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2. 发明申请

US20080303149A1 Electronic Component 审中-公开
标题翻译：电子元器件
公开(公告)号：US20080303149A1
公开(公告)日：2008-12-11
申请号：US10593535
申请日：2005-01-21
申请人： Toshiharu Takayama , Ryuusuke Suzuki , Takefumi Nakamori
发明人： Toshiharu Takayama , Ryuusuke Suzuki , Takefumi Nakamori
IPC分类号： H01L23/488
CPC分类号： H01C1/16 , H01C1/144 , H01C13/02 , H01G4/40 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H05K1/111 , H05K3/3436 , H05K2201/094 , H05K2201/10045 , H05K2201/10234 , Y02P70/613 , H01L2924/00
摘要： An electronic component including, on one surface of a substrate (1), a plurality of circuit elements and external terminals each consisting of a conductive protrusion (9) for the circuit elements is provided with a structure capable of resisting an external force after mounting. Each of the circuit elements includes, as constituent elements, a pair of electrodes (2) and a resistive element (3) or a dielectric contacting with the pair of electrodes (2), each circuit element is covered with an overcoat (7) while the electrodes (2) are partially exposed as lands (4), the conductive protrusion (9) includes a fixedly bonding member, the conductive protrusion (9) is fixedly bonded to each of the lands (4) by the fixedly bonding member, at least three lands (4b) of the lands (4) are larger in area than the other lands (4a), the electronic component can stand alone while the conductive protrusion (9) contacts with a flat if the conductive protrusion (9) is fixedly bonded only to each of the larger-area lands (4b), and the conductive protrusions are all formed by fixedly bonding conductive balls (10) substantially equal in size to entire surfaces of the respective lands (4).
摘要翻译：一种电子部件，在基板（1）的一个表面上具有由电路元件用的导电突起（9）构成的多个电路元件和外部端子，其具有能够抵抗安装后的外力的结构。每个电路元件包括作为组成元件的一对电极（2）和电阻元件（3）或与该对电极（2）接触的电介质，每个电路元件被外涂层（7）覆盖，同时电极（2）部分地露出为焊盘（4），导电突起（9）包括固定接合部件，导电突起（9）通过固定接合部件固定地接合到每个焊盘（4）上，如果导电突起（9）固定地，导电突起（9）与平坦接触，则电子部件可以独立地平坦地区域（4）中的至少三个焊盘区域（4b）的面积大于其他焊盘（4a）仅与每个较大区域焊盘（4b）接合，并且导电突起全部通过将导电球（10）固定地结合到大致相等于各个焊盘（4）的整个表面上而形成。

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