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    • 28. 发明申请
    • ELECTROCHROMIC DEVICE INCLUDING A MEANS FOR PREVENTING ION MIGRATION AND A PROCESS OF FORMING THE SAME
    • 包括用于防止离子迁移的手段的电致变色装置和形成该装置的过程
    • WO2017196634A1
    • 2017-11-16
    • PCT/US2017/031057
    • 2017-05-04
    • SAGE ELECTROCHROMICS, INC.
    • BROSSARD, SophieGIRON, Jean-ChristopheLEYDER, CharlesABREU, João
    • G02F1/155G02F1/15
    • An electrochromic device can include a substrate; an electrochromic layer or a counter electrode layer over the substrate and including a mobile ion; a first transparent conductive layer over the substrate and including Ag. In one embodiment, the electrochromic device can include a barrier layer disposed between first transparent conductive layer and the electrochromic or counter electrode layer. In another embodiment, the electrochromic device can include means for preventing (1) the mobile ion from migrating into the first transparent conductive layer, (2) Ag from migrating into the electrochromic layer or counter electrode layer, or both (1) and (2). A process of forming an electrochromic device can include forming an electrochromic layer or a counter electrode layer over a substrate; forming a barrier layer; and forming a first transparent conductive layer over the substrate.
    • 电致变色器件可以包括衬底; 电致变色层或对电极层,所述电致变色层或对电极层位于所述衬底上并且包括可移动离子; 在衬底上的包括Ag的第一透明导电层。 在一个实施例中,电致变色装置可以包括设置在第一透明导电层和电致变色或反电极层之间的阻挡层。 在另一个实施方案中,电致变色装置可以包括用于防止(1)移动离子迁移到第一透明导电层中,(2)Ag迁移到电致变色层或反电极层中或者(1)和(2) )。 形成电致变色器件的过程可以包括在衬底上形成电致变色层或反电极层; 形成阻挡层; 并在衬底上形成第一透明导电层。
    • 29. 发明申请
    • ELECTROCHROMIC GLAZINGS
    • 电致变色釉
    • WO2017100536A1
    • 2017-06-15
    • PCT/US2016/065769
    • 2016-12-09
    • SAGE ELECTROCHROMICS, INC.
    • GREER, Bryan D.PODBELSKI, Louis J.SANDERS, Helen E.
    • G02F1/153G02F1/15
    • G02F1/155G02F1/153G02F2001/1555
    • A glazing can include a substrate having a viewable area contained within a boundary, and an electrochromic device coupled to the substrate. The electrochromic device can have a tintable area spaced apart from the boundary of the viewable area along at least 5% of the boundary. The tintable area can have a tintable surface area, A ED , the viewable area of the substrate has a surface area, A VA , and A ED can be less than A VA . A central portion of the viewable area can include a number of layers of material, a peripheral portion can include a number of layers of material, and the number of layers at the central portion can be greater than the number of layers at the peripheral portion.
    • 窗玻璃可以包括具有包含在边界内的可视区域的衬底,以及耦合到衬底的电致变色装置。 沿着至少5%的边界,电致变色装置可具有与可视区域的边界间隔开的可着色区域。 可着色区域可具有可着色表面区域AED,基板的可视区域具有表面积A VA和A ED D / >可以小于A VA 。 可视区域的中心部分可以包括多层材料,周边部分可以包括多层材料,并且中心部分处的层数可以大于周边部分处的层数。
    • 30. 发明申请
    • MULTIPLE BARRIER LAYER ENCAPSULATION STACK
    • 多个障碍层覆盖层
    • WO2016081514A1
    • 2016-05-26
    • PCT/US2015/061182
    • 2015-11-17
    • SAGE ELECTROCHROMICS, INC.
    • JAIN, Avanti, M.GIRON, Jean-Christophe
    • H01L21/56H01L23/28
    • H01L23/31B32B27/00B32B27/06B32B2307/50B32B2307/7242B32B2307/7244B32B2307/7246B32B2307/7248G02F2201/501H01L21/02057H01L23/28H01L23/29H01L23/291H01L23/293H01L23/3135
    • A process for encapsulating an apparatus to restrict environmental element permeation between the apparatus and an external environment includes applying multiple barrier layers to the apparatus and preceding each layer application with a separate cleaning of the presently-exposed apparatus surface, resulting in an apparatus which includes an encapsulation stack, where the encapsulation stack includes a multi-layer stack of barrier layers. Each separate cleaning removes particles from the presently-exposed apparatus surface, exposing gaps in the barrier layer formed by the particles, and the subsequently-applied barrier layer at least partially fills the gaps, so that a permeation pathway through the encapsulation stack via gap spaces is restricted. The quantity of barrier layers applied to form the stack can be based on a determined probability that a stack of the particular quantity of barrier layers is independent of at least a certain quantity of continuous permeation pathways through the stack.
    • 用于封装装置以限制装置和外部环境之间的环境因素渗透的装置的方法包括:在装置和在每个层应用之间施加多个阻挡层,对当前曝光的装置表面进行单独的清洁,得到包括 封装堆栈,其中封装堆栈包括多层阻挡层堆叠。 每个单独的清洁从当前暴露的设备表面去除颗粒,暴露由颗粒形成的阻挡层中的间隙,并且随后施加的阻挡层至少部分地填充间隙,使得穿过封装层的渗透途径经由间隙 被限制 施加以形成堆叠的阻挡层的量可以基于确定的特征量的阻挡层的堆叠与通过堆叠的至少一定量的连续渗透途径无关的概率。