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    • 10. 发明授权
    • Methods and systems for detecting acceleration using bondwires
    • 使用焊丝检测加速度的方法和系统
    • US09291636B1
    • 2016-03-22
    • US13070076
    • 2011-03-23
    • Brian Patrick OtisYu-Te LiaoWilliam James Biederman
    • Brian Patrick OtisYu-Te LiaoWilliam James Biederman
    • G01P3/42
    • G01P3/42G01P15/10G01P15/11
    • Disclosed herein are example methods, systems, and devices involving electrically-conductive wires, such as standard IC bonding wires, that are configured so as to operate as inertial sensors. One embodiment of the disclosed methods, systems, and devices may take the form of a system that includes a first electrically-conductive wire and a second electrically-conductive wire, where the first wire and the second wire are electromagnetically coupled; and a sensor oscillator, where the sensor oscillator is coupled to the first wire and the second wire, and where the sensor oscillator is configured to output a sensor-oscillator signal that is frequency modulated based on a change in complex impedance between the first wire and the second wire, where the change in complex impedance is due to a displacement of the first wire relative to the second wire.
    • 本文公开了包括被配置为作为惯性传感器操作的导电线(例如标准IC接合线)的示例性方法,系统和设备。 所公开的方法,系统和设备的一个实施例可以采取包括第一导电线和第二导电线的系统的形式,其中第一线和第二线被电磁耦合; 以及传感器振荡器,其中所述传感器振荡器耦合到所述第一线和所述第二线,并且其中所述传感器振荡器被配置为输出基于所述第一线和所述第一线和所述第二线之间的复阻抗的变化而被频率调制的传感器振荡器信号 第二线,其中复阻抗的变化是由于第一线相对于第二线的位移。