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    • 13. 发明申请
    • ALL POLYMER PROCESS COMPATIBLE OPTICAL POLYMER MATERIAL
    • 所有聚合物工艺兼容光学聚合物材料
    • WO0236647A3
    • 2002-08-15
    • PCT/US0131574
    • 2001-10-09
    • CORNING INC
    • CHALK JULIE ASHUSTACK PAUL JWANG JIANGUO JOHN
    • C08F2/46C08F220/22C08F222/40G02B1/04G02B6/12G02B6/122G02B6/124G02B6/138
    • G02B6/138C08F220/22C08F222/40G02B1/045G02B6/12007G02B6/1221G02B6/124G02B2006/12069G02B2006/121C08L33/16C08L35/00C08F2220/325
    • A terploymer containing N-halogenated phenyl maleimide units or N-halogenated phenyl bismaleimide units, one or more second units selected from the group consisting of halogenated acrylates, halogenated styrenes, halogenated vinyl ethers, halogenated olefins, halogenated vinyl isocyanates, halogenated N-vinyl amides, halogenated allyls, halogenated propenyl ethers, halogenated methacrylates, halogenated maleates, halogenated itaconates, and halogenated crotonates and one or more third units comprising a monomer containing both a free radically polymerizable group and cationic ring opening polymerizable group, is prepared by radical co-polymerization. The resulting linear plastic polymer group contains a UV, or e-beam curable ring opening polymerizable functional groups. Such plastic polymer is then blended with cationic photoiniator and processed into optical waveguide structures using a hot embossing technique. The terpolymer is subsequently crosslinked by exposure to UV or E-beam radiation and thermal post-bake. Alternatively, in a direct contact photolithographic process, the terpolymer is mixed with cationic photoinitiator, and deposited or coated onto a substrate. Then optical waveguide structures are formed by exposing the terpolymer to UV or E-beam radiation through a photomask. After thermal postbake, the exposed area of the photopolymer is chemically crosslinked. The unexposed area is washed away with solvent. The terpolymer is fully compatible with polymer processes such as micromolding, hot-embossing, coating and direct contact photolithography processes to fabricate polymer waveguide devices. The crosslinked polymer waveguides have low optical loss, good thermal and environmental stability and low coefficient of thermal expansion.
    • 包含N-卤代苯基马来酰亚胺单元或N-卤代苯基双马来酰亚胺单元的一个或多个第二单元,选自卤化丙烯酸酯,卤代苯乙烯,卤代乙烯基醚,卤代烯烃,卤代乙烯基异氰酸酯,卤代N-乙烯基酰胺 卤代烯丙基醚,卤代丙烯基醚,卤代甲基丙烯酸酯,卤代马来酸酯,卤代衣康酸酯和卤代巴豆酸酯以及一种或多种含有含有可自由基聚合基团和阳离子可开环聚合基团的单体的第三单元通过自由基共聚 。 所得的线性塑料聚合物基团含有UV或电子束可固化的开环聚合官能团。 然后将这种塑料聚合物与阳离子光合剂混合,并使用热压花技术加工成光波导结构。 三元共聚物随后通过暴露于UV或电子束辐射和热后烘烤而交联。 或者,在直接接触光刻工艺中,将三元共聚物与阳离子光引发剂混合,并沉积或涂覆在基材上。 然后,通过将光敏掩模暴露于紫外线或电子束辐射,形成光波导结构。 在热后烘烤之后,光聚合物的暴露面积被化学交联。 用溶剂冲洗未曝光区域。 三元共聚物与聚合物工艺完全相容,例如微胶印,热压印,涂覆和直接接触光刻工艺以制造聚合物波导器件。 交联聚合物波导具有低光损耗,良好的热和环境稳定性和低的热膨胀系数。