/038411
申请日：2019-06-21
申请人： APPLIED MATERIALS, INC.
发明人： SOUNDARARAJAN, Hari , CHANG, Shou-Sung , WU, Haosheng , TANG, Jianshe , OH, Jeonghoon , BAJAJ, Rajeev , SIORDIA, Andrew
IPC分类号： H01L21/67 , H01L21/304
摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

24. 发明申请

WO2019070757A1 RETAINING RING DESIGN 审中-公开
公开(公告)号：WO2019070757A1
公开(公告)日：2019-04-11
申请号：PCT/US2018/054022
申请日：2018-10-02
申请人： APPLIED MATERIALS, INC.
发明人： OH, Jeonghoon , GARRETSON, Charles C. , LAU, Eric , NAGENGAST, Andrew , ZUNIGA, Steven M. , SUAREZ, Edwin C. , ZHANG, Huanbo , BROWN, Brian J.
IPC分类号： B24B37/32 , B24B41/06 , H01L21/687 , H01L21/306
摘要： Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

25. 发明申请

WO2018045039A1 POLISHING SYSTEM WITH ANNULAR PLATEN OR POLISHING PAD 审中-公开
标题翻译：带环形板或抛光垫的抛光系统
公开(公告)号：WO2018045039A1
公开(公告)日：2018-03-08
申请号：PCT/US2017/049394
申请日：2017-08-30
申请人： APPLIED MATERIALS, INC.
发明人： BUTTERFIELD, Paul D. , OSTERHELD, Thomas H. , OH, Jeonghoon , CHANG, Shou-Sung , ZUNIGA, Steven M. , REDEKER, Fred C.
IPC分类号： B24B37/04 , B24B37/20 , B24B57/02 , H01L21/306
摘要： A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.
摘要翻译：抛光系统包括具有顶表面的台板，支撑在台板上的环形抛光垫，支撑与环形抛光垫接触的基板的载体头，载体结构，载体头被悬挂并且被构造成使载体头横向地保持在抛光垫上，以及控制器。台板可围绕穿过台板的大致中心的旋转轴线旋转，并且环形抛光垫的内边缘围绕旋转轴线定位。所述控制器被配置为使所述支撑结构定位所述载体头部，使得当所述衬底接触所述抛光垫时，所述衬底的一部分伸出所述环形抛光垫的内边缘。

26. 发明申请

WO2018022520A3 RETAINING RING FOR CMP 审中-公开
公开(公告)号：WO2018022520A3
公开(公告)日：2018-02-01
申请号：PCT/US2017/043551
申请日：2017-07-24
申请人： APPLIED MATERIALS, INC.
发明人： NAGENGAST, Andrew J. , LEE, Christopher Heung-Gyun , LI, Thomas , IYER, Anand N. , DIAO, Jie , ZHANG, Huanbo , RONDUM, Erik S. , LEE, Wei-Cheng , OH, Jeonghoon
IPC分类号： B24B37/32 , H01L21/687 , B24B37/04 , H01L21/306
摘要： A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

27. 发明申请

WO2015199815A1 CONFIGURABLE PRESSURE DESIGN FOR MULTIZONE CHEMICAL MECHANICAL PLANARIZATION POLISHING HEAD 审中-公开
标题翻译：多机化学机械平面抛光头配置压力设计
公开(公告)号：WO2015199815A1
公开(公告)日：2015-12-30
申请号：PCT/US2015/029034
申请日：2015-05-04
申请人： APPLIED MATERIALS, INC.
发明人： OH, Jeonghoon , ZUNIGA, Steven, M. , NAGENGAST, Andrew , HSU, Samuel, Chu-Chiang , DANDAVATE, Gautam, Shashank
IPC分类号： H01L21/304
CPC分类号： B24B37/107 , B24B37/11 , B24B37/30
摘要： A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.
摘要翻译：提供了用于化学机械平面化的抛光头。抛光头包括壳体和固定到壳体的柔性膜。至少第一，第二和第三可加压室设置在壳体中，并且每个室接触柔性膜。第一压力输送通道联接到第一室。第二压力输送通道连接到第三室。第一压力供给管线将第一压力输送通道连接到第二室。第二压力供给管线将第二压力输送通道连接到第二室。第一可手动插头与第一压力进料管线接合，以允许或阻止来自第一压力输送通道到第二室的压力。第二可手动插头与第二压力进料管线接合，以允许或阻止来自第一压力输送通道到第二室的压力。

28. 发明申请

WO2015183448A1 ELECTROSTATIC CHUCK WITH EMBOSSED TOP PLATE AND COOLING CHANNELS 审中-公开
标题翻译：带有顶板和冷却通道的静电卡盘
公开(公告)号：WO2015183448A1
公开(公告)日：2015-12-03
申请号：PCT/US2015/027895
申请日：2015-04-28
申请人： APPLIED MATERIALS, INC.
发明人： MANGALORE, Chethan , BALAN, Arumuga , OH, Jeonghoon
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H01L21/67109 , H01L21/6875 , H01L21/68785 , H05B6/06 , H05B6/105
摘要： An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
摘要翻译：本文提供了用于保持基板的静电卡盘。在一些实施例中，用于保持衬底的静电吸盘可以包括：基座，其包括在其上表面中形成有一个或多个冷却通道的导电基座; 设置在所述一个或多个冷却通道上的升高的中心支撑件; 以及设置在所述升高的中心支撑件上的电介质顶板，其中所述电介质顶板具有压花顶表面，并且其中所述电介质顶板和升高的中心支撑件包括多个孔，以便于冷却气体的输送一个或多个冷却通道当设置在电介质顶板的压花顶表面上时，到衬底的背面。

29. 发明申请

WO2014085203A1 THREE-ZONE CARRIER HEAD AND FLEXIBLE MEMBRANE 审中-公开
标题翻译：三区载体和柔性膜
公开(公告)号：WO2014085203A1
公开(公告)日：2014-06-05
申请号：PCT/US2013/071334
申请日：2013-11-21
申请人： APPLIED MATERIALS, INC.
发明人： OH, Jeonghoon , LEIGHTON, Jamie
IPC分类号： H01L21/302
CPC分类号： B24B37/27 , B24B37/30
摘要： A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
摘要翻译：用于化学机械抛光机的载体头的柔性膜包括主要部分，环形外部部分和三个环形襟翼。主要部分具有半径R的衬底安装表面。环形外部部分从主体部分的外边缘向上延伸，并且具有连接到主要部分和上边缘的下边缘。三个环形翼片包括在R的75％至95％之间的径向位置处连接到主部分的内表面的第一环形挡片，在下部位置之间的位置处连接到环形外部的第二向内延伸的环形挡片边缘和上边缘，以及连接到环形外部的上边缘的第三向内延伸的环形翼片。

30. 发明申请

WO2022197347A1 SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS 审中-公开
公开(公告)号：WO2022197347A1
公开(公告)日：2022-09-22
申请号：PCT/US2022/011441
申请日：2022-01-06
申请人： APPLIED MATERIALS, INC.
发明人： OH, Jeonghoon , ZUNIGA, Steven M.
IPC分类号： B24B37/10 , B24B37/30 , B24B37/24 , H01L21/306 , H01L21/67
摘要： A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is positionable to simultaneously position a substrate supported therein against polishing pads on at least two of the plurality of polishing platens. The processing station can form a standalone polishing system, or be one of at least two processing statins in a polishing tool, where at least one other polishing station includes a polishing platen to support a polishing pad thereon.

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