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    • 6. 发明授权
    • Automated method and apparatus for processor thermal validation
    • 用于处理器热验证的自动化方法和装置
    • US07275012B2
    • 2007-09-25
    • US10334233
    • 2002-12-30
    • James G. Hermerding, II
    • James G. Hermerding, II
    • G01K17/00G01K7/10
    • G01K7/42
    • A method and corresponding software for automatically validating a computer platform thermal solution. An application program is employed to selectively execute thermal stress code to cause the platform's processor to dissipate an amount of power corresponding to a predetermined value, such as a thermal design power dissipation value specified by the processor's manufacturer. In one embodiment, tests are performed while operating at this power dissipation level to determine if a thermal overload condition exists, which may be determined by the processor's temperature, an indication that the processor is throttled, or a signal provided by the processor indicating the processor has detected a thermal overload condition. In another embodiment, a thermal resistance value is calculated based on the processor power dissipation, the temperature of the processor, and the ambient temperature of the test environment. In one embodiment the entire validation process is automatically performed by the application program without requiring any extraneous test equipment or temperature probes.
    • 一种用于自动验证计算机平台热解决方案的相应软件。 使用应用程序来选择性地执行热应力代码以使平台的处理器消耗对应于预定值的功率量,例如由处理器的制造商指定的热设计功耗值。 在一个实施例中,在以该功率耗散水平操作的同时执行测试以确定是否存在热过载条件,其可以由处理器的温度,处理器被限制的指示或由处理器提供的指示处理器的信号 已经检测到热过载状况。 在另一个实施例中,基于处理器功率耗散,处理器的温度和测试环境的环境温度来计算热阻值。 在一个实施例中,整个验证过程由应用程序自动执行,而不需要任何外部测试设备或温度探测器。
    • 7. 发明授权
    • Dynamic polymer pressure transducer with temperature compensation
    • 具有温度补偿功能的动态聚合物压力传感器
    • US4577510A
    • 1986-03-25
    • US647782
    • 1984-09-06
    • Anthony J. BurSteven C. Roth
    • Anthony J. BurSteven C. Roth
    • G01L9/00G01L9/08G01K7/10
    • G01L9/0001G01L9/085Y10S73/04
    • Accurate dynamic pressure data in a changing thermal environment is obtained through the use of a pressure gage formed from polyvinylidene fluoride (PVDF) polymer material. The temperature compensation pressure gage has three major elements: an active PVDF transducer which obtains remote pressure readings which are uncorrected for thermal effects; a thermocouple having a short rise time allowing an output thermal signal which dynamically responds to changing thermal conditions; and a compensation amplifier circuit receiving the uncorrected pressure readings and the dynamic thermal signal and producing an output signal representing accurate pressure data which is corrected for changing thermal conditions. Also disclosed are the details of making an active PVDF transducer.
    • 通过使用由聚偏二氟乙烯(PVDF)聚合物材料形成的压力表获得在变化的热环境中的精确动态压力数据。 温度补偿压力表有三个主要元素:主动PVDF传感器,获得未校正的热效应的远程压力读数; 具有短的上升时间的热电偶,允许动态地响应于变化的热条件的输出热信号; 以及补偿放大器电路,其接收未校正的压力读数和动态热信号,并产生表示精确压力数据的输出信号,该数据被校正以改变热条件。 还公开了制造活性PVDF传感器的细节。
    • 8. 发明授权
    • Remote temperature measuring system with semiconductor junction sensor
    • 具有半导体结传感器的远程温度测量系统
    • US4228684A
    • 1980-10-21
    • US45269
    • 1979-06-04
    • Jackson R. Templin
    • Jackson R. Templin
    • G01K1/02G01K7/01G01K7/10
    • G01K1/024G01K7/01
    • A circuit is provided for measuring the effect of temperature on the voltage drop across the semiconductor junction sensor which is located remotely from the measuring circuit and connected thereto by a pair of conductors having substantial lead resistance. The circuit provides a programmed current source which alternately provides to the sensor first and second currents of different magnitudes having a fixed ratio to produce corresponding voltages across the conductors wherein each voltage includes a lead component arising from the lead resistance and the respective current. A sample and hold circuit measures each of the voltages and an amplifier multiplies one of the voltages by the current ratio and the resultant voltages are compared to obtain an output free of any lead component and which varies with the temperature of the sensor.
    • 提供了一种电路,用于测量温度对跨越半导体结传感器的电压降的影响,半导体结传感器位于远离测量电路并通过具有实质的引线电阻的一对导体与其连接。 该电路提供编程电流源,其交替地向传感器提供具有固定比率的不同量程的第一和第二电流,以在导体之间产生相应的电压,其中每个电压包括由引线电阻和相应电流产生的引线分量。 采样和保持电路测量每个电压,并且放大器将一个电压乘以电流比,并且将所得到的电压进行比较,以获得没有任何引线分量的输出,并随传感器的温度而变化。