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21. 发明申请

WO2009059031A2 PHOTOIMAGEABLE BRANCHED POLYMER 审中-公开
标题翻译：可光照分支聚合物
公开(公告)号：WO2009059031A2
公开(公告)日：2009-05-07
申请号：PCT/US2008081831
申请日：2008-10-30
申请人： BREWER SCIENCE INC , XU HAO , MERCADO RAMIL-MARCELO L , GUERRERO DOUGLAS J , MEADOR JIM D
发明人： XU HAO , MERCADO RAMIL-MARCELO L , GUERRERO DOUGLAS J , MEADOR JIM D
IPC分类号： C08G65/30 , C08G65/48 , C08J3/28 , G03F7/038 , G03F7/16
CPC分类号： G03F7/091 , C08L25/18 , Y10S430/151
摘要： Novel, developer-soluble anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a multi-functional acid reacted with a multi-functional vinyl ether to form a branched polymer or oligomer. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light and post-exposure baking, the cured polymers/oligomers will decrosslink and depolymerize, rendering the layer soluble in typical photoresist developing solutions (e.g., alkaline developers).
摘要翻译：提供了新颖的显影剂可溶的抗反射涂层组合物和使用这些组合物的方法。该组合物包含与多官能乙烯基醚反应形成支化聚合物或低聚物的多官能酸。在使用中，将组合物施加到基材上并热交联。在曝光和曝光后烘烤后，固化的聚合物/低聚物将发生解交联和解聚，使该层溶于典型的光致抗蚀剂显影溶液（例如碱性显影剂）中。

22. 发明申请

WO2009018217A3 NON-COVALENTLY CROSSLINKABLE MATERIALS FOR PHOTOLITHOGRAPHY PROCESSES 审中-公开
标题翻译：用于光刻过程的非共价交联材料
公开(公告)号：WO2009018217A3
公开(公告)日：2009-03-26
申请号：PCT/US2008071357
申请日：2008-07-28
申请人： BREWER SCIENCE INC , SULLIVAN DANIEL M , HUANG RUNHUI , NEEF CHARLES J , DAI JINHUA , SWOPE MICHAEL B
发明人： SULLIVAN DANIEL M , HUANG RUNHUI , NEEF CHARLES J , DAI JINHUA , SWOPE MICHAEL B
IPC分类号： G03F7/11 , C08F212/04 , C08F220/10 , C08F236/06 , G03F7/16
CPC分类号： G03F7/091 , C08F212/14 , C08F220/14 , C08F220/18 , C08F220/26 , C08F220/34 , C08F220/56 , C08F226/06 , G03F7/11 , Y10T428/31678 , Y10T428/31855 , Y10T428/31935
摘要： This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-covalent interactions allow for easier removal of these coatings than of covalcntly crosslinked materials. These types of materials are well-suited for trench and gap fill applications, as well as for anti-reflective coatings, spin-on carbon layers, and etch masks.
摘要翻译：本发明描述了用于平版印刷应用的非共价交联树脂涂料的组合物和方法。这些材料被设计成在涂覆之后经历改变，从而提供耐溶剂性，并且在某些材料的情况下同时具有水基溶解性。与共价交联材料相比，非共价相互作用可以更容易地去除这些涂层。这些类型的材料非常适合沟槽和间隙填充应用，以及抗反射涂层，旋涂碳层和蚀刻掩膜。

23. 发明申请

WO2007061559A3 PHOTOCURABLE, CONDUCTIVE, TRANSPARENT POLYMER COATINGS 审中-公开
标题翻译：可光，导电，透明聚合物涂料
公开(公告)号：WO2007061559A3
公开(公告)日：2008-12-11
申请号：PCT/US2006041599
申请日：2006-10-24
申请人： BREWER SCIENCE INC , ZHONG XING-FU
发明人： ZHONG XING-FU
IPC分类号： B32B27/36 , B05D1/40 , B05D3/02 , B05D5/12 , B32B17/10 , B32B27/00 , B32B27/08
CPC分类号： H01B1/127 , H01L51/0037 , Y10T428/31507 , Y10T428/31645 , Y10T428/31855 , Y10T428/31909
摘要： Photocurable, conductive, and transparent polymer coating compositions and methods of using the same are provided. The compositions include a photopolymer and an electrically conductive polymer dissolved or dispersed in a solvent system. Preferred photopolymers include water-miscible, multifunctional acrylates. Preferred electrically conductive polymers include ?oly(3 ,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT-PSS). The compositions preferably also contain a photoinitiator and may contain a water-immiscible acrylate and/or a surfactant. The compositions are applied to substrates and exposed to actinic radiation such as ultraviolet (UV) light to form a cured, durable, conductive, and transparent coating.
摘要翻译：提供光固化，导电和透明的聚合物涂料组合物及其使用方法。组合物包括溶解或分散在溶剂体系中的光聚合物和导电聚合物。优选的光聚合物包括水混溶性多官能丙烯酸酯。优选的导电聚合物包括（3,4-亚乙基二氧噻吩）/聚（苯乙烯磺酸盐）（PEDOT-PSS）。组合物优选还含有光引发剂并且可以含有不与水混溶的丙烯酸酯和/或表面活性剂。将组合物施加到基底上并暴露于光化辐射如紫外（UV）光下以形成固化的，耐久的，导电的和透明的涂层。

24. 发明申请

WO2008109198A1 ANTI-REFLECTIVE COATINGS USING VINYL ETHER CROSSLINKERS 审中-公开
标题翻译：使用乙烯基交联剂的抗反射涂层
公开(公告)号：WO2008109198A1
公开(公告)日：2008-09-12
申请号：PCT/US2008/051948
申请日：2008-01-24
申请人： BREWER SCIENCE INC. , GUERRERO, Douglas, J. , MERCADO, Ramil-Marcelo, L.
发明人： GUERRERO, Douglas, J. , MERCADO, Ramil-Marcelo, L.
IPC分类号： G03F7/11
CPC分类号： G03F7/091 , G03F7/0392
摘要： Novel, developer soluble anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker, a photoacid generator, and optionally a chromophore. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light (and optionally a post exposure bake), the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers). In one embodiment, the compositions can be used to form ion implant areas in microelectronic substrates.
摘要翻译：提供了新颖的开发可溶性抗反射涂层组合物和使用这些组合物的方法。组合物包含具有酸官能团并与交联剂，光致酸发生剂和任选的发色团一起溶解在溶剂体系中的聚合物和/或低聚物。优选的酸官能团是羧酸，而优选的交联剂是乙烯基醚交联剂。在使用中，将组合物施用于基材并进行热交联。在曝光（和任选地曝光后烘烤）时，固化的组合物将脱链，使其溶于典型的光致抗蚀剂显影溶液（例如碱性显影剂）中。在一个实施方案中，组合物可用于在微电子衬底中形成离子注入区域。

25. 发明申请

WO2008079582A1 CONTACT PLANARIZATION APPARATUS 审中-公开
标题翻译：联系平面设备
公开(公告)号：WO2008079582A1
公开(公告)日：2008-07-03
申请号：PCT/US2007/085772
申请日：2007-11-28
申请人： BREWER SCIENCE INC. , MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
发明人： MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
IPC分类号： H01L21/304
CPC分类号： G03F7/168 , H01L21/67092 , H01L21/67115
摘要： A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes a top pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.
摘要翻译：接触平面化装置包括下膜组件，上膜组件，差压组件和固化或回流组件。下膜组件支撑待平坦化的基底，并在压差组件的影响下将其偏向上膜组件。上膜组件在差压组件的影响下平坦化基板上的涂层，并且包括柔性片，其通过由差压组件施加的真空力被支撑在基底台上并在固化或回流组件之下。差压组件相对于彼此移动下部膜组件和上部膜组件，以通过施加真空和压力力使衬底上的涂层完全平坦化。差压组件包括位于上板的上表面上方的顶压室，位于下板下表面下方的底压室，以及通常位于上板的下表面和下片的上表面。

26. 发明申请

WO2006101902A3 DEPOSITION OF POLYMERIC MATERIALS AND PRECURSORS THEREFOR 审中-公开
标题翻译：聚合材料及其前身的沉积
公开(公告)号：WO2006101902A3
公开(公告)日：2007-03-22
申请号：PCT/US2006009347
申请日：2006-03-15
申请人： BREWER SCIENCE INC , SENKEVICH JOHN J
发明人： SENKEVICH JOHN J
IPC分类号： C23C16/00
CPC分类号： B05D1/60 , H01L21/312
摘要： Substituted paracyclophanes are particularly useful as precursors in the formation of a cross-linkable polymer on a deposition substrate such as an electronic device being processed. The paracyclophane precursor including a cross-linkable substituent such as an alkynyl is cracked at the phenyl linkages. The substrate is subjected to the*cracked precursor. As a result, an organic polymer is formed on the substrate. Cross-linking of the polymer through reaction, e.g. thermally induced reaction, of the cross-linkable substituents produces a thermally stable cross-linked polymer. The deposition of such cross-linked polymer is particularly useful for sealing ultra low k dielectric materials used in the damascene process in the production of integrated circuits. Alternatively the polymer is also advantageous as an adhesive in wafer-to-wafer bonding. Alternatively, the polymer is useful as a hardmask to replace silicon nitride and silicon carbide in the back-end-of-the-line processing of electronic devices.
摘要翻译：取代的副环己烷特别可用作在沉积基底上形成可交联聚合物的前体，例如正在加工的电子器件。包括可交联的取代基如炔基的对环芳烃前体在苯基键处裂解。使基板经受*裂纹前体。结果，在基板上形成有机聚合物。通过反应交联聚合物，例如，可交联取代基的热诱导反应产生热稳定的交联聚合物。这种交联聚合物的沉积特别可用于密封用于集成电路生产中的镶嵌工艺中使用的超低k电介质材料。或者，聚合物在晶片到晶片结合中也是有利的。或者，聚合物可用作硬掩模以在电子设备的后端处理中替代氮化硅和碳化硅。

27. 发明申请

WO2005029556A3 METHOD OF FILLING STRUCTURES FOR FORMING VIA-FIRST DUAL DAMASCENE INTERCONNECTS 审中-公开
公开(公告)号：WO2005029556A3
公开(公告)日：2005-03-31
申请号：PCT/US2004/030816
申请日：2004-09-17
申请人： BREWER SCIENCE INC. , BRAKENSIEK, Nickolas, L. , WASHBURN, Carlton, A. , MURPHY, Earnest, C.
发明人： BRAKENSIEK, Nickolas, L. , WASHBURN, Carlton, A. , MURPHY, Earnest, C.
IPC分类号： H01L27/10 , H01L29/40 , H01L21/4763
摘要： A method of forming via-first, dual damascene interconnect structures by using a gapfilling, bottom anti-reflective coating material whose thickness is easily controlled by a solvent is provided. After application to a substrate, the bottom anti-reflective coating is partially cured by baking at a low temperature. Next, a solvent is dispensed over the coated wafer and allowed to contact the coating for a period of time. The solvent removes the bottom anti-reflective coating at a rate controlled by the bottom anti-reflective coating's bake temperature and the solvent contact time to yield a bottom anti-reflective coating thickness that is thin, while maintaining optimum light-absorbing properties on the dielectric stack. In another possible application of this method, sufficient bottom anti-reflective coating may be removed to only partially fill the vias in order to protect the bottoms of the vias during subsequent processing. The solvent is removed from the wafer, and the bottom anti-reflective coating is cured completely by a high-temperature bake. The wafer is then coated with photoresist, and the trench pattern exposed. The bottom anti-reflective coating material used maintains a greater planar topography for trench patterning, eliminates the need for an inorganic light-absorbing material layer on the top of the dielectric stack, protects the bottom of the vias during the trench etch, and prevents the formation of fencing problems by using a solvent to control the thickness in the vias.

28. 发明申请

WO2004036311A2 ANTI-REFLECTIVE COMPOSITIONS COMPRISING TRIAZINE COMPOUNDS 审中-公开
标题翻译：包含TRIAZINE化合物的抗反射组合物
公开(公告)号：WO2004036311A2
公开(公告)日：2004-04-29
申请号：PCT/US2003/029819
申请日：2003-09-19
申请人： BREWER SCIENCE, INC.
发明人： ENOMOTO, Tomoyuki , NAKAYAMA, Keisuke , PULIGADDA, Rama
IPC分类号： G03F
CPC分类号： G03F7/091 , Y10T428/31938
摘要： The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or alkoxymehyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.
摘要翻译：本发明涉及一种抗反射涂料组合物，其特征在于包含由具有至少两个氮原子取代羟甲基和/或烷氧基甲基的三嗪化合物制成的树脂，以及光吸收化合物和/或光吸收树脂。本发明提供了一种用于抗反射涂层的抗反射涂层组合物，其在制备半导体器件时用于光刻工艺的光具有高的光吸收特性，显示出高的防反射光效果，在较薄的膜厚度下使用并且与光致抗蚀剂层相比具有更大的干蚀刻速率。

29. 发明申请

WO2004001502A1 DEVELOPER-SOLUBLE METAL ALKOXIDE COATINGS FOR MICROELECTRONIC APPLICATIONS 审中-公开
标题翻译：用于微电子应用的开发可溶性金属烷基氧化物涂料
公开(公告)号：WO2004001502A1
公开(公告)日：2003-12-31
申请号：PCT/US2003/019457
申请日：2003-06-18
申请人： BREWER SCIENCE, INC.
发明人： KRISHNAMURTHY, Vandana , NEEF, Charles, J. , SNOOK, Juliet, A., M.
IPC分类号： G03C1/735
CPC分类号： C08G79/10 , C08G79/00 , C08L85/00 , G03F7/091 , Y10S430/106 , Y10S430/11 , Y10S430/111 , Y10S430/151
摘要： Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers of the composition include recurring units having the formula (I), where X is a light-attenuating moiety, M is a metal, and each R is individually selected from the group consisting of hydrogen, alkyls, aryls, alkoxys, and phenoxys. The resulting compositions are spin bowl compatible (i.e., they do not crosslink prior to the bake stages of the microlithographic processes or during storage at room temperature), are wet developable, and have superior optical properties.
摘要翻译：提供了抗反射组合物和使用这些组合物形成电路的方法。组合物包含溶解或分散在溶剂体系中的聚合物。在优选的实施方案中，组合物的聚合物包括具有式（I）的重复单元，其中X是光衰减部分，M是金属，并且每个R各自选自氢，烷基，芳基，烷氧基和苯氧基。所得到的组合物是旋转碗相容的（即，它们在微光刻工艺的烘烤阶段之前或在室温下储存期间不交联）是湿显影的并且具有优异的光学性能。

30. 发明申请

WO2004000928A3 SPIN BOWL COMPATIBLE POLYAMIC ACIDS/IMIDES AS WET DEVELOPABLE POLYMER BINDERS FOR ANTI-REFLECTIVE COATINGS 审中-公开
公开(公告)号：WO2004000928A3
公开(公告)日：2003-12-31
申请号：PCT/US2003/019456
申请日：2003-06-18
申请人： BREWER SCIENCE, INC.
发明人： COX, Robert, Christian , NEEF, Charles, J.
IPC分类号： G03F7/004
摘要： Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers of the composition include recurring monomers having the formulas (1) and (2) where: (1) each R is individually selected from the group consisting of hydrogen, -OH, aliphatics, and phenyls; and (2) L is selected from the group consisting of -SO 2 - and -CR' 2 -, where each R' is individually selected from the group consisting of hydrogen, aliphatics, phenyls, and -CX 3 , where each X is individually selected from the group consisting of the halogens. The resulting compositions are spin bowl compatible (i.e., they do not crosslink prior to the bake stages of the microlithographic processes or during storage at room temperature), are wet developable, and have superior optical properties.

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