专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4936504A Process for producing a clad plate 失效
标题翻译：复合板的制造方法
公开(公告)号：US4936504A
公开(公告)日：1990-06-26
申请号：US384762
申请日：1989-07-25
申请人： Hiroshi Arai , Seiichi Takeda , Masahiro Sasaki , Kazuhisa Yokoyama
发明人： Hiroshi Arai , Seiichi Takeda , Masahiro Sasaki , Kazuhisa Yokoyama
IPC分类号： B23K20/00 , B23K20/16 , B23K20/227
CPC分类号： B23K20/16 , B23K20/227
摘要： The present invention provides a process for producing a clad plate which comprises a first step of forming a coil by taking up two or more metal sheets as clad materials and a thin sheet of heat-resistant steel which works as a separator material while these members are overlaid on one another and a second step of vacuum heat-treating the resultant coil.

2. 发明授权

US4846904A Martensitic stainless steel having excellent hardness by subzero treatment 失效
标题翻译：马氏体不锈钢具有优异的硬度通过零度处理
公开(公告)号：US4846904A
公开(公告)日：1989-07-11
申请号：US195841
申请日：1988-05-19
申请人： Hiroshi Arai , Tadahiko Murakami , Kazuo Mashimo , Jyou Tanioka
发明人： Hiroshi Arai , Tadahiko Murakami , Kazuo Mashimo , Jyou Tanioka
IPC分类号： C22C38/00 , C21D6/00 , C21D6/04 , C22C38/18 , C22C38/20 , C22C38/22 , C22C38/38 , C22C38/40 , C22C38/58
CPC分类号： C21D6/002 , C21D6/04 , C22C38/18 , C22C38/20 , C22C38/22 , C22C38/38 , C22C38/40
摘要： This invention provides the following stainless steels called invention steel 1 and invention steel 2.Invention steel 1 is a subzero treatment hardening type martensitic stainless steel characterized by comprising not more than 0.4% by weight of C, not more than 0.4% by weight of N, not more than 15% by weight of Mn, not more than 12% by weight of Ni, 10 to 23% by weight of Cr, not more than 3.0% by weight of Mo, not more than 5.0% by weight of Cur, not more than 2.0% by weight of Si, and the remaining portion consisting of inevitable impurities and Fe and satisfying the following formaulae (1), (2) and (3),[Cr %]+1.5[Si %]+[Mo %]-[Mn %)]-1.3[Ni %]-[Cu %]-19 [C %]-19[N %].ltoreq.12.0 Formula (1)27.5.ltoreq.[Cr %]+1.3[SDi %]+1.3[Mn %]+1.5[Ni %]+[Cu %]+[Mo %]+15[C %]+20[N %].ltoreq.32.0 Formula (2)and1.3[Ni %]+[Mn %]+[Cu %]>4.0 Formula (3)Invention steel is a subzero treatment hardening type martensitic stainless characterized by comprising not more than 0.4% by weight of C, not more than 0.4% by weight of Mn, not more than 3.0% by weight of Ni, 10 to 23% by weight of Cr, not more than 3.0% by weight of Mo, not more than 2.0% by weight of Cu, not more than 2.0% by weight of Si and the remaining portion consisting of inevitable impurities and Fe and satisfying the above formulae (1) and (2), and the following formula (4),1.3[Ni %]+[Mn %]+[Cu %].ltoreq.4.0 Formula (4)

3. 发明授权

US4771819A Manufacturing apparatus for sheet metal according to continuous casting 失效
标题翻译：根据连铸的金属板制造装置
公开(公告)号：US4771819A
公开(公告)日：1988-09-20
申请号：US97412
申请日：1987-09-15
申请人： Naoto Toyama , Hiroshi Yoshimura , Hidetoshi Abo , Yoshio Sawamura , Hiroshi Arai
发明人： Naoto Toyama , Hiroshi Yoshimura , Hidetoshi Abo , Yoshio Sawamura , Hiroshi Arai
IPC分类号： B22D11/06
CPC分类号： B22D11/0622
摘要： Manufacturing apparatus for continuous casting of sheet metal includes a pair of chill rolls and a vessel containing molten metal. One of the rolls is of a larger diameter, on which the other roll of a smaller diameter is arranged at a position corresponding to a clock position of 12-3 O'clock. The vessel has an open forward end and is arranged to contact the larger roll or leave a gap as narrow as possible. The smaller roll is partially disposed in molten metal in the vessel. When the two rolls are driven at the same peripheral velocity in the opposite direction, molten metal is fed between the rolls to form a sheet metal which may be continuously peeled from the larger roll surface.
摘要翻译：连续铸造金属板的制造装置包括一对冷却辊和容纳熔融金属的容器。其中一个辊具有较大的直径，其中较小直径的另一个辊布置在对应于12-3时钟的时钟位置的位置。容器具有敞开的前端，并且布置成接触较大的辊或留下尽可能窄的间隙。较小的辊部分地设置在容器中的熔融金属中。当两个辊以相反的方向以相同的圆周速度被驱动时，熔融金属被供给到辊之间以形成可以从较大辊表面连续剥离的金属片。

4. 发明授权

US07179417B2 Sn—Zn lead-free solder alloy, its mixture, and soldered bond 失效
标题翻译： Sn-Zn无铅焊料合金，其混合物和焊接键
公开(公告)号：US07179417B2
公开(公告)日：2007-02-20
申请号：US11435614
申请日：2006-05-17
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： B23K35/14 , B23K35/26
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , H05K3/3484 , H05K2201/0224
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content being effective quantity for forming a protective magnesium oxide film on the solder surface and also for destroying said oxide film during soldering. When solder paste is preserved, the inside of solder particle is protected by the protective magnesium oxide film formed on the surface of solder particle, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at elevated temperature during soldering, a state where said protective oxide film is easily destroyed is obtained, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有6〜10重量％的锌，还含有0.0015〜0.1重量％的镁的Sn系焊料合金构成的，所述镁含量是在焊料表面上形成保护性氧化镁膜的有效量，并且还用于在焊接期间破坏所述氧化膜。当焊膏被保存时，焊料颗粒的内部由形成在焊料颗粒表面上的保护性氧化镁膜保护，锌和活化剂之间的反应被抑制，从而保持了稳定性，并且在高温下焊接时，获得容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

5. 发明授权

US07070736B2 Sn-Zn lead-free solder alloy and soldered bond 失效
标题翻译： Sn-Zn无铅焊料合金和焊接键
公开(公告)号：US07070736B2
公开(公告)日：2006-07-04
申请号：US10468606
申请日：2002-11-18
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： B23K35/26 , B23K20/04
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K2101/42
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有至少还含有0.0015-0.03％（重量）镁和0.0010（重量％）的6至10％重量的锌的Sn基焊料合金构成的至0.006重量％的铝。在不仅在制冷下还能在室温以上保存焊膏的情况下，通过在焊料粒子表面形成的保护性镁/氧化铝膜来保护焊锡颗粒的内部，抑制锌与活化剂的反应，从而保持稳定性提高，并且在焊接时的高温下，焊料合金进入容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

6. 发明授权

US07175805B2 Tin-zinc lead-free solder, its mixture, and solder-joined part 失效
标题翻译：锡锌无铅焊料，其混合物和焊接部分
公开(公告)号：US07175805B2
公开(公告)日：2007-02-13
申请号：US10468607
申请日：2002-11-18
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： B23K35/14 , B23K35/26
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , H05K3/3484 , H05K2201/0224
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content being effective quantity for forming a protective magnesium oxide film on the solder surface and also for destroying said oxide film during soldering. When solder paste is preserved, the inside of solder particle is protected by the protective magnesium oxide film formed on the surface of solder particle, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at elevated temperature during soldering, a state where said protective oxide film is easily destroyed is obtained, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有6〜10重量％的锌，还含有0.0015〜0.1重量％的镁的Sn系焊料合金构成的，所述镁含量是在焊料表面上形成保护性氧化镁膜的有效量，并且还用于在焊接期间破坏所述氧化膜。当焊膏被保存时，焊料颗粒的内部由形成在焊料颗粒表面上的保护性氧化镁膜保护，锌和活化剂之间的反应被抑制，从而保持了稳定性，并且在高温下焊接时，获得容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

7. 发明申请

US20060210420A1 SN-ZN LEAD-FREE SOLDER ALLOY, ITS MIXTURE, AND SOLDERED BOND 失效
标题翻译： SN-ZN无铅焊接合金，其混合物和焊接粘合剂
公开(公告)号：US20060210420A1
公开(公告)日：2006-09-21
申请号：US11435614
申请日：2006-05-17
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： C22C13/02
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , H05K3/3484 , H05K2201/0224
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content being effective quantity for forming a protective magnesium oxide film on the solder surface and also for destroying said oxide film during soldering. When solder paste is preserved, the inside of solder particle is protected by the protective magnesium oxide film formed on the surface of solder particle, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at elevated temperature during soldering, a state where said protective oxide film is easily destroyed is obtained, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有6〜10重量％的锌，还含有0.0015〜0.1重量％的镁的Sn系焊料合金构成的，所述镁含量是在焊料表面上形成保护性氧化镁膜的有效量，并且还用于在焊接期间破坏所述氧化膜。当焊膏被保存时，焊料颗粒的内部由形成在焊料颗粒表面上的保护性氧化镁膜保护，锌和活化剂之间的反应被抑制，从而保持了稳定性，并且在高温下焊接时，获得容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

8. 发明授权

US07175804B2 Sn-Zn lead-free solder alloy, and solder junction portion 失效
标题翻译： Sn-Zn无铅焊料合金和焊接部分
公开(公告)号：US07175804B2
公开(公告)日：2007-02-13
申请号：US11433325
申请日：2006-05-12
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： B23K35/26 , B23K20/04
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K2101/42
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有至少还含有0.0015-0.03％（重量）镁和0.0010（重量％）的6至10％重量的锌的Sn基焊料合金构成的至0.006重量％的铝。在不仅在制冷下还能在室温以上保存焊膏的情况下，通过在焊料粒子表面形成的保护性镁/氧化铝膜来保护焊锡颗粒的内部，抑制锌与活化剂的反应，从而保持稳定性提高，并且在焊接时的高温下，焊料合金进入容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

9. 发明授权

US5362443A Method and apparatus for disposal of medical waste 失效
标题翻译：处置医疗废物的方法和设备
公开(公告)号：US5362443A
公开(公告)日：1994-11-08
申请号：US996403
申请日：1992-12-23
申请人： Mitsuyuki Tanaka , Masahiro Michino , Yasutaka Fujihira , Takashi Nakamura , Kisaburo Kohmura , Toshiro Asaoka , Akio Ohya
发明人： Mitsuyuki Tanaka , Masahiro Michino , Yasutaka Fujihira , Takashi Nakamura , Kisaburo Kohmura , Toshiro Asaoka , Akio Ohya
IPC分类号： A61L11/00 , A61L2/06 , A61L2/24
CPC分类号： A61L11/00 , Y10S241/606
摘要： A method and an apparatus for simply disposing medical waste from a medical institution on site. The method comprises crushing medical waste in a closed container, exhausting air out of the container, sterilizing the air before releasing it into the atmosphere, and filling the container with a high-pressure steam having a temperature between 110.degree. C. and 150.degree. C. to sterilize the crushed medical waste. The apparatus is equipped with a pressure container having at least one air-tight seal, an internal waste crushing mechanism such as blades, an internal supply of steam, a valve for exhausting air from the container, and an air sterilizer for the exhausted air.
摘要翻译：一种从现场医疗机构简单处置医疗废物的方法和装置。该方法包括将密封容器中的医疗废物破碎，将空气排出容器，在将其排放到大气中之前对空气进行灭菌，并用温度在110℃至150℃的高压蒸汽填充容器对被粉碎的医疗废物进行消毒。该装置配备有至少一个气密密封的压力容器，诸如叶片的内部废料破碎机构，内部蒸汽供应源，用于从容器排出空气的阀以及用于排出的空气的空气消毒器。

10. 发明申请

US20060204397A1 SN-ZN LEAD-FREE SOLDER ALLOY, AND SOLDER JUNCTION PORTION 失效
标题翻译： SN-ZN无铅焊接合金和焊接接头部分
公开(公告)号：US20060204397A1
公开(公告)日：2006-09-14
申请号：US11433325
申请日：2006-05-12
申请人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
发明人： Masaaki Yoshikawa , Haruo Aoyama , Hirotaka Tanaka
IPC分类号： C22C13/02
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K2101/42
摘要： An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.
摘要翻译：根据本发明的Sn-Zn无铅焊料合金是以至少含有至少还含有0.0015-0.03％（重量）镁和0.0010（重量％）的6至10％重量的锌的Sn基焊料合金构成的至0.006重量％的铝。在不仅在制冷下还能在室温以上保存焊膏的情况下，通过在焊料粒子表面形成的保护性镁/氧化铝膜来保护焊锡颗粒的内部，抑制锌与活化剂的反应，从而保持稳定性提高，并且在焊接时的高温下，焊料合金进入容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式