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1. 发明公开

US20240282517A1 Method For Manufacturing Electrical Devices 审中-公开
公开(公告)号：US20240282517A1
公开(公告)日：2024-08-22
申请号：US18444513
申请日：2024-02-16
申请人： Hutchinson Technology Incorporated
发明人： Collin M. Grove , Tyler D. Keeler , Bryan J. Scheele
IPC分类号： H01F41/12 , H05K3/10 , H05K3/46
CPC分类号： H01F41/125 , H05K3/10 , H05K3/4608 , H05K2203/1105 , H05K2203/162
摘要： An improved method for manufacturing an electrical device is described herein. In some embodiments according to the present disclosure, the method includes: providing a base layer with a coil set, thermal flattening the base layer, and forming a circuit on the base layer opposite of the coil set in the base layer.

2. 发明公开

US20240274345A1 MANUFACTURING METHOD OF MAGNETIC ELEMENT 审中-公开
公开(公告)号：US20240274345A1
公开(公告)日：2024-08-15
申请号：US18642793
申请日：2024-04-22
申请人： Delta Electronics (Shanghai) Co., Ltd.
发明人： Shouyu HONG , Ganyu ZHOU , Zhiheng FU , Yan TONG , Qingdong CHEN , Xiaoni XIN , Jinping ZHOU , Pengkai JI , Yiqing YE
IPC分类号： H01F27/28 , H01F27/24 , H01F27/32 , H01F41/02 , H01F41/04 , H01F41/12
CPC分类号： H01F27/2804 , H01F27/24 , H01F27/324 , H01F41/0206 , H01F41/041 , H01F41/125
摘要： The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.

3. 发明公开

US20240136119A1 MANUFACTURING METHOD OF SUBSTRATE 审中-公开
公开(公告)号：US20240136119A1
公开(公告)日：2024-04-25
申请号：US18399658
申请日：2023-12-28
申请人： Delta Electronics (Shanghai) Co., Ltd.
发明人： Shouyu Hong , Qingdong Chen , Xin Zou , Mingzhun Zhang , Jiaoping Huang , Jinping Zhou
IPC分类号： H01F27/32 , H01F27/29 , H01F41/12 , H02M3/06
CPC分类号： H01F27/324 , H01F27/292 , H01F41/125 , H02M3/06
摘要： A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.

4. 发明授权

US11901114B2 Substrate, manufacturing method, and power module with same 有权
公开(公告)号：US11901114B2
公开(公告)日：2024-02-13
申请号：US17015770
申请日：2020-09-09
申请人： Delta Electronics (Shanghai) Co., Ltd.
发明人： Shouyu Hong , Qingdong Chen , Xin Zou , Mingzhun Zhang , Jiaoping Huang , Jinping Zhou
IPC分类号： H01F5/00 , H01F27/32 , H01F27/29 , H01F41/12 , H02M3/06
CPC分类号： H01F27/324 , H01F27/292 , H01F41/125 , H02M3/06
摘要： A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.

5. 发明公开

US20240021363A1 INDUCTOR COMPONENT 审中-公开
公开(公告)号：US20240021363A1
公开(公告)日：2024-01-18
申请号：US18347249
申请日：2023-07-05
申请人： Murata Manufacturing Co., Ltd.
发明人： Tomomi HIGASHIYAMA , Keisuke KUNIMORI , Yuuki KAWAKAMI
IPC分类号： H01F41/04 , H01F27/29 , H01F41/12 , H01F27/32 , H01F17/00
CPC分类号： H01F41/041 , H01F27/29 , H01F41/125 , H01F27/324 , H01F17/0013
摘要： An inductor component includes a base body, an underlying insulation layer, an inductor wiring line, and a covering insulation layer. The underlying insulation layer is within the base body, and includes a first major face. The inductor wiring line is on the first major face within the base body, and extends along the first major face. The covering insulation layer is within the base body, and covers at least part of the inductor wiring line. The inductor wiring line includes a seed layer, and a plating layer in contact with the seed layer. As seen in a first cross-section orthogonal to a direction in which the inductor wiring line extends: the inductor wiring line includes first and second leg portions and a crotch portion. The first and second leg portions are in opposite end portions of a lower face of the inductor wiring line in a width direction.

6. 发明公开

US20230411067A1 ELECTRONIC COMPONENT, COIL COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20230411067A1
公开(公告)日：2023-12-21
申请号：US18333356
申请日：2023-06-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuuki KAWAKAMI , Ryuichiro TOMINAGA , Keisuke KUNIMORI , Yoshimasa YOSHIOKA
IPC分类号： H01F27/28 , H01F41/04 , H01F27/29 , H01F27/32 , H01F41/12
CPC分类号： H01F27/2804 , H01F41/043 , H01F27/29 , H01F27/324 , H01F41/125 , H01F2027/2809 , H01F41/127 , H01F27/24
摘要： In an electronic component including a circuit pattern embedded in an insulating layer, connection reliability between the circuit pattern and a wiring conductor outside the insulating layer is improved. An electronic component includes an insulating layer; a circuit pattern embedded in the insulating layer; a wiring conductor formed outside the insulating layer; and an interlayer connection portion that connects a circuit connection portion, which is a part of the circuit pattern, and the wiring conductor with an opening of the insulating layer interposed therebetween. In the circuit pattern, a thickness of a portion immediately below the interlayer connection portion of the circuit connection portion is larger than an average thickness of a portion other than the circuit connection portion.

7. 发明申请

US20180233274A1 POLYAMIDE ELECTRICAL INSULATION FOR USE IN LIQUID FILLED TRANSFORMERS 审中-公开
公开(公告)号：US20180233274A1
公开(公告)日：2018-08-16
申请号：US15892957
申请日：2018-02-09
申请人： Martin Weinberg , Askim Senyurt
发明人： Martin Weinberg , Askim Senyurt
IPC分类号： H01F27/32 , H01F41/12 , H01F27/02 , H01F41/00
CPC分类号： H01F27/32 , H01B3/305 , H01F27/02 , H01F27/12 , H01F27/323 , H01F27/324 , H01F41/00 , H01F41/125
摘要： A transformer assembly and a method of producing the same are provided. The transformer assembly includes a housing, transformer oil, and a plurality of coils of electrically conductive wire. The transformer oil is disposed within the housing. The coils of electrically conductive wire are disposed in the housing and in contact with the transformer oil. A cross-linked aliphatic polyamide insulation material configured to electrically insulate the electrically conductive wire. The insulation material includes stabilizing compounds that provide thermal and chemical stability for the insulation material.

8. 发明申请

US20170323725A1 MANUFACTURING METHOD FOR ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20170323725A1
公开(公告)日：2017-11-09
申请号：US15661739
申请日：2017-07-27
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Eiji ISO , Shinichiro IZUMI , Yoshifumi MAKI , Hirotsugu TOMIOKA , Tsuyoshi KAWADA
IPC分类号： H01F41/12 , H01F41/10 , H01F27/32 , H01F27/29 , H01F41/04 , H01F27/28
CPC分类号： H01F41/12 , H01F17/0013 , H01F17/04 , H01F27/022 , H01F27/2804 , H01F27/292 , H01F27/32 , H01F41/005 , H01F41/041 , H01F41/046 , H01F41/10 , H01F41/125 , H01F41/127 , H01F2027/2809 , H01G2/20 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/252 , H01G4/30
摘要： A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

9. 发明申请

US20150332828A1 ELECTROMAGNETIC COIL, METHOD OF MANUFACTURING ELECTROMAGNETIC COIL, AND ELECTROMAGNETIC ACTUATOR 有权
标题翻译：电磁线圈，制造电磁线圈的方法和电磁致动器
公开(公告)号：US20150332828A1
公开(公告)日：2015-11-19
申请号：US14812922
申请日：2015-07-29
申请人： CKD CORPORATION
发明人： Masayuki KOUKETSU , Akihiro ITO , Kazutoshi ITOH , Takashi HOSONO , Sadayoshi MUTO
IPC分类号： H01F5/06 , H01F7/08 , F16K49/00 , F16K31/06 , H01F41/06 , H01F41/12
CPC分类号： H01F5/06 , F16K31/0675 , F16K49/00 , H01F5/00 , H01F7/08 , H01F27/08 , H01F41/064 , H01F41/125 , H01J35/14 , H01J2235/087 , H01J2235/1287 , Y10T29/49073 , Y10T137/6416
摘要： An electromagnetic coil includes a conductor winding 12a formed by winding a conductor 12b a plurality of times about a predetermined axis, and a ceramic layer 12c formed through thermal spraying on an axial end surface of the conductor winding 12a, and having a flattened surface. A maximal value t12 of thickness of the ceramic layer 12c is set to three times or less a maximal value t11 of depth of the recesses formed at the surface of turns of the conductor 12b at the axial end surface.
摘要翻译：电磁线圈包括通过围绕预定轴线多次缠绕导体12b而形成的导体绕组12a，以及通过热喷涂形成在导体绕组12a的轴向端面上并具有扁平表面的陶瓷层12c。将陶瓷层12c的厚度的最大值t12设定为在轴向端面处形成在导体12b的匝面的凹部的深度的最大值t11的三倍以下。

10. 发明授权

US09183981B2 Reactor and manufacturing method thereof 有权
标题翻译：反应器及其制造方法
公开(公告)号：US09183981B2
公开(公告)日：2015-11-10
申请号：US13394677
申请日：2011-06-27
申请人： Yasuhiro Ueno , Fumio Nomizo
发明人： Yasuhiro Ueno , Fumio Nomizo
IPC分类号： H01F27/30 , H01F17/04 , H01F27/24 , H01F27/34 , H01F37/00 , H01F3/14 , H01F27/02 , H01F41/12 , H01F41/00
CPC分类号： H01F27/341 , H01F3/14 , H01F27/022 , H01F37/00 , H01F41/005 , H01F41/125 , Y10T29/4902
摘要： A reactor comprises a reactor core in which two U-shaped core members are connected in a ring shape with a gap section therebetween, a primary insert-molded resin part provided covering at least an outer peripheral surface of a leg part of the core member other than an adhesion surface of the core member, a coil placed around the gap section and the leg part of the core member, and a secondary insert-molded resin part made of a thermoplastic resin and which is insert-molded around the coil to fix the coil on the reactor core and fix the leg parts of the core members in a connected state. A positioning section which determines a relative position of opposing leg parts and a window section which allows a melted thermoplastic resin for forming the secondary insert-molded resin part to flow into the gap section are formed on an end of the primary insert-molded resin part connected in a state where core members are placed connected in a ring shape.
摘要翻译：反应器包括反应堆芯，其中两个U形芯构件以环形连接，其间具有间隙部分，设置成覆盖芯构件的腿部的至少外周面的主嵌入成型树脂部件比芯构件的粘合表面，围绕芯构件的间隙部分和腿部的线圈以及由热塑性树脂制成的二次嵌入成型树脂部分，并且被嵌入模制在线圈周围以固定线圈在反应堆芯上，并将芯部件的腿部部分固定在连接状态。确定相对的腿部的相对位置的定位部和允许用于形成第二嵌入成型树脂部的熔融热塑性树脂流入间隙部的窗部形成在主嵌入成型树脂部的一端连接在核心部件被连接成环状的状态。

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