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    • 10. 发明申请
    • Polyamide Resin and Method for Manufacturing Same
    • 聚酰胺树脂及其制造方法
    • US20160280856A1
    • 2016-09-29
    • US15037521
    • 2014-11-21
    • SAMSUNG SDI CO., LTD.
    • Tomomichi KANDATomoaki SHIMODA
    • C08G69/30C08G69/26
    • C08G69/30C08G69/26C08G69/265C08G69/28
    • A method for manufacturing a polyamide resin, according to the present invention, comprises the steps of: obtaining a low-order condensate in a solid state through polycondensation of dicarboxylic acid and diamine in the presence of a compound having a wt % of approximately 0.01 to 0.5 with respect to the total amount of the dicarboxylic acid and the diamine; and solid-state polymerizing the low-order condensate, wherein the dicarboxylic acid contains, with respect to the total amount of the dicarboxylic acid, approximately 70 mol % of aliphatic dicarboxylic acid having 9 to 12 carbon atoms, wherein the diamine contains, with respect to the total amount of the diamine, approximately 50 mol % of diamine represented by previously indicated chemical formula 1, wherein the range of the maximum temperature of the polycondensation reaction is approximately 200 to 230° C., and the maximum reaction temperature of the solid-state polymerization is approximately 170 to 230° C.
    • 根据本发明的聚酰胺树脂的制造方法包括以下步骤:通过二羧酸和二胺在wt%为约0.01的化合物的存在下,通过缩聚二羧酸和二胺来获得固体状态的低级缩合物, 相对于二羧酸和二胺的总量为0.5; 和固相聚合低级缩合物,其中相对于二羧酸的总量,二羧酸含有约70摩尔%的具有9至12个碳原子的脂族二羧酸,其中二胺包含,相对于 相对于二胺的总量,约50mol%由先前指示的化学式1表示的二胺,其中缩聚反应的最高温度的范围为约200至230℃,并且固体的最大反应温度 - 状态聚合约为170-230℃