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    • 9. 发明授权
    • Tool head, with wireless monitoring system, for performing industrial operations
    • 工具头,带无线监控系统,用于执行工业操作
    • US09517502B2
    • 2016-12-13
    • US14316965
    • 2014-06-27
    • Comau S.p.A.
    • Giovanni Di StefanoMauro MaestriValeria Serpi
    • B21D3/02B23P19/04B25J11/00B23K37/02B25J13/00B25J15/00B21D39/02B25J13/08
    • B21D39/023B23K37/0258B23P19/04B25J11/005B25J13/006B25J13/085B25J15/0019B25J19/0045G05B2219/33192
    • A system for performing industrial operations comprises at least one tool head provided with a tool and at least one sensor associated to the tool head. The system further comprises a control module mounted on the tool head including a data-acquisition unit connected to the sensor configured for acquiring the data coming from said at least one sensor, and a wireless transmission unit connected to the acquisition unit for receiving the aforesaid acquired data and for transmitting the data acquired to a receiving unit in a wireless mode. The module further comprises a device for storing electrical energy for electrical supply of the control module. The system further comprises a wireless charging system for charging the device for storing electrical energy comprising a first charging device carried by the tool head and connected to the energy-storage device and a second charging device associated to a stationary workstation.
    • 用于执行工业操作的系统包括至少一个具有工具的工具头和与工具头相关联的至少一个传感器。 所述系统还包括安装在所述工具头上的控制模块,所述控制模块包括连接到所述传感器的数据采集单元,所述传感器被配置为用于获取来自所述至少一个传感器的数据;以及无线传输单元,连接到所述获取单元, 数据和用于以无线模式发送获取到接收单元的数据。 该模块还包括用于存储用于控制模块的电力供应的电能的装置。 该系统还包括无线充电系统,用于对用于存储电能的设备进行充电,该电能包括由工具头承载并连接到能量存储装置的第一充电装置和与固定工作站相关联的第二充电装置。
    • 10. 发明授权
    • Water lift mechanism with electrostatic pickup and method for transferring a workpiece
    • 具有静电拾音器的水升降机构和用于传送工件的方法
    • US06354791B1
    • 2002-03-12
    • US08835972
    • 1997-04-11
    • Joe WytmanIvo Raaijmakers
    • Joe WytmanIvo Raaijmakers
    • B25J1500
    • H01L21/67748B25J19/0045H01L21/6831
    • A method and apparatus for transferring a semiconductor wafer in both a theta axis and a z-axis is provided. The apparatus is able to maintain maximum process and wafer throughput while minimizing the footprint of the processing machine by utilizing the concept of “vertical integration” to maximize the use of process slots and minimize the machine foot print. The wafer lift apparatus includes a bipolar electrostatic pick-up for engaging the article at an off-center position near an edge thereof. The electrostatic pick-up is positioned near one end of a transfer arm, the other end of the transfer arm being connected to a drive means for rotating the transfer arm and electrostatic pick-up in the theta axis, or vertically moving the transfer arm and electrostatic pick-up in the z-axis. The electrostatic pick-up is preferably connected to a power source by inductive coupling. According to the method of the present invention, the electrostatic pick-up is positioned beneath the wafer at an off-center position, lifted to contact a lower surface of the wafer, and energized to create an attractive force upon the wafer. The wafer is then lifted and rotated to remove the wafer from the end effector. Finally, the wafer is lifted to a pre/post processing plane located above the processing plane.
    • 提供了一种用于在θ轴和z轴上传送半导体晶片的方法和装置。 该装置能够通过利用“垂直整合”的概念来最大化处理槽的使用并使机器脚印最小化,从而保持最大的处理和晶片生产量,同时最小化处理机的占地面积。 晶片提升装置包括用于在靠近其边缘的偏心位置接合物品的双极静电拾取器。 静电拾取器位于传送臂的一端附近,传送臂的另一端连接到驱动装置,用于在θ轴上旋转传送臂和静电拾取器,或垂直移动传送臂和 静电拾取在z轴上。 静电拾取器优选地通过电感耦合连接到电源。 根据本发明的方法,静电拾取器位于晶片的偏心位置下方,被提升以接触晶片的下表面,并被激励以在晶片上产生吸引力。 然后将晶片提升并旋转以从末端执行器移除晶片。 最后,将晶片提升到位于处理平面上方的预处理/后处理平面。