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    • 1. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20100132614A1
    • 2010-06-03
    • US12620750
    • 2009-11-18
    • HITOSHI KATOManabu Honma
    • HITOSHI KATOManabu Honma
    • C23C16/50C23C16/00
    • C23C16/4551C23C16/402C23C16/45551C23C16/45578H01L21/6719H01L21/67703
    • A film deposition apparatus includes a rotary table having a substrate placement area to support a substrate, a vacuum container including a container and a top panel, an open-and-close mechanism configured to open and close the top panel, reactant gas nozzles disposed through and supported by an outer wall of the container to be situated at different angular positions with respect to a rotation center of the rotary table to face areas in which the substrate placement area passes, the reactant gas nozzles having gas discharge ports arranged in radial directions to supply respective reactant gases to the wafer thereby to form respective process areas, a discharge gas supply unit situated at an angular position between the process areas to supply purge gas to form an isolation area that isolates atmospheres of the process areas from each other, and an exhaustion unit configured to exhaust atmosphere inside the vacuum container.
    • 一种成膜装置,包括具有用于支撑基板的基板放置区域的旋转台,包括容器和顶板的真空容器,构造成打开和关闭顶板的开闭机构,布置成穿过的反应气体喷嘴 并且由所述容器的外壁支撑,以相对于所述旋转台的旋转中心位于不同的角度位置,以面对所述基板放置区域通过的区域,所述反应气体喷嘴具有沿径向布置的气体排出口, 将相应的反应气体供应到晶片,从而形成相应的处理区域,放电气体供应单元位于处理区域之间的角位置处,以供应净化气体,以形成隔离区域,隔离区域将过程区域的气氛彼此隔离;以及 排气单元构造成排出真空容器内的气氛。
    • 2. 发明授权
    • Controlling surface chemistry on solid substrates
    • 控制固体基质上的表面化学
    • US06951827B2
    • 2005-10-04
    • US10221247
    • 2001-03-15
    • Arthur L. UtzLudo B. F. Juurlink
    • Arthur L. UtzLudo B. F. Juurlink
    • C23C16/04C23C16/26C23C16/44C23C16/455C23C16/48C30B25/10C30B33/00C30B33/04H01L21/31H01S1/00
    • C23C16/4551C23C16/04C23C16/047C23C16/26C23C16/483C30B25/105C30B29/36C30B33/00C30B33/04
    • By exposing precursor molecules traveling in a molecular beam to a narrow bandwidth laser beam (hu) tuned to a vibrational resonance frequency of the molecules and aimed orthogonal to the molecular beam (FIG. 6A), only those molecules having velocity (va) along trajectory (A) orthogonal to the laser beam are excited, becoming several orders of magnitude more reactive, affording a high degree of control over precise locations of reactions of molecules. Controlling a reaction on a surface of a solid substrate, includes; (a) obtaining a precursor molecule that includes (or can be reacted to form) species to be reacted with the substrate; (b) creating a molecular beam (eg., supersonic) that includes the precursor molecule; (c) vibrationally exciting the molecule with the laser beam tuned to a vibrational resonance frequency of the molecule; and (d) causing the exciting molecule to impinge on the substrate, enabling reactions (deposition, etching . . . ) of the species with the substrate.
    • 通过将在分子束中行进的前体分子暴露于调谐到分子的振动共振频率并且与分子束正交的目标(图6A)的窄带宽激光束(hu),仅具有沿轨迹的速度(va)的分子 与激光束正交的(A)被激发,变成几个数量级的反应性,提供了对分子反应精确位置的高度控制。 控制固体基材表面上的反应,包括: (a)获得包含(或可以反应形成)待与基底反应的物质的前体分子; (b)产生包括前体分子的分子束(例如超音速); (c)使激光束调谐到分子的振动共振频率来振动激发分子; 和(d)使激发分子撞击到基底上,使得能够与基底进行物质的反应(沉积,蚀刻...)。
    • 4. 发明授权
    • Plasma jet system
    • 等离子喷射系统
    • US5951771A
    • 1999-09-14
    • US719823
    • 1996-09-30
    • Daniel V. RaneyMichael Scott HeuserStephen M. JaffeC. B. Shepard, Jr.
    • Daniel V. RaneyMichael Scott HeuserStephen M. JaffeC. B. Shepard, Jr.
    • C30B29/04C23C16/27C23C16/44C23C16/455C23C16/513H05H1/42C23C4/00
    • C23C16/4551C23C16/513H05H1/42
    • A plasma jet CVD system includes gas injectors and a stand-off ring. The gas injectors have outlet holes preferably flared to approach the expansion angle of the injected jet, thereby keeping the holes substantially free from entrained atomic hydrogen. The injectors are arranged counter-rotational to the swirl of the primary jet, providing a more uniform mixture of hydrocarbons and atomic hydrogen. The stand-off ring provides vents for cooler gases to enter the nozzle, thereby decreasing the overall temperature of the injectors and decreasing the temperature gradient experienced by the injectors, thereby preventing injector cracking. In addition the vents reduce shear, thereby increasing jet velocity and increasing the deposition rate for the coating. In addition, a new method of injector design permits optimal mixing characteristics to be obtained across various recipes whereby the ratio of the mass flux of the primary flow of the jet to the mass flux of the injected flow from the downstream injectors is kept constant.
    • 等离子体喷射CVD系统包括气体喷射器和支架环。 气体喷射器具有出口孔,其优选地扩张以接近喷射射流的膨胀角,从而保持孔基本上不含夹带的原子氢。 喷射器被布置成与主射流的漩涡相反旋转,提供烃和原子氢的更均匀的混合物。 支座环为较冷气体提供通风口进入喷嘴,从而降低喷射器的总体温度并降低喷射器所经历的温度梯度,从而防止喷油器破裂。 此外,通风口减少剪切,从而增加喷射速度并增加涂层的沉积速率。 此外,喷射器设计的新方法允许在各种配方中获得最佳的混合特性,由此射流的一次流的质量流量与来自下游喷射器的喷射流的质量通量的比率保持恒定。
    • 5. 发明授权
    • Solid film growth apparatus
    • 固体膜生长装置
    • US5025751A
    • 1991-06-25
    • US366185
    • 1989-06-14
    • Shinichiro TakataniShigeo GotoMasahiko KawataKenji Hiruma
    • Shinichiro TakataniShigeo GotoMasahiko KawataKenji Hiruma
    • C23C16/44C23C16/455C30B25/02C30B25/14
    • C23C16/4551C30B25/02C30B25/14C30B29/40Y10S148/169
    • A solid film forming apparatus, e.g., an MO-MBE (Metal-Organic Molecular Beam Epitaxy) apparatus, wherein evacuatable containers isolated from a growth chamber by a switching device and connected to raw material gas introduction pipings are provided between the growth chamber for a solid film, e.g., a compound semiconductor, and raw material gas introduction pipings. Growth of the solid film is controlled by opening and closing the switching device and evacuating the container at least while the switching device is closed during the growth of the solid film. An undesired influence on the growing film due to residual gas in the containers which are not used for growth can be prevented and, hence, interception and introduction of the raw material gas into the growth chamber can be performed with remarkably high controllability, and films of superior abruptness of the interface between films, e.g., the heterojunction of the compound semiconductor, can be obtained.
    • 一种固体成膜装置,例如MO-MBE(金属有机分子束外延)装置,其中通过开关装置从生长室隔离并连接到原料气体导入管的可排出容器设置在生长室之间用于 固体膜,例如化合物半导体和原料气体导入管。 至少在固体膜生长期间开关装置关闭时,通过打开和关闭开关装置并抽出容器来控制固体膜的生长。 可以防止由于不用于生长的容器中的残留气体对生长的膜产生不期望的影响,因此可以以非常高的可控性进行原料气体截留和引入生长室,并且可以进行膜的 可以获得膜之间的界面的优异的突变性,例如化合物半导体的异质结。
    • 7. 发明授权
    • Method for etching and controlled chemical vapor deposition
    • 蚀刻和控制化学气相沉积的方法
    • US4468283A
    • 1984-08-28
    • US451450
    • 1982-12-17
    • Irfan Ahmed
    • Irfan Ahmed
    • C23C16/44C23C16/455C23F1/12C30B25/14H01L21/306B05D5/12C23C11/00H01L7/36
    • C23C16/45504C23C16/4551C23C16/45593C23F1/12C30B25/14Y10S118/90Y10S156/917Y10S438/935
    • A high velocity stream of gas comprising of either the carrier gas or one or more film forming or removing components is shot through a shooting means such as a nozzle or orifice in the form of a high speed stream of gas in a chemical vapor deposition growth chamber or within an attachment receiving reaction gases from such a chamber. This gas or mixture of gases entrains all of the adjacent gases within the vicinity of the shooting nozzle or orifice and is subsequently swept through a diffusion tube. The diffusion tube compresses and exhausts the gas mixture at a pressure sufficient to drive the combined gas mixture through a heat exchanger and finally back into the growth chamber. The gases within the growth chamber are provided for entrainment downstream to a heated base or substrate which is being coated with a thin film or epitaxial layer of film forming components contained in a carrier gas. The entrained temperature adjusted gas mixture together with the high velocity gas mixture is reintroduced upstream of the same heated base or substrates in the growth chamber.
    • 包括载气或一种或多种成膜或去除组分的高速气流可以通过诸如在化学气相沉积生长室中以高速气流形式的喷嘴或孔口的射击装置 或者在接收来自这种室的反应气体的附件内。 这种气体或气体混合物将所有相邻的气体夹带在喷嘴或孔口附近,随后被扫过扩散管。 扩散管以足以驱动合并的气体混合物通过热交换器并最终回到生长室的压力来压缩和排出气体混合物。 生长室内的气体被提供用于夹带在加热的基底或基底的下游,该基底或基底被涂覆有载体气体中包含的成膜组分的薄膜或外延层。 夹带温度调节的气体混合物与高速气体混合物再次引入生长室中相同加热的碱或基底的上游。
    • 8. 发明申请
    • ATOMIC LAYER DEPOSITION APPARATUS USING NEUTRAL BEAM AND METHOD OF DEPOSITING ATOMIC LAYER USING THE SAME
    • 使用中性光束的原子层沉积装置和使用其沉积原子层的方法
    • US20110162581A1
    • 2011-07-07
    • US13050507
    • 2011-03-17
    • Geun-Young YeomDo-Haing LeeByoung-Jae ParkKyeong-Joon Ahn
    • Geun-Young YeomDo-Haing LeeByoung-Jae ParkKyeong-Joon Ahn
    • C23C16/48C23C16/455
    • C23C16/45536C23C16/452C23C16/4551C23C16/45544
    • Disclosed are an atomic layer deposition apparatus using a neutral beam and a method of depositing an atomic layer using the apparatus, capable of converting an ion beam into a neutral beam and radiating it onto a substrate to be treated. The method uses an apparatus for supplying a first reaction gas containing a material that cannot be chemisorbed onto a substrate to be treated into a reaction chamber in which the substrate is loaded, and forming a first reactant adsorption layer containing a material that cannot be chemisorbed onto the substrate; and radiating a neutral beam generated by the second reaction gas onto the substrate on which the first reactant adsorption layer is formed, and removing a material not chemisorbed onto the substrate from the first reactant adsorption layer to form a second reactant adsorption layer. It is possible to perform a process without damage due to charging with the apparatus for depositing an atomic layer using a neutral beam and the method of depositing an atomic layer using the apparatus.
    • 公开了使用中性光束的原子层沉积设备和使用该设备沉积原子层的方法,其能够将离子束转换成中性光束并将其辐射到待处理的衬底上。 该方法使用一种装置,用于将含有不能被化学吸附的材料的第一反应气体提供到待处理的基材上,并将其加载到其中装载基材的反应室中,以及形成含有不能被化学吸附的材料的第一反应物吸附层 基材; 并且将由所述第二反应气体产生的中性束辐射到形成有所述第一反应物吸附层的基板上,并从所述第一反应物吸附层除去未化学吸附到所述基板上的材料,以形成第二反应物吸附层。 可以通过使用中性光束对用于沉积原子层的装置进行充电而进行无损伤的处理以及使用该装置沉积原子层的方法。
    • 9. 发明授权
    • Atomic layer deposition apparatus using neutral beam and method of depositing atomic layer using the same
    • 使用中性光束的原子层沉积设备和使用其沉积原子层的方法
    • US07919142B2
    • 2011-04-05
    • US11348471
    • 2006-02-07
    • Geun-Young YeomDo-Haing LeeByoung-Jae ParkKyeong-Joon Ahn
    • Geun-Young YeomDo-Haing LeeByoung-Jae ParkKyeong-Joon Ahn
    • C23C16/00C23C14/28C23C14/30H05B6/00H05B7/00
    • C23C16/45536C23C16/452C23C16/4551C23C16/45544
    • Disclosed are an atomic layer deposition apparatus using a neutral beam and a method of depositing an atomic layer using the apparatus, capable of converting an ion beam into a neutral beam and radiating it onto a substrate to be treated. The method uses an apparatus for supplying a first reaction gas containing a material that cannot be chemisorbed onto a substrate to be treated into a reaction chamber in which the substrate is loaded, and forming a first reactant adsorption layer containing a material that cannot be chemisorbed onto the substrate; and radiating a neutral beam generated by the second reaction gas onto the substrate on which the first reactant adsorption layer is formed, and removing a material not chemisorbed onto the substrate from the first reactant adsorption layer to form a second reactant adsorption layer. It is possible to perform a process without damage due to charging with the apparatus for depositing an atomic layer using a neutral beam and the method of depositing an atomic layer using the apparatus.
    • 公开了使用中性光束的原子层沉积设备和使用该设备沉积原子层的方法,其能够将离子束转换成中性光束并将其辐射到待处理的衬底上。 该方法使用一种装置,用于将含有不能被化学吸附的材料的第一反应气体提供到待处理的基材上,并将其加载到其中装载基材的反应室中,以及形成含有不能被化学吸附的材料的第一反应物吸附层 基材; 并且将由所述第二反应气体产生的中性束辐射到形成有所述第一反应物吸附层的基板上,并从所述第一反应物吸附层除去未化学吸附到所述基板上的材料,以形成第二反应物吸附层。 可以通过使用中性光束对用于沉积原子层的装置进行充电而进行无损伤的处理以及使用该装置沉积原子层的方法。