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    • 2. 发明授权
    • Electronic apparatus
    • 电子仪器
    • US6122185A
    • 2000-09-19
    • US121061
    • 1998-07-21
    • Fumiyasu UtsunomiyaYoshifumi YoshidaMiwa Moriuchi
    • Fumiyasu UtsunomiyaYoshifumi YoshidaMiwa Moriuchi
    • G04C10/00G04G19/02H02M3/07H02M3/18
    • G04C10/00G04G19/02H02M3/07
    • An electronic apparatus is comprised of a generator 11 in which a voltage is changed as time elapses, a booster circuit 12 for boosting an output voltage of the generator 11, and an oscillator circuit 13 that drives the booster circuit 12. When the voltage of the generator 11 changes as time elapses so that the voltage exceeds the minimum driving voltage of the oscillator circuit 13, the oscillator circuit 13 obtains power for starting oscillation from the generator 11. The oscillator circuit 13 that has started oscillation drives the booster circuit 12 to thereby boost the output voltage generated by the generator 11. Since the oscillator circuit 13 after starting oscillation continuously performs oscillation using the power boosted by the booster circuit 12, even if the voltage of the generator 11 changes as time elapses so that the voltage becomes lower than the minimum driving voltage of the oscillator circuit 13, the voltage can be boosted to the minimum driving voltage of the oscillator circuit 13 or higher.
    • 电子设备包括其中电压随时间而改变的发电机11,用于升压发电机11的输出电压的升压电路12以及驱动升压电路12的振荡电路13。 发电机11随时间而变化,使得电压超过振荡电路13的最小驱动电压,振荡电路13从发生器11获得启动振荡的电力。开始振荡的振荡电路13驱动升压电路12 升压发电机11产生的输出电压。由于启动振荡后的振荡电路13使用升压电路12升压的功率连续地进行振荡,所以即使发电机11的电压随时间而变化,电压变低 振荡器电路13的最小驱动电压,电压可以升高到osc的最小驱动电压 错觉电路13或更高。
    • 3. 发明授权
    • Cooling unit
    • 冷却单元
    • US6112525A
    • 2000-09-05
    • US107588
    • 1998-06-16
    • Yoshifumi YoshidaMatsuo KishiMinao Yamamoto
    • Yoshifumi YoshidaMatsuo KishiMinao Yamamoto
    • F25B21/02G05D23/24H01L35/00H01L35/28H01L35/30H01L35/32F25B21/00
    • H01L35/30F25B21/02G05D23/2401H01L35/00F25B2321/0212
    • A cooling unit is structured such that a temperature sensor is formed on at least one of the substrates that form a thermoelectric conversion device to which thermoelectric elements are connected, an input/output electrode extending from the temperature sensor and an electrode formed on the other surface opposed to the substrate on which the temperature sensor is formed are connected to each other by electrically conductive material, and a control circuit for controlling a current supplied to the thermoelectric conversion device according to an output of the temperature sensor is connected thereto. By this structure, only one surface of the substrate is subjected to a manufacturing process, and there is no need for a temperature sensor such as a thermistor to be supplied as a discrete component for mounting on a substrate of the thermoelectric conversion device. There is also no need for a temperature sensor to be connected directly on a surface of the thermoelectric conversion device which is to be adjusted in temperature, thereby being capable of easily and accurately adjusting the temperature at the thermoelectric conversion device.
    • 冷却单元被构造成使得温度传感器形成在形成热电元件连接的热电转换装置的至少一个基板上,从温度传感器延伸的输入/输出电极和形成在另一表面上的电极 与其上形成有温度传感器的基板相对的导电材料彼此连接,并且用于根据温度传感器的输出控制供应到热电转换装置的电流的控制电路被连接到其上。 通过这种结构,仅对衬底的一个表面进行制造处理,并且不需要诸如热敏电阻的温度传感器作为用于安装在热电转换器件的衬底上的分立元件。 也不需要将温度传感器直接连接在要调节温度的热电转换装置的表面上,从而能够容易且精确地调节热电转换装置的温度。
    • 4. 发明授权
    • Thermoelectric conversion component
    • 热电转换元件
    • US6084172A
    • 2000-07-04
    • US47860
    • 1998-03-25
    • Matsuo KishiMinao YamamotoYoshifumi Yoshida
    • Matsuo KishiMinao YamamotoYoshifumi Yoshida
    • H01L35/16H01L35/00H01L35/32
    • H01L35/32H01L35/00
    • A .pi.-type thermoelectric conversion component detects and controls temperature and at the same time exhibits a cooling performance inherently possessed by the thermoelectric conversion component without the need for mounting a discrete temperature detecting unit. To achieve this, a temperature detecting unit, such as a thin film thermistor or doped semiconductor region, is directly integrated on a surface of a substrate forming the thermoelectric component. In one embodiment, a monocrystalline silicon wafer is used as at least one of the opposing substrates of the thermoelectric conversion component, a temperature detecting unit having a diffused resistor is formed therein. An electrode of the temperature detecting unit is connected to an electrode formed on the opposing substrate to reduce the thermal load. There is thus no need for mounting a discrete temperature detecting unit, which places a thermal load on the thermoelectric conversion component, and it is thus possible to perform temperature detection from the same substrate to which a power supply of the thermoelectric conversion component is applied. It is also possible to obtain a cooling performance inherently possessed by the thermoelectric conversion component without the need to increase the performance criteria of the device to incorporate a temperature detecting unit.
    • pi型热电转换部件检测和控制温度,同时表现出热电转换部件固有地具有的冷却性能,而不需要安装离散温度检测单元。 为了实现这一点,诸如薄膜热敏电阻或掺杂半导体区域的温度检测单元直接集成在形成热电组件的基板的表面上。 在一个实施例中,使用单晶硅晶片作为热电转换元件的相对基板中的至少一个,在其中形成具有扩散电阻器的温度检测单元。 温度检测单元的电极连接到形成在相对基板上的电极,以减少热负荷。 因此,不需要安装将热负荷放置在热电转换元件上的离散温度检测单元,因此可以从施加热电转换元件的电源的同一基板进行温度检测。 也可以获得由热电转换部件固有地具有的冷却性能,而不需要增加装置的温度检测单元的性能标准。
    • 7. 发明授权
    • Photoelectric conversion semiconductor device
    • 光电转换半导体器件
    • US5744850A
    • 1998-04-28
    • US733967
    • 1996-10-18
    • Keiji SatoYutaka SaitohTadao Akamine
    • Keiji SatoYutaka SaitohTadao Akamine
    • H01L31/10H01L27/144H01L31/107H01L31/075H01L31/105H01L31/117
    • H01L27/1443H01L31/107
    • A novel photoelectric conversion semiconductor device having an amplifying function which can be readily fabricated is provided. An N.sup.+ -type impurity domain whose impurity concentration is higher than that of an N.sup.- -type semiconductor substrate is formed on one surface thereof and a P.sup.+ -type impurity domain is formed on the opposite surface. An SiO.sub.2 film, an Si.sub.3 N.sub.4 film and an SiO.sub.2 film are formed extending to the domain of the N.sup.- -type semiconductor substrate, exceeding the N.sup.+ -type impurity domain. An anode electrode is formed on the N.sup.+ -type impurity domain and a cathode electrode is formed on the P.sup.+ -type impurity domain. A polysilicon gate electrode is formed on the SiO.sub.2 film, i.e. the top layer, and an Al gate electrode is formed thereon. A reverse voltage is applied between the anode electrode and the cathode electrode and a predetermined voltage is applied between the anode electrode and the Al gate electrode.
    • 提供了具有可容易地制造的放大功能的新颖的光电转换半导体器件。 在其一个表面上形成杂质浓度高于N型半导体衬底的杂质浓度的N +型杂质区域,在相对的表面上形成P +型杂质区域。 形成了延伸到N型半导体衬底的超过N +型杂质域的SiO 2膜,Si 3 N 4膜和SiO 2膜。 在N +型杂质区域上形成阳极电极,在P +型杂质区域上形成阴极电极。 在SiO 2膜即顶层上形成多晶硅栅电极,在其上形成Al栅电极。 在阳极电极和阴极电极之间施加反向电压,并且在阳极电极和Al栅电极之间施加预定电压。