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    • 11. 发明申请
    • TAPERED SOIL MOISTURE SENSOR ARRANGEMENT AND METHOD OF INSTALLATION
    • 带状土壤水分传感器布置和安装方法
    • WO2014165910A1
    • 2014-10-16
    • PCT/AU2014/000383
    • 2014-04-10
    • SENTEK PTY LTD.
    • BUSS, Peter
    • G01N27/22
    • G01N27/223G01N33/246
    • The field of the invention is soil sensors and in particular the sensor clement housing for the placement of a soil sensor housing in the soil. The housing having a body adapted for housing a soil moisture sensor arrangement wherein sensors are arranged within and along the length of the housing, the body having a head end and an inserted end, the body shaped so that the maximum outer diameter of the inserted end is smaller than the maximum outer diameter of the head end of the body, and the body adapted to be inserted into the prepared opening such that the outer surface of the body is in conformance with the soil forming the prepared opening along the full length of the housing. The housing including, at least one capacitive sensor, where a first capacitive element of the sensor has a maximum outer diameter, arid a second capacitive element of the sensor has a maximum outer diameter smaller than the maximum outer diameter of the first capacitive element and the second capacitive element being spaced longitudinally along the housing from the first capacitive element and located closer to the inserted end than the first capacitive clement.
    • 本发明的领域是土壤传感器,特别是用于将土壤传感器壳体放置在土壤中的传感器元件壳体。 壳体具有适于容纳土壤湿度传感器装置的主体,其中传感器布置在壳体的长度内并且沿壳体的长度布置,主体具有头端和插入端,该主体成形为使得插入端的最大外径 小于主体的头端的最大外径,并且该主体适于插入准备好的开口中,使得主体的外表面与形成沿着全部长度的所述准备开口的土壤一致 住房。 壳体包括至少一个电容式传感器,其中传感器的第一电容元件具有最大外径,传感器的第二电容元件具有小于第一电容元件的最大外径的最大外径, 第二电容元件沿着壳体从第一电容元件纵向间隔开并且比第一电容元件更靠近插入端。
    • 15. 发明申请
    • SENSOR ARRAY WITH FIXED OUTPUT
    • 带固定输出的传感器阵列
    • WO2014108598A1
    • 2014-07-17
    • PCT/FI2013/051135
    • 2013-12-04
    • NOKIA CORPORATION
    • ASTLEY, MichaelBORINI, StefanoKIVIOJA, JaniRYHÄNEN, TeuvoSPIGONE, ElisabettaWEI, DiWHITE, Richard
    • G01R17/02G01D3/024H03K17/00G01R27/02
    • G01R27/2605G01N27/223G01R27/02
    • An apparatus comprising a sensor array,configured to produce an array output value in response to an environmental stimulus, and a controller, the sensor array comprising a plurality of sensors and a common output terminal connected to the respective outputs of the sensors, each sensor having first and second electrodes configured to output a respective sensor output value in a particular environment based on the areas of the first and second electrodes and/or the spacing there between, the controller configured to control which of the sensors are connected to the common output terminal using respective switches to vary the effective area and/or spacing of the sensor array such that the array output value at the common output terminal, based on the contribution of the respective sensor output values of the connected sensors, is held at a reference value.
    • 一种包括响应于环境刺激而产生阵列输出值的传感器阵列和控制器的传感器阵列,所述传感器阵列包括多个传感器和连接到所述传感器的相应输出端的公共输出端子,每个传感器具有 第一和第二电极被配置为基于第一和第二电极的面积和/或其间的间隔在特定环境中输出相应的传感器输出值,所述控制器被配置为控制哪个传感器连接到公共输出端子 使用相应的开关来改变传感器阵列的有效面积和/或间隔,使得基于所连接的传感器的相应传感器输出值的贡献,公共输出端子处的阵列输出值被保持在参考值。
    • 16. 发明申请
    • METHODS AND SYSTEMS FOR HUMIDITY AND PRESSURE SENSOR OVERLAY INTEGRATION WITH ELECTRONICS
    • 湿度和压力传感器与电子集成的方法与系统
    • WO2014066978A1
    • 2014-05-08
    • PCT/CA2013/000909
    • 2013-10-29
    • MEMS-VISION INTERNATIONAL INC.
    • EL-GAMAL, MouradCICEK, Paul-VaheNABKI, Frédéric
    • G01N27/22G01D5/24G01L21/12
    • G01N27/223G01L9/12G01L19/0092
    • MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ability to recover from condensation and / or saturation, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of ceramics, such as SiC, into such MEMS sensors and the integration of these MEMS sensors with silicon CMOS electronics, to effectively harness the benefits of ceramics and MEMS sensors including reference structures, electrical heaters, electrical interconnections, and multiple measurands. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.
    • 基于MEMS的传感器,特别是电容传感器,潜在地可以解决用户的关键考虑因素,包括精度,重复性,长期稳定性,从冷凝和/或饱和度恢复的能力,易于校准,对化学和物理污染物的抵抗力,尺寸,包装, 和成本效益。 因此,利用允许诸如SiC的陶瓷可制造性和集成到MEMS传感器中的MEMS工艺以及这些MEMS传感器与硅CMOS电子器件集成将有利于有效利用陶瓷和MEMS传感器的优点,包括 参考结构,电加热器,电气互连和多个被测量。 本发明的实施例提供可以直接在硅CMOS电子器件上方实现的电容传感器和MEMS元件。