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    • 3. 发明授权
    • Method for producing a one- or multidimensional detector array
    • 用于产生一维或多维检测器阵列的方法
    • US06793857B2
    • 2004-09-21
    • US09985563
    • 2001-11-05
    • Walter Otto
    • Walter Otto
    • B32B3118
    • G01T1/202G01T1/2018Y10T156/1082
    • In order to produce a one- or multidimensional detector array (9; 15, 17; 70) for detecting electromagnetic radiation, in particular for detecting X-rays, a layer composite (1) is produced. The latter has a sensor layer (3) with a material (M) sensitive to the radiation, and a carrier layer (5). In order to subdivide the sensor layer (3) into individual elements (E11, E12, . . . E1m, E21, . . . Enm) that are isolated from one another, separating spaces (7) are introduced into the sensor layer (3) by material (M) being removed. Preferably, a reflector material (R) is introduced or filled into the separating spaces (7). In order to produce a plurality of one-dimensional detector arrays (70), a structure of elements (E11, E12, . . . E1m, E21, . . . Enm) arranged in a matrix-like manner, which structure is produced by the separating spaces (7) is broken down into row portions (52, 53, . . . 63) or into column portions.
    • 为了产生用于检测电磁辐射,特别是用于检测X射线的一维或多维检测器阵列(9; 15,17; 70),产生层复合物(1)。 后者具有传感器层(3),其具有对辐射敏感的材料(M)和载体层(5)。 为了将传感器层(3)细分成彼此隔离的各个元件(E11,E12,...,E1m,E21,...,Enm),将分离空间(7)引入到传感器层 )除去材料(M)。 优选地,将反射器材料(R)引入或填充到分离空间(7)中。 为了产生多个一维检测器阵列(70),以矩阵状方式布置的元件(E11,E12,...,E1m,E21,...,Enm)的结构,该结构由 分离空间(7)分解成行部分(52,53 ... 63)或分成列部分。
    • 4. 发明授权
    • Method and apparatus for bonding protection film onto silicon wafer
    • 将保护膜粘合到硅晶片上的方法和装置
    • US06773536B2
    • 2004-08-10
    • US10238882
    • 2002-09-11
    • Masahiro Lee
    • Masahiro Lee
    • B32B3118
    • H01L21/67132B29C63/0056B29C63/02H01L21/6835H01L23/562H01L2221/68318H01L2924/0002Y10T156/1052Y10T156/108Y10T156/12Y10T156/16H01L2924/00
    • Provided is a protection film bonding method and a protection film bonding apparatus that improves productivity for bonding the protection film onto one surface of a silicon wafer. A carrier film is separated from a three-layer film having a reinforcement film, and is provided on front and rear surfaces of a protection film, to provide a two-layer film. This two-layer film is bonded onto the front surface of the silicon wafer, the reinforcement film is removed from the two-layer film and the protection film is trimmed. An apparatus consists of a supply unit, separation and take-up unit that separates the carrier film from the three-layer film, an assigning and separation unit, a joint unit that joins the two-layer film onto the silicon wafer, and a peel-off unit, that removes the reinforcement film while separating it from the two-layer film.
    • 提供了一种保护膜接合方法和保护膜接合装置,其提高了将保护膜接合到硅晶片的一个表面上的生产率。 将载体膜与具有加强膜的三层膜分离,并且设置在保护膜的前表面和后表面上,以提供双层膜。 将该双层膜粘合到硅晶片的正面上,从双层膜除去加强膜,并修整保护膜。 一种装置包括供给单元,将载体膜与三层膜分离的分离和卷取单元,分配和分离单元,将两层膜连接到硅晶片上的接合单元和剥离层 该单元在将其从两层膜分离时除去加强膜。
    • 5. 发明授权
    • Method and apparatus for adhesively securing ink jet pen components using thin film adhesives
    • 使用薄膜粘合剂粘合地固定喷墨笔组件的方法和装置
    • US06758934B2
    • 2004-07-06
    • US10305636
    • 2002-11-27
    • Jeanne Marie Saldanha SinghThomas Lee Smart
    • Jeanne Marie Saldanha SinghThomas Lee Smart
    • B32B3118
    • B41J2/17536Y10T156/1062Y10T156/1064Y10T156/108Y10T156/1082Y10T156/12Y10T156/1322
    • The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.
    • 本发明涉及一种将微电子器件,电路板等附着在表面上的方法,特别适用于将多个半导体芯片附着到喷墨笔体上。 该方法包括以下步骤:(a)提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片,所述第二表面可释放地附接到载体网; (b)同时在薄膜粘合剂材料片上进行多个切口,切口从第一表面延伸到第二表面和载体网之间的界面,而不会显着延伸到载体网中以提供一个或多个切割部分 的胶膜; (c)从载体网上去除粘合膜的每个切割部分; (d)将每个切割部分的第二表面与接收表面上的预定位置接合; 和(e)相对于预定位置提供期望对准的一个或多个半导体芯片,并使每个半导体芯片与每个切割部分的第一表面接触。 使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。
    • 7. 发明授权
    • Method for manufacturing flat display element
    • 平面显示元件制造方法
    • US06740190B2
    • 2004-05-25
    • US09988771
    • 2001-11-20
    • Takeshi Takase
    • Takeshi Takase
    • B32B3118
    • G02F1/1339H01L24/14H01L2224/1401Y10T156/108H01L2924/00012
    • In a method for manufacturing a flat display element, a pair of motherboards are prepared, and a display forming portion is formed on each motherboard. A sealant is located on one of the motherboards so as to surround the peripheral edge portion of the display forming portion, and end spacers for maintaining a gap between the two motherboards and a tacker covering the end spacers are located on the end portions of the motherboard. The motherboards are stuck on each other with the sealant, end spacers, and tacker between them, and the stuck motherboards are aligned with each other. After the alignment, the two motherboards are tacked to each other by curing the tacker. Thereafter, the motherboards are finally bonded to each other by curing the sealant. Then, the substrates, stuck on each other with the sealant, are cut out by cutting the motherboards outside the sealant.
    • 在制造平面显示元件的方法中,准备了一对母板,并且在每个母板上形成显示形成部分。 密封剂位于一个母板上,以便围绕显示器形成部分的周缘部分,并且用于保持两个主板之间的间隙的端部间隔件和覆盖端部间隔件的固定器位于主板的端部 。 主板通过密封剂,端部间隔件和它们之间的粘合剂彼此粘合,并且卡住的主板彼此对准。 在对准之后,两个主板通过固化粘合剂彼此粘合。 此后,通过固化密封剂,最终将母板彼此粘合。 然后,用密封剂彼此粘合的基板通过在密封剂外部切割母板来切割。
    • 9. 发明授权
    • Method and apparatus for feeding sheets to be applied to a wiring harness, sheet cutting apparatus and tape adhering apparatus
    • 用于供给用于线束,片材切割装置和带粘附装置的片材的方法和装置
    • US06638382B2
    • 2003-10-28
    • US09726068
    • 2000-11-29
    • Takayoshi Satou
    • Takayoshi Satou
    • B32B3118
    • B65H35/004B65B41/10H01B13/0129Y10T156/1062Y10T156/1084Y10T156/12Y10T156/1322Y10T156/17
    • A sheet piece (S′) that is needed to assemble wiring harnesses (W) on a harness assembling board (A) is recognized, and a recognition signal is generated. A sheet cutting apparatus (20) then cuts a sheet (S) from a sheet roll to a specified length in accordance with the recognition signal. The cut sheet piece (S′) then is dropped onto the respective harness assembling board (A). The sheet cutting apparatus (20) has a sheet feed roller (22), pressure rollers (23) that are movable toward and away from the feed roller (22) and cutters (26) for cutting the sheet (S). The feed roller (22) is rotated and the pressure rollers (23) press the sheet (S) against the feed rollers (22) in response to the recognition signal. Thus, a specified length of the sheet (S) is fed, and the cutters (26) cut the sheet (S) into a sheet piece (S′) of the specified length. Therefore, in a production line, a desired number of sheet pieces (S′) can be supplied to the specified harness assembling boards (A) by cutting the sheet (S) from the sheet roll when necessary.
    • 识别在线束组装板(A)上组装线束(W)所需的片材(S'),并产生识别信号。 然后,片材切割装置(20)根据识别信号将片材(S)从片材卷切割成指定长度。 然后将切割片(S')落到相应的线束组装板(A)上。 片材切割装置(20)具有供纸辊(22),能够朝向和远离进给辊(22)移动的压力辊(23)和用于切割纸张(S)的切割器(26)。 进给辊(22)旋转,并且压力辊(23)响应于识别信号将片材(S)压靠进给辊(22)。 因此,供给片材(S)的指定长度,并且切割器(26)将片材(S)切割成规定长度的片材(S')。 因此,在生产线中,根据需要,通过从片材卷切割片材(S),可以向规定的线束组装板(A)供给所需数量的片材(S')。