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101. 发明申请

WO2007038536A2 IN MOLD MANUFACTURING OF AN OBJECT COMPRISING A FUNCTIONAL ELEMENT 审中-公开
标题翻译：包含功能元件的对象的模具制造
公开(公告)号：WO2007038536A2
公开(公告)日：2007-04-05
申请号：PCT/US2006/037531
申请日：2006-09-25
申请人： SIPIX IMAGING, INC. , LIAO, Chih-Yuan , HO, Andrew
发明人： LIAO, Chih-Yuan , HO, Andrew
IPC分类号： B29C45/00
CPC分类号： B29C45/14778 , B29C43/18 , B29C43/20 , B29C45/14811 , B29C45/14827 , B29C49/20 , B29C51/12 , B29K2033/20 , B29K2077/10 , B29K2715/006 , B29L2031/3061 , H01L21/565 , H01L2924/0002 , H05K1/0284 , H05K1/0393 , H05K3/0058 , H05K3/20 , H05K3/386 , H05K2201/09118 , H05K2203/1327 , H01L2924/00
摘要： This invention relates to an object having a functional element embedded in its top surface and processes for its manufacturing. The object is in general formed by molding, stamping, lamination or a combination thereof. The functional element is includes any electrical or mechanical elements that are capable of performing a function.
摘要翻译：本发明涉及具有嵌入在其顶表面中的功能元件的物体及其制造方法。该目的通常通过模制，冲压，层压或其组合形成。功能元件包括能够执行功能的任何电气或机械元件。

102. 发明申请

WO2007027604A1 POLYESTER FLEX CIRCUIT CONSTRUCTIONS AND FABRICATION METHODS FOR INK-RESISTANT FLEX CIRCUITS USED IN INK JET PRINTING 审中-公开
标题翻译：喷墨打印机中使用的耐冲击电缆的聚酯柔性电路结构和制造方法
公开(公告)号：WO2007027604A1
公开(公告)日：2007-03-08
申请号：PCT/US2006/033527
申请日：2006-08-29
申请人： INNOVEX, INC. , HAYDEN, Terry, F. , MCCLURE, Daniel, F. , JONES, Matthew, P. , LOFTIS, Robert, E.
发明人： HAYDEN, Terry, F. , MCCLURE, Daniel, F. , JONES, Matthew, P. , LOFTIS, Robert, E.
IPC分类号： H05K1/00 , H05K1/03 , H05K1/14 , H05K3/00 , H05K3/36 , H05K3/46
CPC分类号： H05K1/0326 , B41J2/14072 , H05K1/0393 , H05K3/0097 , H05K3/281 , H05K2201/0145 , H05K2201/0394 , H05K2203/065 , H05K2203/1545
摘要： Flex circuits for use in ink jet printers. In particular, flex circuits for use in ink jet printers that include a polyester material layer supporting a plurality of metal conductors, with the polyester material being a material suitable for use in an ink environment with lower ink permeability and low moisture and ink absorption than polyimide (PI) material. The polyester layer having low ink permeability and moisture and ink absorption to prevent: catastrophic "ink shorting of conductors" failures; adhesion failures; corrosion failures by direct ink contact with the conductors; and material degradation failures that may result if any of the materials are degraded by or react with the ink. Preferably, the polyester material is polyethylene naphthalate (PEN). The polyester base layer is suitable for use in many major flex circuit construction types, including: both adhesive-less and adhesive-based circuits; and one-metal and two-metal layer circuits. Also, a method of producing an improved splice in a continuous Tab Automated Bonding (TAB) style strip of circuits, using a suitable polymer material layer, that is stronger per area than other splices.
摘要翻译：用于喷墨打印机的柔性电路。特别地，用于喷墨打印机的柔性电路，其包括支撑多个金属导体的聚酯材料层，其中聚酯材料是适合用于油墨环境中的材料，其具有较低的油墨渗透性和比聚酰亚胺低的水分和油墨吸收（PI）材料。聚酯层具有低油墨渗透性和水分和油墨吸收，防止：导致“油墨短路”故障; 粘连失效; 通过直接油墨与导体接触的腐蚀失效; 以及如果任何材料被油墨降解或与油墨反应可能导致的材料退化故障。优选地，聚酯材料是聚萘二甲酸乙二醇酯（PEN）。聚酯基层适用于许多主要的柔性电路结构类型，包括：无粘合剂和基于粘合剂的电路; 和一金属和二金属层电路。另外，使用合适的聚合物材料层在连续的Tab Automated Bonding（TAB）形式的电路条中产生改进的接头的方法，每个面积比其它接头更强。

103. 发明申请

WO2007009513A1 VERFAHREN ZUM AUFBRINGEN VON ELEKTRISCHEN LEITERSTRUKTUREN AUF EIN ZIELBAUTEIL AUS KUNSTSTOFF 审中-公开
标题翻译：申请的程序结构的电动云台塑料的目标组件中
公开(公告)号：WO2007009513A1
公开(公告)日：2007-01-25
申请号：PCT/EP2006/003250
申请日：2006-04-10
申请人： HIRSCHMANN CAR COMMUNICATION GMBH , PFLETSCHINGER, Markus , SCHWARZ, Bernd , KRÜGER, Jan , PETERSEN, Ingmar
发明人： PFLETSCHINGER, Markus , SCHWARZ, Bernd , KRÜGER, Jan , PETERSEN, Ingmar
IPC分类号： H01B13/012 , B60R16/02
CPC分类号： H05K3/0058 , B60R16/0207 , H01B13/01254 , H05K1/0393 , H05K2203/1327 , H05K2203/1366 , Y10T428/12028
摘要： Die Erfindung betrifft ein Verfahren zum Aufbringen von elektrischen Leiterstrukturen (1) in oder auf ein Zielbauteil (10) aus Kunststoff, wobei erfindungsgemäss vorgesehen ist, dass ein Trägermedium, auf oder in dem die Leiterstrukturen (1) dauerhaft angeordnet sind, in ein Formteil (3, 8) eingelegt werden und das Formteil (3, 8) mit einem formbaren Kunststoffmaterial aufgefüllt wird, wobei nach dem Ausformen des Kunststoffmaterials das Zielbauteil (9) mit den Leiterstrukturen (1) dem Formteil (3, 8) entnommen wird.
摘要翻译：本发明涉及一种方法，用于（1）中或由塑料制成的对象部件（10）上施加电导体结构，根据它提供了本发明的是其上或其中的载体介质中的导体图案（1），设置永久（在模制 3，8）被插入和模制部分（3,8）中填充有可模制塑料材料，其中所述目标成分（9）（塑料材料的与所述导体结构1）的模制零件（3成形后，8）被去除。

104. 发明申请

WO2007008992A2 APPARATUS AND METHODS FOR CONTINUOUSLY DEPOSITING A PATTERN OF MATERIAL ONTO A SUBSTRATE 审中-公开
标题翻译：将材料图案连续沉积到基材上的装置和方法
公开(公告)号：WO2007008992A2
公开(公告)日：2007-01-18
申请号：PCT/US2006027063
申请日：2006-07-11
申请人： 3M INNOVATIVE PROPERTIES CO
发明人： MCCLURE DONALD J , TOKIE JEFFREY H , CARLSON DANIEL H , DOBBS JAMES N , STRAND JOHN T , SWANSON RONALD P
CPC分类号： H05K3/143 , B41F15/0836 , B41P2215/12 , C23C14/042 , C23C14/562 , H05K1/0393 , H05K2203/0134 , H05K2203/1545
摘要： A pattern of material is continuously deposited onto a substrate. The substrate and a mask are continuously brought together over a portion of a drum where a deposition source emits material. The mask includes apertures that form a pattern, and the material from the deposition source passes through the pattern of the mask and collects onto the substrate to form the pattern of material. The elongation and the transverse position of the substrate and the mask may be controlled. Pattern elements of the substrate and of the mask may be sensed in order to adjust the elongation and/or the transverse position of the substrate and/or mask to maintain a precise registration. Furthermore, the apertures may have a least dimension on the order of 100 microns or less to thereby create features on the substrate having least dimensions on the order of 100 microns or less.
摘要翻译：材料的图案被连续沉积在基底上。衬底和掩模在沉积源发射材料的鼓的一部分上连续地连在一起。掩模包括形成图案的孔，并且来自沉积源的材料穿过掩模的图案并收集到基底上以形成材料图案。可以控制基材和掩模的伸长率和横向位置。可以感测衬底和掩模的图案元件以调节衬底和/或掩模的伸长率和/或横向位置以保持精确的配准。此外，孔可以具有大约100微米或更小的最小尺寸，从而在基底上产生具有小于或等于100微米的最小尺寸的特征。

105. 发明申请

WO2007001977A2 SYSTEMS AND METHODS FOR ROLL-TO-ROLL PATTERNING 审中-公开
标题翻译：用于卷对卷图案的系统和方法
公开(公告)号：WO2007001977A2
公开(公告)日：2007-01-04
申请号：PCT/US2006/023804
申请日：2006-06-20
申请人： MICROCONTINUUM, INC. , SLAFER, W., Dennis
发明人： SLAFER, W., Dennis
IPC分类号： B44C1/165 , B44C1/17 , D06N7/00 , B65C9/18
CPC分类号： B05D1/28 , B05D1/286 , B05D1/32 , B05D1/322 , B05D1/40 , B05D3/0263 , B05D3/067 , B05D3/068 , B05D3/141 , B05D2252/02 , B29C59/046 , B29C2035/0827 , C23C18/1603 , C25D5/022 , H01L27/1292 , H05K1/0393 , H05K3/0079 , H05K3/061 , H05K3/108 , H05K3/143 , H05K2203/0113 , H05K2203/0143 , H05K2203/0264 , H05K2203/1545 , Y10T156/1023 , Y10T156/1039
摘要： Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
摘要翻译：公开了系统和方法，通过该方法可以通过连续的卷对卷制造工艺在柔性衬底上形成各种材料的图案。图案可以包括金属，透明导电或非金属元件，其横向尺寸包括从100纳米到毫米的范围，并且厚度尺寸包括从几十埃到大于10,000埃的范围。基材可以是任何能够具有足够的柔韧性以与基于辊的加工设备（包括聚合物膜，金属箔和薄玻璃）兼容的材料，其中聚合物膜代表特别广泛的应用领域。方法可包括连续卷到卷地形成临时聚合物结构，其中选定的区域对下面的基底开放，连续添加或减少构成材料，并且在必要时连续去除聚合物结构和任何过量材料

106. 发明申请

WO2006132397A1 PLATING METHOD, LIGHT-TRANSMITTING ELECTRICALLY-CONDUCTIVE FILM AND LIGHT-TRANSMITTING ELECTROMAGNETIC WAVE SHIELD FILM 审中-公开
标题翻译：电镀方法，发光导电膜和发光电磁波屏蔽薄膜
公开(公告)号：WO2006132397A1
公开(公告)日：2006-12-14
申请号：PCT/JP2006/311693
申请日：2006-06-06
申请人： FUJI PHOTO FILM CO., LTD. , FUJITA, Yoshihiro
发明人： FUJITA, Yoshihiro
IPC分类号： C25D21/12 , C25D5/56 , G02B1/10 , H01B5/14 , H01B13/00 , H05K9/00
CPC分类号： C25D5/10 , C25D7/0614 , C25D7/0671 , H05K1/0393 , H05K3/241 , H05K2203/1476 , H05K2203/1545
摘要： A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000 O/ in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a latter half stage, and wherein an average plating time of the former half stage of the electroplating step is shorter than an average plating time of the latter half stage of the electroplating step or an average plating voltage at the latter half stage of the electroplating step is 60% or less of an average plating voltage at the former half stage of the electroplating step.
摘要翻译：一种电镀方法，其特征在于，包括：将表面电阻率为1〜1000O /的膜的表面多次连续地电镀，其中，将所述多次等分成前半部和后半部，电镀工序的前半部分的平均电镀时间比电镀工序的后半阶段的平均镀敷时间短，或电镀工序的后半阶段的平均电镀电压为60％以下在电镀步骤的前半段的平均电镀电压。

107. 发明申请

WO2006123804A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：含羧基的聚氨酯，可固化树脂组合物及其用途
公开(公告)号：WO2006123804A1
公开(公告)日：2006-11-23
申请号：PCT/JP2006/310084
申请日：2006-05-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
发明人： UCHIDA, Hiroshi , HIRAKAWA, Ritsuko , MIYAJIMA, Yoshio , INOUE, Hirofumi , KIMURA, Kazuya , AZUMA, Yukihiko
IPC分类号： C08G18/65 , C08G18/34 , C08G18/62 , C08G18/08
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/348 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G18/69 , C08G18/698 , C09D11/106 , C09D175/04 , H05K1/0393
摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol% (relative to the total (100 mol%) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

108. 发明申请

WO2006119189A2 MOLDED LEAD FRAME CONNECTOR WITH ONE OR MORE PASSIVE COMPONENTS 审中-公开
标题翻译：带有一个或多个被动部件的模制导线框架连接器
公开(公告)号：WO2006119189A2
公开(公告)日：2006-11-09
申请号：PCT/US2006016629
申请日：2006-05-01
申请人： FINISAR CORP , ICE DONALD A , DOUMA DARIN J , KIELY PHILLIP ANTHONY
发明人： ICE DONALD A , DOUMA DARIN J , KIELY PHILLIP ANTHONY
IPC分类号： H01L23/495
CPC分类号： H01R13/6608 , G02B6/4201 , G02B6/4246 , G02B6/4279 , G02B6/428 , H01L23/495 , H01L2924/0002 , H01R12/7082 , H01R13/405 , H05K1/023 , H05K1/0393 , H05K1/141 , H05K3/202 , H05K3/3405 , H05K3/3421 , H05K3/3447 , H05K2201/0397 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446 , H05K2203/302 , H01L2924/00
摘要： Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.
摘要翻译：本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。引线框架连接器包括被封装在多个聚合物壳体中的导电引线结构。聚合物壳体为引线框架中的导体提供电绝缘以及用于成品部件的机械支撑。一个或多个无源部件可以安装到引线框架连接器的导体，以有助于光学子组件，引线框架连接器和印刷电路板之间的阻抗匹配。引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。

109. 发明申请

WO2006118971A2 GENERIC PATTERNED CONDUCTOR FOR CUSTOMIZABLE ELECTRONIC DEVICES 审中-公开
标题翻译：用于可定制电子设备的通用图形导体
公开(公告)号：WO2006118971A2
公开(公告)日：2006-11-09
申请号：PCT/US2006/016099
申请日：2006-04-27
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： JAMBOR, George F., , ROBRECHT, Michael J.,
IPC分类号： H05K1/00 , H05K3/46
CPC分类号： G06F3/045 , G06F3/041 , G06F3/044 , G06F3/047 , H05K1/0289 , H05K1/0393 , H05K3/4611 , H05K3/4635 , H05K2203/0554 , H05K2203/1545
摘要： A method of making a multilayered product having a repeating conductive pattern that includes determining a repeating pattern configuration such as a grid of conductive traces for use in a range of active element configurations, and forming a continuous web of multilayered product having at least one layer of conductive material configured according to the determined repeating pattern configuration. The continuous web is suitable for use in a range of active element configurations. The method may also include altering the continuous web to form a customized active element. Forming the continuous web may include providing a first roll of continuous webbing stock, the first roll having at least a portion of the repeating pattern formed thereon, providing a second roll of continuous webbing stock, the second roll having at least a portion of the repeating conductive pattern formed thereon, and laminating the first and second rolls of continuous webbing stock together.
摘要翻译：一种制备具有重复导电图案的多层产品的方法，所述多层产品包括确定重复图案构型，例如用于一系列活性元件构型的导电迹线格栅，以及形成具有至少一层导电材料根据所确定的重复图案构型配置。连续卷材适用于一系列有源元件配置。该方法还可以包括改变连续卷材以形成定制的活性元件。形成连续幅材可以包括提供第一卷连续织带坯料，第一辊具有形成在其上的重复图案的至少一部分，提供第二卷连续织带坯料，第二辊具有重复的至少一部分形成在其上的导电图案，以及将第一和第二辊的连续织带材料层叠在一起。

110. 发明申请

WO2006110364A1 FLEXIBLE CIRCUIT SUBSTRATE 审中-公开
标题翻译：柔性电路基板
公开(公告)号：WO2006110364A1
公开(公告)日：2006-10-19
申请号：PCT/US2006/012218
申请日：2006-04-04
申请人： 3M INNOVATIVE PROPERTIES COMPANY , WANG, Li Ping, , WANG, Xiao Dong, , GAO, Jian Xia,
发明人： WANG, Li Ping, , WANG, Xiao Dong, , GAO, Jian Xia,
IPC分类号： H05K3/38
CPC分类号： H05K3/388 , H05K1/0393 , H05K3/363
摘要： The present invention is directed to a substrate for subsequent eutectic bonding with a subsequently applied metal to provide, or as a precursor to the provision of, a circuit substrate. The circuit substrate comprises a dielectric film and a layer of an oxide or oxides of a metal on the film. The metal oxide layer has been formed by sputtering the metal of the metal oxide or oxides onto a surface of the film in the presence of an inert atmosphere save for at least one reactive gas content to provide the oxygen of the oxides.
摘要翻译：本发明涉及用于随后与随后施加的金属共晶接合以提供或作为提供电路基板的前体的基板。电路基板包括电介质膜和膜上的金属的氧化物或氧化物层。金属氧化物层是通过在惰性气氛的存在下将金属氧化物或氧化物的金属溅射到膜的表面而形成的，除了至少一种反应气体含量以提供氧化物的氧。

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