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1. 发明公开

US20240329076A1 MEMS ACCELEROMETER WITH VERTICAL STOPS 审中-公开
公开(公告)号：US20240329076A1
公开(公告)日：2024-10-03
申请号：US18295232
申请日：2023-04-03
申请人： NXP USA, Inc.
发明人： Jun Tang , Jinglun Li , Andrew C. McNeil , Aaron A. Geisberger
IPC分类号： G01P15/08 , B81C1/00
CPC分类号： G01P15/08 , B81C1/00198 , G01P2015/0837
摘要： A MEMS device includes a substrate, a set of spring, and a proof mass suspended above and coupled to the substrate by the springs. Each spring includes a corresponding anchor on the substrate and a beam extending away from that anchor. Each beam has a fixed end that is coupled to the anchor by a first linkage at one end of the beam proximal to the anchor and a free end that is coupled to the proof mass by a second linkage at an end of the beam that is distal to the anchor. The anchors are arranged symmetrically around a center of the proof mass. The proof mass translates vertically with respect to the substrate and when a vertical displacement of the proof mass toward the substrate reaches a predefined value, the free end of each spring contacts the substrate and prevents the proof mass from contacting the substrate.

2. 发明授权

US09753279B2 Electrostatically actuated oscillating structure with oscillation starting phase control, and manufacturing and driving method thereof 有权
公开(公告)号：US09753279B2
公开(公告)日：2017-09-05
申请号：US14564237
申请日：2014-12-09
申请人： STMicroelectronics S.r.l. , STMicroelectronics International N.V.
发明人： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
IPC分类号： G02B26/08 , H04N9/31 , H02N1/00 , B81B3/00 , G02B27/10
CPC分类号： G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
摘要： An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.

3. 发明授权

US09718683B2 System and method for precision transport, positioning, and assembling of longitudinal nano-structures 有权
公开(公告)号：US09718683B2
公开(公告)日：2017-08-01
申请号：US14675306
申请日：2015-03-31
申请人： The Johns Hopkins University
发明人： Chia-Ling Chien , Donglei Fan , Robert Cammarata
IPC分类号： G01N27/447 , B81C3/00 , B82Y40/00 , B03C5/00 , B81C99/00 , B81C1/00 , B81B3/00 , B81B5/00 , B22F1/00 , B82Y30/00
CPC分类号： B81C3/004 , B03C5/005 , B22F1/0022 , B22F1/0025 , B22F1/0096 , B81B3/0097 , B81B5/00 , B81C1/00007 , B81C1/00182 , B81C1/00198 , B81C99/002 , B82Y30/00 , B82Y40/00 , Y10T428/24942 , Y10T428/26 , Y10T428/2933 , Y10T428/2938
摘要： A method for assembling multi-component nano-structures that includes dispersing a plurality of nano-structures in a fluid medium, and applying an electric field having an alternating current (AC) component and a direct current (DC) component to the fluid medium containing the plurality of nano-structures. The electric field causes a first nano-structure from the plurality of nano-structures to move to a predetermined position and orientation relative to a second nano-structure of the plurality of nano-structures such that the first and second nano-structures assemble into a multi-component nano-structure.

4. 发明申请

US20170101306A1 MICROMECHANICAL COMPONENT HAVING TWO AXES OF OSCILLATION AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT 审中-公开
公开(公告)号：US20170101306A1
公开(公告)日：2017-04-13
申请号：US15317231
申请日：2015-05-06
申请人： Robert Bosch GmbH
发明人： Stefan Pinter
IPC分类号： B81B3/00 , G02B26/10 , G02B7/182 , B81C1/00 , G02B26/08
CPC分类号： B81B3/0043 , B81B2201/042 , B81B2203/0118 , B81B2203/0307 , B81B2203/058 , B81C1/00198 , G02B7/1821 , G02B26/0833 , G02B26/101 , G02B26/105
摘要： A micromechanical component is described as having a part that is movable relative to a holder. The part is suspended on the holder at least via a suspension structure. Self-oscillations of the suspension structure are inducible such that, relative to the holder, the movable part can be set into a resonant oscillatory movement about a first axis of rotation and into a quasi-static oscillatory movement about a second axis of rotation oriented at an incline to the first axis of rotation by the suspension structure set into the self-oscillations. The movable part is connected directly or via at least one spring to at least one oscillation node point of at least one of the induced self-oscillations of the suspension structure. In addition, a method is described for producing a micromechanical component.

5. 发明授权

US09337173B2 Three-dimensional inter-chip contact through vertical displacement MEMS 有权
公开(公告)号：US09337173B2
公开(公告)日：2016-05-10
申请号：US14826261
申请日：2015-08-14
申请人： International Business Machines Corporation
发明人： Kenneth J. Goodnow , Todd E. Leonard , Stephen G. Shuma , Peter A. Twombly
IPC分类号： H01L25/065 , H01L21/00 , H01H59/00 , H01L23/528 , H01L23/538 , B81B3/00 , H01L25/00 , B81C1/00
CPC分类号： H01L25/0657 , B81B3/0056 , B81B3/0086 , B81C1/00158 , B81C1/00182 , B81C1/00198 , H01H59/0009 , H01L23/528 , H01L23/5386 , H01L23/5389 , H01L25/50 , H01L2225/06527 , H01L2924/0002 , H01L2924/1434 , H01L2924/1461 , H01L2924/00
摘要： An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

6. 发明申请

US20150353354A1 SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBLING OF LONGITUDINAL NANO-STRUCTURES 有权
标题翻译：用于精确运输，定位和组装长期纳米结构的系统和方法
公开(公告)号：US20150353354A1
公开(公告)日：2015-12-10
申请号：US14675306
申请日：2015-03-31
申请人： The Johns Hopkins University
发明人： Chia-Ling Chien , Donglei Fan , Robert Cammarata
IPC分类号： B81C3/00 , B81B5/00 , B81B3/00 , B81C99/00 , B81C1/00
CPC分类号： B81C3/004 , B03C5/005 , B22F1/0022 , B22F1/0025 , B22F1/0096 , B81B3/0097 , B81B5/00 , B81C1/00007 , B81C1/00182 , B81C1/00198 , B81C99/002 , B82Y30/00 , B82Y40/00 , Y10T428/24942 , Y10T428/26 , Y10T428/2933 , Y10T428/2938
摘要： A method for assembling multi-component nano-structures that includes dispersing a plurality of nano-structures in a fluid medium, and applying an electric field having an alternating current (AC) component and a direct current (DC) component to the fluid medium containing the plurality of nano-structures. The electric field causes a first nano-structure from the plurality of nano-structures to move to a predetermined position and orientation relative to a second nano-structure of the plurality of nano-structures such that the first and second nano-structures assemble into a multi-component nano-structure.
摘要翻译：一种用于组装多组分纳米结构的方法，其包括在流体介质中分散多个纳米结构，以及将具有交流（AC）组分和直流（DC）组分的电场施加到含有多个纳米结构。电场使得来自多个纳米结构的第一纳米结构相对于多个纳米结构的第二纳米结构移动到预定位置和取向，使得第一和第二纳米结构组装成多组分纳米结构。

7. 发明授权

US09044808B2 System and method for precision transport, positioning, and assembling of longitudinal nano-structures 有权
标题翻译：用于精密运输，定位和组装纵向纳米结构的系统和方法
公开(公告)号：US09044808B2
公开(公告)日：2015-06-02
申请号：US13147744
申请日：2010-03-03
申请人： Chia-Ling Chien , Donglei Fan , Robert Charles Cammarata
发明人： Chia-Ling Chien , Donglei Fan , Robert Charles Cammarata
IPC分类号： B22F1/00 , B82Y40/00 , B03C5/00 , B82Y30/00
CPC分类号： B81C3/004 , B03C5/005 , B22F1/0022 , B22F1/0025 , B22F1/0096 , B81B3/0097 , B81B5/00 , B81C1/00007 , B81C1/00182 , B81C1/00198 , B81C99/002 , B82Y30/00 , B82Y40/00 , Y10T428/24942 , Y10T428/26 , Y10T428/2933 , Y10T428/2938
摘要： A method for assembling multi-component nano-structures that includes dispersing a plurality of nano-structures in a fluid medium, and applying an electric field having an alternating current (AC) component and a direct current (DC) component to the fluid medium containing the plurality of nano-structures. The electric field causes a first nano-structure from the plurality of nano-structures to move to a predetermined position and orientation relative to a second nano-structure of the plurality of nano-structures such that the first and second nano-structures assemble into a multi-component nano-structure.
摘要翻译：一种用于组装多组分纳米结构的方法，其包括在流体介质中分散多个纳米结构，以及将具有交流（AC）组分和直流（DC）组分的电场施加到含有多个纳米结构。电场使得来自多个纳米结构的第一纳米结构相对于多个纳米结构的第二纳米结构移动到预定位置和取向，使得第一和第二纳米结构组装成多组分纳米结构。

8. 发明申请

US20150111332A1 METHOD AND DEVICE OF MEMS PROCESS CONTROL MONITORING AND PACKAGED MEMS WITH DIFFERENT CAVITY PRESSURES 有权
标题翻译： MEMS过程控制监测和包装MEMS与不同孔隙压力的方法和装置
公开(公告)号：US20150111332A1
公开(公告)日：2015-04-23
申请号：US14521441
申请日：2014-10-22
申请人： mCube Inc.
发明人： TE-HSI "TERRENCE" LEE
IPC分类号： B81C1/00 , B81C99/00
CPC分类号： B81B7/0041 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00198 , B81C1/00269 , B81C1/00293 , B81C99/004
摘要： A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.
摘要翻译：因此，制造集成MEMS器件的方法及其结果。可以在集成的CMOS-MEMS封装内提供包括MEMS膜覆盖物的控制过程监视器，以监测封装泄漏或除气。 MEMS膜罩可以分隔上部空腔区域，以使其经受脱气的下腔体泄漏。可以通过经由多个位移传感器监测膜盖的挠曲来检测这些空腔之间的压差的差异变化。可以分别用配置有第一和第二MEMS腔的第一和第二MEMS器件来制造集成的MEMS器件。可以通过蚀刻封盖结构来形成单独的空腔，以使每个空腔具有单独的空腔体积。通过利用集成MEMS器件内的CMOS层的除气特性，第一和第二MEMS空腔可被配置为具有不同的腔压力。

9. 发明授权

US5417801A Process to manufacture bushings for micromechanical elements 失效
标题翻译：制造微机械元件衬套的工艺
公开(公告)号：US5417801A
公开(公告)日：1995-05-23
申请号：US083226
申请日：1993-06-29
申请人： Igor I. Bol
发明人： Igor I. Bol
IPC分类号： B23P15/00 , B81C1/00 , G03F7/00 , H01H1/00 , H02N1/00 , H01L21/302
CPC分类号： B81C1/00198 , B23P15/00 , G03F7/00 , H01H1/0036 , H02N1/002 , B81B2201/035
摘要： A process in which micromechanical bushings can be made and the application of such process to making micromechanical devices. Bushings are made on a surface of a stationary structure extending from a planar surface. The bushings are separated from the stationary structure by a sacrificial layer. The stationary structure, the bushing and the planar surface are then further processed by coating with a second sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by a curved, undercut edge such as gear on stool. Final processing includes removing both sacrificial layers to free the movable structure, the bushing, and the stationary structure from each other. The bushing is trapped between the movable structure and the stationary structure but able to move freely.
摘要翻译：可以制造微机械套管的过程以及制造微机械装置的这种工艺的应用。衬套在从平坦表面延伸的固定结构的表面上制成。衬套通过牺牲层与静止结构分离。然后通过用第二牺牲层和结构层进行涂覆来进一步处理固定结构，衬套和平面表面。结构层被图案化成可移动的结构，其通过弯曲的底切边缘（例如在凳子上的齿轮）保持在固定结构上。最终处理包括移除两个牺牲层以使可移动结构，衬套和固定结构彼此释放。衬套被夹在可移动结构和固定结构之间，但能够自由移动。

10. 发明授权

US10502758B2 Inertia sensor and method of manufacturing the same 有权
公开(公告)号：US10502758B2
公开(公告)日：2019-12-10
申请号：US15554264
申请日：2016-11-09
申请人： Hitachi, Ltd.
发明人： Takashi Shiota , Tatsuyuki Saito , Tatemi Ido , Noriyuki Sakuma , Yuudai Kamada , Atsushi Isobe , Chisaki Takubo
IPC分类号： G01P15/125 , G01P15/08 , B81C1/00
CPC分类号： G01P15/125 , B81C1/00198 , G01P15/0802 , G01P2015/0862
摘要： Airtightness in a cavity of an inertial sensor (acceleration sensor) is increased to achieve high sensitivity. In the acceleration sensor having movable electrodes VE1, VE2 and fixed electrodes FE1, FE2, the fixed electrodes are formed by portions surrounded by a through hole TH1 provided in a cap layer CL, and the through hole is filled with an insulating film IF1 and polysilicon P and has a wide portion (WP). The wide portion has a gap SP that is not filled with the insulating film IF1 and the polysilicon P, and the gap SP is filled with the interlayer insulating film ID. With such a configuration, degassing can be exhausted through the gap (airway) SP in a pressure reducing step.

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