专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

111. 发明申请

WO2011146697A3 HIGH STRENGTH DIAMOND-SIC COMPACTS AND METHOD OF MAKING SAME 审中-公开
标题翻译：高强度金刚石复合材料及其制造方法
公开(公告)号：WO2011146697A3
公开(公告)日：2012-05-18
申请号：PCT/US2011037119
申请日：2011-05-19
申请人： DIAMOND INNOVATIONS INC , EASLEY THOMAS CHARLES
发明人： EASLEY THOMAS CHARLES
IPC分类号： C04B35/52 , B01J3/06 , C04B35/63 , C04B35/645
CPC分类号： C04B35/52 , C04B35/6316 , C04B35/645 , C04B2235/3826 , C04B2235/386 , C04B2235/3865 , C04B2235/3873 , C04B2235/40 , C04B2235/404 , C04B2235/408 , C04B2235/427 , C04B2235/428 , C04B2235/5436 , C04B2235/5472 , C04B2235/5481 , C04B2235/616 , C04B2235/656 , C04B2235/6567 , C04B2235/6587 , C04B2235/721 , C04B2235/728 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/96
摘要： The present disclosure provides a silicon carbide (SiC) bonded diamond compact having less than about 2 weight % unreacted Si and less than about 1 weight % graphite, as well as processes for making the same.
摘要翻译：本公开内容提供了具有小于约2重量％的未反应的Si和小于约1重量％的石墨的碳化硅（SiC）结合的金刚石复合体，以及其制备方法。

112. 发明申请

WO2011146697A2 HIGH STRENGTH DIAMOND-SIC COMPACTS AND METHOD OF MAKING SAME 审中-公开
标题翻译：高强度金刚石复合材料及其制造方法
公开(公告)号：WO2011146697A2
公开(公告)日：2011-11-24
申请号：PCT/US2011/037119
申请日：2011-05-19
申请人： DIAMOND INNOVATIONS, INC. , EASLEY, Thomas, Charles
发明人： EASLEY, Thomas, Charles
IPC分类号： B24D3/04 , B01J3/06 , B24D18/00
CPC分类号： C04B35/52 , C04B35/6316 , C04B35/645 , C04B2235/3826 , C04B2235/386 , C04B2235/3865 , C04B2235/3873 , C04B2235/40 , C04B2235/404 , C04B2235/408 , C04B2235/427 , C04B2235/428 , C04B2235/5436 , C04B2235/5472 , C04B2235/5481 , C04B2235/616 , C04B2235/656 , C04B2235/6567 , C04B2235/6587 , C04B2235/721 , C04B2235/728 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/96
摘要： The present disclosure provides a silicon carbide (SiC) bonded diamond compact having less than about 2 weight % unreacted Si and less than about 1 weight % graphite, as well as processes for making the same.
摘要翻译：本公开提供了具有小于约2重量％的未反应的Si和小于约1重量％的石墨的碳化硅（SiC）结合的金刚石复合体，以及其制备方法。

113. 发明申请

WO2011084864A3 BLANK FOR THE MANUFACTURE OF A MACHINING TOOL AND METHOD OF USE OF A BLANK FOR THE MANUFACTURE OF A MACHINING TOOL 审中-公开
公开(公告)号：WO2011084864A3
公开(公告)日：2011-07-14
申请号：PCT/US2010/062475
申请日：2010-12-30
申请人： DIAMOND INNOVATIONS, INC. , SINGH, Anshul , HAAR, Andreas
发明人： SINGH, Anshul , HAAR, Andreas
IPC分类号： B23P15/28 , B22F5/10 , C22C26/00
摘要： A blank (2) for use in forming a machining tool having a body (4) with at least one end face (5) and at least two recesses (6, 10) formed in the end face including a first recess (6) wherein the first recess extends from the end face at an angle of about 15° to about 60° and a second recess (10) continuing from the first recess extending from the end face at an angle of about 40° to about 90°.

114. 发明申请

WO2011084864A2 MACHINING TOOL BLANK 审中-公开
标题翻译：加工工具空白
公开(公告)号：WO2011084864A2
公开(公告)日：2011-07-14
申请号：PCT/US2010062475
申请日：2010-12-30
申请人： DIAMOND INNOVATIONS INC , SINGH ANSHUL , HAAR ANDREAS
发明人： SINGH ANSHUL , HAAR ANDREAS
IPC分类号： B23P15/28 , B22F5/10 , C22C26/00
CPC分类号： B23P15/28 , B22F7/062 , C22C26/00
摘要： A blank for use in forming a machining tool having a body with at least one end face and at least two recesses formed in the end face including a first recess wherein the first recess extends from the end face at an angle of about 15° to about 60° and a second recess continuing from the first recess extending from the end face at an angle of about 40° to about 90°.
摘要翻译：一种坯件，用于形成具有主体的机械加工工具，所述主体具有至少一个端面，并且在所述端面中形成有至少两个凹部，所述凹部包括第一凹部，其中所述第一凹部以所述端面从所述端面以大约15°的角度延伸到约 60°的第二凹部和从端面以约40°至约90°的角度延伸的第一凹部的第二凹部。

115. 发明申请

WO2010083015A1 RADIAL TOOL WITH SUPERHARD CUTTING SURFACE 审中-公开
标题翻译：具有超级切割表面的径向工具
公开(公告)号：WO2010083015A1
公开(公告)日：2010-07-22
申请号：PCT/US2009/069764
申请日：2009-12-30
申请人： DIAMOND INNOVATIONS, INC. , SANDVIK INTELLECTUAL PROPERTY AB , LUCEK, John, W. , OLWERT, Adrienne , MONYAK, Kenneth , CLAESSON, Björn
发明人： LUCEK, John, W. , OLWERT, Adrienne , MONYAK, Kenneth , CLAESSON, Björn
IPC分类号： E21C35/183
CPC分类号： E21C35/183 , E21C35/1936 , E21C2035/1809 , Y10T156/10
摘要： A non-rotating mining cutter pick (10) has a shank portion (12) with a non-circular cross-section, a head portion (16) including a tip region (28) distal from the shank portion (12), a shoulder portion (14) separating the shank portion (12) from the head portion (16), and a cutting insert (30) mounted at a front end (32) of the tip region (28). The cutting insert (30) includes a body (34) formed of tungsten carbide and an element (36) formed of a superhard material, such as PCD or other material having a prescribed knoop hardness. At least a portion of a first surface (40) of the element (36) is exposed on a cutting surface (38) of the cutting insert (30), which improves wear properties of the mining cutter pick (10). The element (36) is fused to the body (34) of the cutting insert (30), preferably in a high pressure - high temperature (HPHT) process. A method of manufacture and a cutting machine incorporating the non-rotating mining cutter pick on the rotatable element are also disclosed. ??
摘要翻译：非旋转采矿刀具（10）具有具有非圆形横截面的柄部分（12），包括远离柄部分（12）的尖端区域（28）的头部分（16），肩部将所述柄部分（12）与所述头部（16）分离的部分（14）以及安装在所述尖端区域（28）的前端（32）处的切削刀片（30）。切削刀片（30）包括由碳化钨形成的主体（34）和由超硬材料形成的元件（36），所述超硬材料例如具有规定的硬度的PCD或其他材料。元件（36）的第一表面（40）的至少一部分露出在切削刀片（30）的切割表面（38）上，这改善了采矿刀具（10）的磨损性能。元件（36）熔合到切削刀片（30）的主体（34）上，优选地在高压 - 高温（HPHT）工艺中。还公开了一种将可旋转元件上的非旋转采矿刀具结合在一起的制造方法和切割机。 ??

116. 发明申请

WO2010080153A1 AFFECTING THE THERMOELECTRIC FIGURE OF MERIT (ZT) BY HIGH PRESSURE, HIGH TEMPERATURE SINTERING 审中-公开
标题翻译：通过高压，高温烧结影响MERIT（ZT）的热电影图
公开(公告)号：WO2010080153A1
公开(公告)日：2010-07-15
申请号：PCT/US2009/030569
申请日：2009-01-09
申请人： DIAMOND INNOVATIONS, INC. , MALIK, Abds-sami , DONG, Yongkwan , DISALVO, Francis, J.
发明人： MALIK, Abds-sami , DONG, Yongkwan , DISALVO, Francis, J.
IPC分类号： H01L35/34 , B01J3/06
CPC分类号： H01L31/18 , B01J3/06 , B01J2203/06 , C01B19/007 , H01L35/16 , H01L35/34
摘要： A method for increasing the ZT of a semiconductor, involves creating a reaction cell including a semiconductor in a pressure-transmitting medium, exposing the reaction cell to elevated pressure and elevated temperature for a time sufficient to increase the ZT of the semiconductor, and recovering the semiconductor with an increased ZT.
摘要翻译：一种用于增加半导体的ZT的方法，包括在压力传递介质中产生包括半导体的反应池，将反应池暴露于升高的压力和升高的温度足以增加半导体的ZT，并回收半导体具有增加的ZT。

117. 发明申请

WO2010033575A2 ABRASIVE PARTICLES HAVING A UNIQUE MORPHOLOGY 审中-公开
标题翻译：具有独特形态的磨料颗粒
公开(公告)号：WO2010033575A2
公开(公告)日：2010-03-25
申请号：PCT/US2009057133
申请日：2009-09-16
申请人： DUMM TIMOTHY F , NG KAN-YIN , DIAMOND INNOVATIONS INC
发明人： DUMM TIMOTHY F , NG KAN-YIN
IPC分类号： C09K3/14 , C30B29/04 , C30B33/08
CPC分类号： C30B33/08 , C09K3/1409 , C09K3/1445 , C09K3/1463 , C30B29/04
摘要： An abrasive particle having an irregular surface, wherein the surface roughness of the particle is less than about 0.95. A method for producing modified abrasive particles, including providing a plurality of abrasive particles, providing a reactive coating on said particles, heating said coated particles; and recovering modified abrasive particles.
摘要翻译：具有不规则表面的磨料颗粒，其中颗粒的表面粗糙度小于约0.95。一种生产改性磨料颗粒的方法，包括提供多个研磨颗粒，在所述颗粒上提供反应性涂层，加热所述涂覆颗粒; 并回收改性的磨料颗粒。

118. 发明申请

WO2008092093B1 GRADED DRILLING CUTTERS 审中-公开
标题翻译：分级钻头切割机
公开(公告)号：WO2008092093B1
公开(公告)日：2008-11-06
申请号：PCT/US2008052076
申请日：2008-01-25
申请人： DIAMOND INNOVATIONS INC , WAN SHAN
发明人： WAN SHAN
IPC分类号： B24D3/06 , B24D18/00
CPC分类号： B24D3/06 , B24D18/0009
摘要： In an embodiment, an abrasive compact includes ultra-hard particles which are sintered, bonded, or otherwise consolidated into a solid body. The compact also includes various physical characteristics having a continuous gradient, a multiaxial gradient, or multiple independent gradients.
摘要翻译：在一个实施方案中，研磨成型体包括烧结，结合或以其他方式固结成固体的超硬颗粒。紧凑件还包括具有连续梯度，多轴梯度或多个独立梯度的各种物理特性。

119. 发明申请

WO2008092093A3 GRADED DRILLING CUTTERS 审中-公开
标题翻译：分级钻孔刀
公开(公告)号：WO2008092093A3
公开(公告)日：2008-09-12
申请号：PCT/US2008052076
申请日：2008-01-25
申请人： DIAMOND INNOVATIONS INC , WAN SHAN
发明人： WAN SHAN
IPC分类号： B24D3/06 , B24D18/00
CPC分类号： B24D3/06 , B24D18/0009
摘要： In an embodiment, an abrasive compact includes ultra-hard particles which are sintered, bonded, or otherwise consolidated into a solid body. The compact also includes various physical characteristics having a continuous gradient, a multiaxial gradient, or multiple independent gradients.
摘要翻译：在一个实施例中，研磨压块包括烧结，结合或以其他方式固结成固体的超硬颗粒。压缩机还包括具有连续梯度，多轴梯度或多个独立梯度的各种物理特性。

120. 发明申请

WO2008092093A2 GRADED DRILLING CUTTERS 审中-公开
标题翻译：分级钻孔刀
公开(公告)号：WO2008092093A2
公开(公告)日：2008-07-31
申请号：PCT/US2008/052076
申请日：2008-01-25
申请人： DIAMOND INNOVATIONS, INC. , WAN, Shan
发明人： WAN, Shan
IPC分类号： B24D3/06 , B24D18/00
CPC分类号： B24D3/06 , B24D18/0009
摘要： In an embodiment, an abrasive compact includes ultra-hard particles which are sintered, bonded, or otherwise consolidated into a solid body. The compact also includes various physical characteristics having a continuous gradient, a multiaxial gradient, or multiple independent gradients.
摘要翻译：在一个实施例中，研磨压块包括烧结，结合或以其他方式固结成固体的超硬颗粒。该压缩机还包括具有连续梯度，多轴梯度或多个独立梯度的各种物理特性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式