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1. 发明申请

WO2008132634A3 RADIATION DETECTOR HAVING A SPLIT LAMINATE OPTICAL COUPLING 审中-公开
公开(公告)号：WO2008132634A3
公开(公告)日：2008-11-06
申请号：PCT/IB2008/051174
申请日：2008-03-28
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , U.S. PHILIPS CORPORATION , LEVENE, Simha , LIJTEN, Gerardus, F., C., M.
发明人： LEVENE, Simha , LIJTEN, Gerardus, F., C., M.
IPC分类号： G01T1/20
摘要： A radiation- sensitive detector (120) includes a scintillator array (124) coupled with a photosensor array (140) via an adhesive laminate (144). The photosensor (140) has a plurality of dixels (136). The adhesive laminate (144) includes a material free region that extends through the adhesive laminate (144) from the scintillator array (124) to the photosensor array (140) and that is located between a pair of adjacent dixels (136).

2. 发明申请

WO2010058335A2 ASSEMBLY METHOD FOR A TILED RADIATION DETECTOR 审中-公开
标题翻译：一种倾斜式辐射探测器的组装方法
公开(公告)号：WO2010058335A2
公开(公告)日：2010-05-27
申请号：PCT/IB2009/055063
申请日：2009-11-13
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , JORRITSMA, Jorrit , POORTER, Tiemen , LIJTEN, Gerardus, F., C., M. , VAN ROOSMALEN, Johannes, H., M. , SENS, Martinus, M. , GROB, Timon, R. , TER LAAK, Michael, J., F., M.
发明人： JORRITSMA, Jorrit , POORTER, Tiemen , LIJTEN, Gerardus, F., C., M. , VAN ROOSMALEN, Johannes, H., M. , SENS, Martinus, M. , GROB, Timon, R. , TER LAAK, Michael, J., F., M.
IPC分类号： G01T1/20
CPC分类号： G01T1/2018 , G01T1/00
摘要： A tiled detector assembly (1000) and a method for making a tiled radiation detector (1000) is described. The innovative feature of this method is that the xyz misalignment of the detector tiles (304, 304'), the origin of various image artifacts, can be significantly reduced by accurate sizing and alignment of the detector tiles (304, 304'). Consequently, image quality, yield and reliability of as-produced tiled radiation detectors are considerably improved.
摘要翻译：描述了平铺检测器组件（1000）和用于制造平铺辐射检测器（1000）的方法。该方法的创新特征是通过检测器贴片（304,304'）的精确尺寸和对准，可以显着减小检测器贴片（304,304'）的xyz未对准，各种图像伪影的起源。因此，生产的平铺式辐射探测器的图像质量，成品率和可靠性得到显着改善。

3. 发明申请

WO2007063489A1 LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：发光二极管模块
公开(公告)号：WO2007063489A1
公开(公告)日：2007-06-07
申请号：PCT/IB2006/054479
申请日：2006-11-28
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , VAN OS, Koen , WANG, Lingli , LIJTEN, Gerardus, F., C., M. , CALON, Georges, M. , RIEMEIJER, Martijn
发明人： VAN OS, Koen , WANG, Lingli , LIJTEN, Gerardus, F., C., M. , CALON, Georges, M. , RIEMEIJER, Martijn
IPC分类号： H01L33/00
CPC分类号： H01L33/54
摘要： The present invention relates to a light emitting diode (LED) module, comprising at least one LED chip mounted on a heat spreading substrate, an encapsulant covering the chip(s), and an optical element fixedly mounted in relation to the substrate and in contact with the encapsulant, wherein the optical element is so arranged that the encapsulant has at least one free surface to allow deformation of the encapsulant. The present invention also relates to a method for the manufacturing of such a LED module.
摘要翻译：本发明涉及一种发光二极管（LED）模块，其包括安装在散热基板上的至少一个LED芯片，覆盖芯片的密封剂以及相对于基板固定地接触的光学元件与所述密封剂一起，其中所述光学元件被布置成使得所述密封剂具有至少一个自由表面以允许所述密封剂变形。本发明还涉及制造这种LED模块的方法。

4. 发明申请

WO2003003293A1 DATA CARRIER WITH AN INTEGRATED CIRCUIT BETWEEN TWO CARRIER LAYERS 审中-公开
标题翻译：数据载体与两个载波层之间的集成电路
公开(公告)号：WO2003003293A1
公开(公告)日：2003-01-09
申请号：PCT/IB2002/002369
申请日：2002-06-20
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V.
发明人： FRITZ, Reinhard , LIJTEN, Gerardus, F., C., M. , WINTERS, Hubertus, H., A.
IPC分类号： G06K19/077
CPC分类号： G06K19/07749
摘要： A data carrier (1) for contactless communication comprises a first carrier layer (2) and a second carrier layer (3) which are held together by an adhesive layer (15), wherein an integrated circuit (11) is held in a given position between one of the two carrier layers (2, 3) and the adhesive layer (15), the circuit comprising transmission means (13, 14) which can communicate in a contactless manner with transmission means (7, 8) at the carrier layer, and the transmission means (7, 8) of the carrier layer are connected with electrical conduction to further transmission means (5, 6) by which a contactless communication with a communication station can be carried out, and wherein the final, mechanically stable retention of the integrated circuit (11) in the position reserved for it in the data carrier (1) is realized by means of the adhesive layer (15) only.
摘要翻译：用于非接触通信的数据载体（1）包括由粘合剂层（15）保持在一起的第一载体层（2）和第二载体层（3），其中集成电路（11）保持在给定位置在两个载体层（2,3）中的一个和粘合剂层（15）之间，电路包括能够以非接触方式与载体层上的传输装置（7,8）通信的传输装置（13,14）并且载体层的传输装置（7,8）与导电连接以进一步传输装置（5,6），通过该传输装置可以执行与通信站的非接触式通信，并且其中最后的机械稳定保持在数据载体（1）中为其保留的位置中的集成电路（11）仅通过粘合剂层（15）实现。

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