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1. 发明公开

US20240130238A1 OPTICAL SENSOR 审中-公开
公开(公告)号：US20240130238A1
公开(公告)日：2024-04-18
申请号：US18377306
申请日：2023-10-06
申请人： Sumitomo Electric Industries, Ltd.
发明人： Kyohei KAKUYAMA , Kotaro HIROSE , Masahiro ADACHI
IPC分类号： H10N10/851 , G01J5/12 , H10N10/13 , H10N10/817
CPC分类号： H10N10/8556 , G01J5/12 , H10N10/13 , H10N10/817
摘要： An optical sensor includes a support film having a first main surface and a second main surface located opposite to the first main surface in a thickness direction; a thermoelectric-conversion material section disposed on the first main surface and including a plurality of strip-shaped first material layers formed of SiGe having p-type conductivity and configured to convert thermal energy into electric energy, and a plurality of strip-shaped second material layers formed of SiGe having n-type conductivity and configured to convert thermal energy into electric energy; a heat sink disposed on the second main surface; and a light absorbing film disposed so as to form a temperature difference in each of the first material layers in longitudinal directions and each of the second material layers in longitudinal directions and configured to convert received light into thermal energy.

2. 发明公开

US20230189650A1 THERMOELECTRIC COMPOSITE, PREPARATION METHOD THEREFOR, AND THERMOELECTRIC DEVICE AND SEMICONDUCTOR DEVICE EACH COMPRISING THERMOELECTRIC COMPOSITE 审中-公开
公开(公告)号：US20230189650A1
公开(公告)日：2023-06-15
申请号：US18163694
申请日：2023-02-02
申请人： Industry-University Cooperation Foundation Hanyang University Erica Campus , Ajou University Industry-Academic Cooperation Foundation
发明人： Tae Joo Park , Sang Woon Lee , Dae Woong Kim , Tae Jun Seok , Jae Hyun Yoon , Ji Hyeon Choi
IPC分类号： H10N10/855 , H10N10/01 , H10N10/13 , H10N10/817 , H10N10/82 , H01L23/427
CPC分类号： H10N10/855 , H10N10/01 , H10N10/13 , H10N10/817 , H10N10/82 , H01L23/427
摘要： Provided is a preparation method for a thermoelectric composite. The preparation method for a thermoelectric composite comprises the steps of: preparing a base substrate containing a first binary metal oxide; and providing a metal precursor and a reaction material containing oxygen (O) onto the base substrate to form a material film containing a second biliary metal oxide resulting from the reaction of the metal precursor and the reaction material, wherein in the step of forming the material film, a 2-dimensional electron gas is generated between the base substrate and the material film as the material film is formed on the base substrate.

3. 发明授权

US11659767B2 Package with built-in thermoelectric element 有权
公开(公告)号：US11659767B2
公开(公告)日：2023-05-23
申请号：US16485729
申请日：2018-02-14
申请人： NGK SPARK PLUG CO., LTD. , FERROTEC MATERIAL TECHNOLOGIES CORPORATION
发明人： Masahiro Ogawa , Tetsuya Kato , Takayuki Hachida
IPC分类号： H10N10/17 , H10N10/82 , H10N10/817
CPC分类号： H10N10/17 , H10N10/817 , H10N10/82
摘要： A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

4. 发明授权

US12102007B2 Thermoelectric conversion module 有权
公开(公告)号：US12102007B2
公开(公告)日：2024-09-24
申请号：US17759843
申请日：2021-01-26
申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人： Ryoji Funahashi
IPC分类号： H10N10/817 , H10N10/01 , H10N10/17 , H10N10/853
CPC分类号： H10N10/817 , H10N10/01 , H10N10/17 , H10N10/853
摘要： This thermoelectric conversion module is formed by electrically connecting, by a conductive member, one end of an n-type thermoelectric conversion element having a negative Seebeck coefficient and having a half-Heusler structure to one end of a p-type thermoelectric conversion element containing an oxide having a positive Seebeck coefficient at a temperature of 25° C. or higher. The conductive member is connected to the n-type thermoelectric conversion element and the p-type thermoelectric conversion element through a connection layer containing a conductive metal comprising silver, and the connection layer is characterized by further containing an oxide to reduce the bond resistance between the n-type thermoelectric conversion element and/or the p-type thermoelectric conversion element.

5. 发明公开

US20240292755A1 Thermoelectric elements, thermoelectric modules, and methods for manufacturing thereof 审中-公开
公开(公告)号：US20240292755A1
公开(公告)日：2024-08-29
申请号：US18584291
申请日：2024-02-22
申请人： Nikolay Iosad
发明人： Nikolay Iosad
IPC分类号： H10N10/17 , H10N10/01 , H10N10/817 , H10N19/00
CPC分类号： H10N10/17 , H10N10/01 , H10N10/817 , H10N19/00
摘要： A substrate-free film-based thermoelectric element comprising a first thermoelectric film, a first metal foil electrode having a first planar interface with a first side of the thermoelectric film, and a second metal foil electrode having a second planar interface with the first side of the thermoelectric film, wherein the first and the second planar interfaces are disposed in the same first flat plane.

6. 发明公开

US20240206339A1 THERMOELECTRIC CONVERSION DEVICE AND THERMOELECTRIC CONVERSION MODULE 审中-公开
公开(公告)号：US20240206339A1
公开(公告)日：2024-06-20
申请号：US18287296
申请日：2022-02-04
申请人： Sumitomo Electric Industries, Ltd.
发明人： Kotaro HIROSE , Masahiro ADACHI
IPC分类号： H10N10/817 , H10N10/17 , H10N10/851
CPC分类号： H10N10/817 , H10N10/17 , H10N10/8556
摘要： A thermoelectric conversion device includes a first electrode, a thermoelectric conversion material portion containing Si and Ge as constituent elements, a conductive joining member disposed in contact with the first electrode and the thermoelectric conversion material portion and joining the first electrode and the thermoelectric conversion material portion together, and a second electrode. The Si and the Ge contain amorphous phase and crystalline phase. The joining member contains at least one of Ag, Cu, Ti, and Sn or an alloy thereof as a major constituent. The thermoelectric conversion material portion includes a first layer containing the major constituent in an amount of 10 atm % or more and in contact with the joining member, and a second layer. The second layer has a degree of crystallinity of 40% by volume to 90% by volume.

7. 发明公开

US20240180036A1 THERMOELECTRIC ELEMENT 审中-公开
公开(公告)号：US20240180036A1
公开(公告)日：2024-05-30
申请号：US18577744
申请日：2022-07-12
申请人： LG INNOTEK CO., LTD.
发明人： Man Hue CHOI , Se Woon LEE , Jong Min LEE , Hyung Eui LEE
IPC分类号： H10N10/817 , H10N10/17
CPC分类号： H10N10/817 , H10N10/17
摘要： A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; an insulation layer disposed on the first substrate; a first electrode disposed on the insulation layer; a bonding layer disposed on the first electrode; a semiconductor structure disposed on the bonding layer; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the upper surface of the insulation layer includes a first concave surface vertically overlapping the first electrode, the bonding layer includes a first area vertically overlapping the first concave surface and the semiconductor structure and a second area which vertically overlaps the first concave surface and does not vertically overlap the semiconductor structure, and a void density of the first area is smaller than that of the second area.

8. 发明公开

US20240147859A1 THERMOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND THERMOELECTRIC CONVERSION DEVICE 审中-公开
公开(公告)号：US20240147859A1
公开(公告)日：2024-05-02
申请号：US17769352
申请日：2020-09-11
申请人： Mitsuba Corporation , National Institute for Materials Science
发明人： Satoki Tada , Yukihiro Isoda
IPC分类号： H10N10/853 , C22C21/02 , C22C21/08 , H10N10/01 , H10N10/17 , H10N10/817
CPC分类号： H10N10/853 , C22C21/02 , C22C21/08 , H10N10/01 , H10N10/17 , H10N10/817
摘要： A thermoelectric conversion element (100) of the present invention includes a first electrode (105) which has one side joined to a first surface (101a) of an n-type semiconductor via an n-side junction layer (102), and the other side joined to a first surface (103a) of a p-type semiconductor via a p-side junction layer (104), and a second electrode (106) which is joined to each of a second surface (101b) of the n-type semiconductor and a second surface (103b) of the p-type semiconductor via the n-side junction layer (102) and the p-side junction layer (104). Each of the n-type semiconductor (101) and the p-type semiconductor (103) has a composition represented by Formulas (1) and (2) below, and the n-side junction layer (102) and the p-side junction layer (104) include Al.

Mg2SiaSn1-a+A (1)

MgmSixSnyGez+B (2)

9. 发明公开

US20230371380A1 THERMOELECTRIC DEVICES ON CERAMIC 审中-公开
公开(公告)号：US20230371380A1
公开(公告)日：2023-11-16
申请号：US18196093
申请日：2023-05-11
申请人： Sheetak, Inc.
发明人： Uttam Ghoshal , Key Kolle
IPC分类号： H10N10/817 , H10N10/01 , H10N10/17
CPC分类号： H10N10/817 , H10N10/01 , H10N10/17
摘要： The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.

10. 发明授权

US11723275B2 Thermoelectric module 有权
公开(公告)号：US11723275B2
公开(公告)日：2023-08-08
申请号：US16782295
申请日：2020-02-05
申请人： LG INNOTEK CO., LTD.
发明人： Seong Jae Jeon , Sung Chul Kim
IPC分类号： H01L35/32 , H10N10/17 , H10N10/817
CPC分类号： H10N10/17 , H10N10/817
摘要： A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.

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