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1. 发明申请

US20020040769A1 Double sided dispenser 审中-公开
标题翻译：双面分配器
公开(公告)号：US20020040769A1
公开(公告)日：2002-04-11
申请号：US09911837
申请日：2001-07-24
发明人： Chiwu Huang
IPC分类号： B65C011/04
CPC分类号： B65H37/007 , Y10T156/1798 , Y10T156/18
摘要： Disclosed is a double sided dispenser in a single hand-held unit, which; in one embodiment thereof, includes one end that dispenses correction transfer film, and the other end dispenses a transparent, colored highlighting film. In another embodiment, two different sizes of films are dispensed at each end of the unit, and these films may each be of the transfer correction film type, or one may be a correction film and the other a highlighting film, or the like.
摘要翻译：公开在单个手持单元中的双面分配器，在其一个实施例中，包括分配校正转移膜的一端，另一端分配透明的着色突出膜。在另一个实施例中，在单元的每个端部分配两种不同尺寸的膜，并且这些膜可以各自具有传输校正膜类型，或者可以是校正膜，另一个可以是高亮膜等。

2. 发明申请

US20010037862A1 Support-frame bonding apparatus 失效
标题翻译：支架结合装置
公开(公告)号：US20010037862A1
公开(公告)日：2001-11-08
申请号：US09871371
申请日：2001-05-31
发明人： Akihiro Moriuchi
IPC分类号： B65C011/04 , B30B001/00 , B32B031/00 , B23K037/00
CPC分类号： H01L24/86 , B23K37/047 , B23K2101/40 , B32B37/26 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/351 , Y10T29/53174 , Y10T156/1798 , H01L2924/00
摘要： A support-frame bonding apparatus has an upper pressing member to which a semiconductor device is supplied and a lower pressing member to which a support frame is supplied. An elastic member is provided to the lower surface of a pressing tool in the upper pressing member. The elastic member is formed of a conductive silicon rubber having a satin finish on the side facing the semiconductor device. The outline of the area of the elastic member contacting the semiconductor device is substantially identical to the outline of an adhesive layer. The semiconductor device and the support frame are superposed via the adhesive layer and pressed against each other, the support frame being heated by the pressing stage. Thus, the semiconductor device is bonded to the support frame via the adhesive layer. The satin finish on the surface of the elastic member prevents the elastic member from sticking to the seniconductor device.
摘要翻译：支撑框架接合装置具有供给半导体装置的上部按压部件和供给支撑框架的下部按压部件。弹性构件设置在上部按压构件中的按压工具的下表面。弹性构件由在面向半导体器件的一侧上具有缎面光洁度的导电硅橡胶形成。与半导体器件接触的弹性构件的面积的轮廓与粘合剂层的轮廓基本相同。半导体器件和支撑框架经由粘合剂层重叠并且彼此压靠，支撑框架被加压阶段加热。因此，半导体器件经由粘合剂层结合到支撑框架。弹性部件的表面上的缎面光洁度可以防止弹性部件粘到半导体器件上。

3. 发明申请

US20040103992A1 Paste unit for a bottom guide device 有权
标题翻译：底部导向装置的粘贴装置
公开(公告)号：US20040103992A1
公开(公告)日：2004-06-03
申请号：US10721068
申请日：2003-11-26
发明人： Ruediger Duwendag , Guido Kerres , Andrees Erdmann
IPC分类号： B65C011/04
CPC分类号： B05C1/0834 , B05C1/0813 , B31B70/60 , B31B70/62 , B31B2150/00 , B31B2160/20 , Y10T156/1798
摘要： A paste unit (3) for a bottom guide device for star seal bottom bags, which are formed of tube sections, is introduced. The paste unit (3) serves for the glueing of bottom warps, or star seal bottom bags. The unit's characteristics are a glue reservoir (1), or a glue source (5), a metering roller (2), a glue application roller (3), as well as a making roller (4). Drive means are assigned to the rollers. Innovating and inventive is the fact that the glue (9) is transferred to the printing roller (4) by the glue application roller (3). This closed system provides the advantage that the glue (9) is applied evenly, and that the metering can be adjusted at a very fine setting. Furthermore, no glue (9) can be discharged to the environment of the paste unit.
摘要翻译：引入由管段形成的用于星形密封底袋的底部引导装置的糊剂单元（3）。糊剂单元（3）用于粘合底部经纱或星形密封底部袋。该设备的特征是胶水储存器（1）或胶水源（5），计量辊（2），涂胶辊（3）以及制造辊（4）。驱动装置分配给滚筒。创新和创造性是胶水（9）通过涂胶辊（3）传送到印刷辊（4）的事实。这种封闭系统提供了粘合剂（9）被均匀地施加的优点，并且可以以非常精细的设置来调节计量。此外，没有胶水（9）可以排出到糊料单元的环境中。

4. 发明申请

US20040103990A1 Glue metering in a paste unit 失效
标题翻译：粘贴单位胶水计量
公开(公告)号：US20040103990A1
公开(公告)日：2004-06-03
申请号：US10721890
申请日：2003-11-26
发明人： Ruediger Duwendag , Guido Kerres
IPC分类号： B65C011/04
CPC分类号： B05C1/0834 , B31B70/60 , B31B70/62 , B31B2150/00 , B31B2160/20 , Y10T156/1798
摘要： The invention relates to a paste unit for a bottom guide device for star seal bottom bags, which are formed from tube sections, for gluing of bottom warps or star seal bottom bags, and has at least the following characteristics: a glue reservoir (4), and/or a glue source, a metering roller (3), which is connected with the glue reservoir (4), a glue application roller (2), which may be connected to the glue reservoir (4) or the glue source, and a making roller (1), which is connected to the glue application roller (2), and which transfers glue (7) from this roller (2) to the bottom warps or the star seal bottoms. Drive means are assigned to the above listed rollers (1, 2, 3). The paste unit of the bottom guide device described above is characterized in that the circumference speed of the glue application roller (2) and of the making roller (1) can be adjusted independently of one another.
摘要翻译：本发明涉及一种用于星形密封底袋的底部引导装置的糊料单元，其由管部形成，用于粘合底部经纱或星形密封底部袋，并且至少具有以下特征：胶水储存器（4），和/或胶水源，与胶水储存器（4）连接的计量辊（3），可以连接到胶水储存器（4）或胶水源的胶水施加辊（2）和连接到涂胶辊（2）上并将胶（7）从该辊（2）转移到底部经纱或星形密封底部的制造辊（1）。驱动装置被分配到上面列出的滚子（1，2，3）。上述底部引导装置的糊状单元的特征在于，可以彼此独立地调节涂胶辊（2）和制造辊（1）的圆周速度。

5. 发明申请

US20040060665A1 Thermofusible glue applicator 有权
标题翻译：热熔胶涂布机
公开(公告)号：US20040060665A1
公开(公告)日：2004-04-01
申请号：US10470309
申请日：2003-07-29
发明人： Francis Richardot
IPC分类号： B65C011/04 , B32B031/00
CPC分类号： B05C17/00546 , Y10T156/1798 , Y10T156/18
摘要： The invention relates to an applicator comprising a) an elongated chamber (3) having an opening for a glue stick and a nozzle (6) for distributing melted glue, b) means for gradually pushing the stick into the chamber (3) and c) two heating elements (131, 132), each of which comprises a channel (151, 152) made from an electrically resistant material and which can be connected to an electrical power source. Said channel (151, 152) is formed on an electrically insulated surface of a substrate (141, 142) which is arranged so as to be in thermal contact with a mass of glue contained in the chamber (3). The heating element (131, 132) is applied against an external conformal surface (21, 22) of a heating body (2), one surface of which defines said chamber (3). The heating body (2) is made from a heat-conducting material.
摘要翻译：本发明涉及一种施用器，其包括：a）具有用于胶棒的开口的细长室（3）和用于分配熔融胶的喷嘴（6）; b）用于逐渐将棒推入室（3）的装置，以及c）两个加热元件（131,132），每个加热元件包括由电阻材料制成并可连接到电源的通道（151,152）。所述通道（151,152）形成在衬底（141,142）的电绝缘表面上，该衬底被布置成与容纳在腔室（3）中的大量胶水热接触。加热元件（131,132）被施加在加热体（2）的外部保形表面（21,22）上，加热体（2）的一个表面限定了所述腔室（3）。加热体（2）由导热材料制成。

6. 发明申请

US20010037863A1 Semiconductor die de-processing using a die holder and chemical mechanical polishing 失效
公开(公告)号：US20010037863A1
公开(公告)日：2001-11-08
申请号：US09885314
申请日：2001-06-19
发明人： Bryan C. Carson , Scott E. Moore
IPC分类号： B65C011/04 , B24B005/00 , B24B029/00 , A23P001/00
CPC分类号： B24B37/042 , H01L21/30625 , Y10S438/977 , Y10T156/17 , Y10T156/1702 , Y10T156/1798
摘要： A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.

7. 发明申请

US20040134623A1 Apparatus for applying fluid 失效
标题翻译：用于施加流体的装置
公开(公告)号：US20040134623A1
公开(公告)日：2004-07-15
申请号：US10696107
申请日：2003-10-29
申请人： Nordson Corporation
发明人： Peter Westermann
IPC分类号： B32B031/00 , B65C011/04
CPC分类号： B05C5/0266 , B05C9/04 , B42C9/0006 , Y10T156/1702 , Y10T156/1798
摘要： An apparatus for applying fluid onto a substrate, in particular for glueing inner books, books, magazines and other substrates that need to be bound. The apparatus comprises a first slot nozzle, connectable with a fluid source, for applying a fluid film onto one side of the substrate to be coated. The first slot nozzle comprises a seal member for adjusting the width of the first slot nozzle outlet transversely to the principal direction of movement of the substrate. This enables the width across which fluid is applied to the inner book side to be adjusted.
摘要翻译：一种用于将流体施加到基底上的装置，特别是用于胶合需要绑定的书本，书籍，杂志和其他基底。该装置包括可与流体源连接的第一狭缝喷嘴，用于将流体膜施加到待涂覆的基底的一侧上。第一狭槽喷嘴包括用于调节第一狭槽喷嘴出口横向于基板的主要运动方向的宽度的密封构件。这使得能够调节向内书侧施加流体的宽度。

8. 发明申请

US20030232158A1 Procedure and device for sticking objects 审中-公开
标题翻译：粘贴物件的步骤和装置
公开(公告)号：US20030232158A1
公开(公告)日：2003-12-18
申请号：US10394526
申请日：2003-03-21
申请人： DEUTSCHE SISI-WERKE GMBH & CO. BETRIEBS KG , PIOFLEX KUNSTSTOFF IN FORM GMBH & CO. OHG
发明人： Hans-Peter Wild , Eberhard Kraft , Klaus Hagle , Berthold Willi
IPC分类号： B32B007/12 , F16L001/00 , B65D001/00 , B29D022/00 , B65C011/04 , B32B015/04 , B32B031/00 , B32B007/14
CPC分类号： B65B61/205 , A47G19/2222 , Y10S206/813 , Y10S206/82 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T156/1075 , Y10T156/12 , Y10T156/1339 , Y10T156/1374 , Y10T156/16 , Y10T156/17 , Y10T156/1702 , Y10T156/1712 , Y10T156/1722 , Y10T156/1798 , Y10T428/13 , Y10T428/1471 , Y10T428/1476 , Y10T428/28
摘要： The invention relates to a method for sticking, a container, a pocket tape, a method for the production of a pocket tape, a device for the production of a pocket tape, a method for the production of an adhesive tape, an adhesive tape and a device for the production of an adhesive tape. The invention is characterised in that adhesive zones are spaced from one another by non-adhesive zones.
摘要翻译：本发明涉及一种粘贴方法，一种容器，一种袋式胶带，一种用于生产袋式胶带的方法，一种用于生产袋状胶带的装置，一种用于生产胶带的方法，一种胶带和用于生产胶带的装置。本发明的特征在于，粘合剂区域通过非粘合区彼此间隔开。

9. 发明申请

US20030075279A1 Curing of adhesive materials particularly for glazing applications 审中-公开
标题翻译：粘合剂材料的固化，特别是玻璃应用
公开(公告)号：US20030075279A1
公开(公告)日：2003-04-24
申请号：US10057525
申请日：2002-01-24
发明人： Robert Marc Clement , Christopher Davies
IPC分类号： B65C011/04
CPC分类号： B05C17/00546 , B05C17/00523 , B05C17/00543 , Y10T156/1798 , Y10T156/18
摘要： A hand-held operator manipulatable applicator device is used for dispensing adhesive bonding material to bond a panel (such as an automotive glazing panel). The device has a body containing a delivery channel for delivering adhesive to an outlet nozzle and a heating system disposed within the body for heating the bonding material in the channel to produce a substantially uniform outlet dispensing temperatures via the nozzles.
摘要翻译：手持操作者可操纵的涂抹器装置用于分配粘合剂粘合材料以粘合面板（例如汽车玻璃面板）。该装置具有主体，其包含用于将粘合剂输送到出口喷嘴的输送通道和设置在主体内的加热系统，用于加热通道中的接合材料以通过喷嘴产生基本均匀的出口分配温度。

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