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    • 98. 发明申请
    • METHOD OF JOINING PLASTIC PREFORMS TO ENCAPSULATE AN ARTICLE
    • 加工塑料制品的方法
    • WO00035663A1
    • 2000-06-22
    • PCT/US1999/030304
    • 1999-12-17
    • B29C63/22B29C65/50B29C65/00
    • B29C63/22B29C65/10B29C65/1412B29C65/4815B29C65/483B29C65/5042B29C65/5092B29C66/1142B29C66/1162B29C66/54B29C66/543B29C66/65B29C66/71B29C66/83411B29K2027/16B29K2027/14B29K2027/12
    • A method and apparatus are presented for encapsulating an article comprising, for example, a substantially circular turntable (12) having first (16) and second (18) opposed major surfaces, each major surface sharing an outer peripheral sidewall (20). A first cover (28) and second cover (30), preformed from thermoplastic, are fitted around the article and sealed by rotating a thermoplastic band (32) onto and around the exposed seam (48) while applying pressure (70) and heat (74) to obtain a fused reliable encapsulating joint (72). The method and apparatus presented are particularly well suited for encapsulating metal platens, holders and internal parts of process equipment used in the semiconductor manufacturing industry to avoid contamination from the encapuslated metal, but the method could be used to encapsulate any article having a rotatable outer seam of abutted polymeric materials residing on a relatively narrow outer peripheral flat sidewall surface of the article.
    • 提供了一种用于封装制品的方法和装置,其包括例如具有第一(16)和第二(18)相对的主表面的基本圆形的转台(12),每个主表面共享外周侧壁(20)。 将由热塑性塑料制成的第一盖(28)和第二盖(30)安装在制品的周围,并通过将热塑性带(32)旋转到暴露的接缝(48)上和周围,同时施加压力(70)和加热 74),以获得熔融可靠的封装接头(72)。 所提出的方法和装置特别适用于封装半导体制造工业中使用的工艺设备的金属压板,保持器和内部部件,以避免包覆金属的污染,但该方法可用于封装具有可旋转的外部接缝 邻接的聚合材料位于制品的相对较窄的外周平坦侧壁表面上。