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    • 1. 发明申请
    • LED illumination system
    • US20080259607A1
    • 2008-10-23
    • US12149570
    • 2008-05-05
    • Junichi ShimadaYoichi Kawakami
    • Junichi ShimadaYoichi Kawakami
    • F21V29/00
    • F21V23/06F21K9/20F21V29/505F21Y2115/10H01L25/0753H01L33/641H01L2924/0002H01L2924/00
    • The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
    • 3. 发明授权
    • LED illumination system
    • LED照明系统
    • US07834434B2
    • 2010-11-16
    • US12149570
    • 2008-05-05
    • Junichi ShimadaYoichi Kawakami
    • Junichi ShimadaYoichi Kawakami
    • H01L23/495
    • F21V23/06F21K9/20F21V29/505F21Y2115/10H01L25/0753H01L33/641H01L2924/0002H01L2924/00
    • The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
    • 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。连接器部分14上的导热层12与设置在插座的开口的内表面上的导热层热接触 。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。其结果是, 可以防止LED芯片16,并且可以形成发射大量光的LED照明系统。
    • 4. 发明授权
    • LED illumination system
    • LED照明系统
    • US07400029B2
    • 2008-07-15
    • US10539079
    • 2003-12-15
    • Junichi ShimadaYoichi Kawakami
    • Junichi ShimadaYoichi Kawakami
    • H01L29/06
    • F21V23/06F21K9/20F21V29/505F21Y2115/10H01L25/0753H01L33/641H01L2924/0002H01L2924/00
    • The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
    • 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。 导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。 连接器部14上的导热层12与设置在插座的开口的内表面上的导热层进行热接触。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。 结果,可以防止LED芯片16的温度升高,并且可以形成发射大量光的LED照明系统。
    • 6. 发明授权
    • Remote control system
    • 遥控系统
    • US08734431B2
    • 2014-05-27
    • US12308380
    • 2007-06-15
    • Jun-ichi ShimadaAtsushi Nishikawa
    • Jun-ichi ShimadaAtsushi Nishikawa
    • G05D1/12
    • A61B34/70A61B34/30A61B90/30A61B2017/00212A61B2034/301A61B2090/061A61B2090/3614
    • A remote control system capable of precise operations or treatments in which the visual recognition and operation portions are as close to each other as possible, including: a) an imaging device for taking an image of the object; b) a manipulation tool having at its tip an illuminator for casting a spot light onto the object; c) a driver for changing the position of the manipulation tool; d) an external display unit for displaying an image; e) an input unit for allowing an operator to specify a position corresponding to the display of the external display unit; f) a distance calculator for calculating the distance between the position specified through the input unit and the position of the spot light cast from the illuminator onto the object; and g) a controller for controlling, based on the aforementioned distance, the driver so as to bring the tip of the manipulation tool closer to the specified position.
    • 一种遥控系统,其能够精确地操作或处理,其中视觉识别和操作部分尽可能接近彼此,包括:a)用于拍摄对象的图像的成像装置; b)操作工具,在其顶端具有用于将点光投射到物体上的照明器; c)用于改变操作工具的位置的驱动器; d)用于显示图像的外部显示单元; e)用于允许操作者指定与外部显示单元的显示相对应的位置的输入单元; f)距离计算器,用于计算通过输入单元指定的位置与从照明器投射到物体上的点光的位置之间的距离; 以及g)用于基于前述距离控制驾驶员以使操纵工具的尖端更接近指定位置的控制器。