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    • 2. 发明申请
    • OPTICAL WRITER FOR FLEXIBLE FOILS
    • 柔性纤维的光学写作
    • US20130335504A1
    • 2013-12-19
    • US13909529
    • 2013-06-04
    • Micronic Mydata AB
    • Torbjorn SandstromCarl During
    • B41J2/47
    • B41J2/47G03F7/2002G03F7/2051G03F7/70816G03F9/00
    • The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.
    • 所公开的技术涉及柔性基板的图案化。 一种实施方式可用于在柔性基底上生产柔性显示器和其它电子设备。 基底可以是通常为50-150微米厚的塑料膜,并且图案特征的尺寸通常可以在1-10微米的范围内。 更大和更小的结构是可能的。 通过曝光光敏抗蚀剂或者漆,或通过光与基底之间的其它热或光化学相互作用,通过光学曝光来完成图案化。 基底通常可作为辊加载,并且在曝光和其它加工之后,其可以在第二输出辊上卷起,所谓的卷对卷(R-to-R)处理。
    • 4. 发明授权
    • Method and apparatus for mura detection and metrology
    • mura检测和计量的方法和装置
    • US08160351B2
    • 2012-04-17
    • US12105568
    • 2008-09-08
    • Torbjörn SandströmLars Stiblert
    • Torbjörn SandströmLars Stiblert
    • G06K9/00
    • G01N21/956G01N2021/9513G02F1/1309G03F1/84G06T7/0006G06T7/001G06T2207/30121G06T2207/30148G06T2207/30164
    • The invention addresses the lack of comprehensive and quantitative methods for measurements of unwanted visual “mura” effects in displays and image sensors. Mura is generated by errors that are significantly smaller than what is needed for the function of the device, and sometimes smaller than the random variations in the patterns or structures. Capturing essentially all mura defects in a workpiece in a short time requires a daunting combination of sensitivity, statistical data reduction and speed. The invention devices an inspection method, e.g. optical, which maximizes the sensitivity to mura effects and suppresses artifacts from the mura inspection hardware itself and from noise. It does so by scanning the sensor, e.g. a high-resolution camera, creating a region of high internal accuracy across the mura effects. One important example is for mura related to placement errors, where a stage with better than 10 nanometer precision within a 100 mm range is created. A sampling scheme reduces the data volume and separates between instrument errors and real defects based on their different geometrical signatures. The high-resolution camera scans sparse lines at an angle to the dominating directions of expected mura defects, creating extended sensor fields with high internal precision, and quantifying edge placements in small windows in said extended fields. The mura is classified and presented as type, location and severity.
    • 本发明解决了缺乏用于在显示器和图像传感器中测量不需要的视觉“mura”效果的全面和定量的方法。 Mura由显着小于设备功能所需的错误产生,并且有时小于图案或结构中的随机变化。 在短时间内捕获工件基本上所有的mura缺陷都需要灵敏度,统计数据减少和速度的惊人组合。 本发明装置检查方法,例如 光学,其最大限度地提高对mura效果的敏感性,并抑制mura检测硬件本身的伪影和噪声。 它通过扫描传感器,例如 一个高分辨率的摄像头,创造出一个高度内部准确度的区域在mura效果。 一个重要的例子就是与定位错误相关的mura,其中创建了100mm范围内优于10纳米精度的阶段。 采样方案可以减少数据量,并根据其不同的几何特征分离仪器误差和实际缺陷。 高分辨率摄像机以与预期mura缺陷的主导方向成一定角度扫描稀疏线,创建具有高内部精度的扩展传感器场,并在所述扩展场中的小窗口中量化边缘放置。 mura被分类并呈现为类型,位置和严重性。
    • 5. 发明授权
    • Method of iterative compensation for non-linear effects in three-dimensional exposure of resist
    • 抗蚀剂三维曝光中非线性效应的迭代补偿方法
    • US08067134B2
    • 2011-11-29
    • US12604317
    • 2009-10-22
    • Torbjörn SandströmMikael WahlstenMats EkbergAnders Svensson
    • Torbjörn SandströmMikael WahlstenMats EkbergAnders Svensson
    • G03F9/00
    • G03F7/70416G03F7/2022G03F7/70383Y10S430/146
    • The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
    • 本公开的领域是通过在感光材料例如光致抗蚀剂,感光聚酰亚胺等中的分级曝光来制造三维地形结构。 这样的图案可以被写成直接用作光学,机械,流体等组分,例如, 扩散器,非反射表面,菲涅尔透镜和菲涅耳棱镜,计算机生成的全息图,小透镜阵列等,或者用作通过复制制造这些部件的主人。 复制可以通过本领域已知的模制,压制,压花,电镀,蚀刻来完成。 本公开包括使用具有高分辨率图案发生器的高伽马厚抗蚀剂使用薄抗蚀剂中的被动吸收组分的描述,其使用包括抗蚀剂下半部分中的至少一个焦平面的多个焦平面,以及对抗蚀剂的图案化和调整的迭代模拟 曝光地图。
    • 6. 发明授权
    • Method of compensation for bleaching of resist during three-dimensional exposure of resist
    • 抗蚀剂三维曝光时抗蚀剂漂白的补偿方法
    • US08057971B2
    • 2011-11-15
    • US12604313
    • 2009-10-22
    • Torbjörn SandströmMikael WahlstenMats EkbergAnders Svensson
    • Torbjörn SandströmMikael WahlstenMats EkbergAnders Svensson
    • G03F9/00G03C5/00
    • G03F7/70416G03F7/2022G03F7/70383Y10S430/146
    • The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
    • 本公开的领域是通过在感光材料例如光致抗蚀剂,感光聚酰亚胺等中的分级曝光来制造三维地形结构。 这样的图案可以被写成直接用作光学,机械,流体等组分,例如, 扩散器,非反射表面,菲涅尔透镜和菲涅耳棱镜,计算机生成的全息图,小透镜阵列等,或者用作通过复制制造这些部件的主人。 复制可以通过本领域已知的模制,压制,压花,电镀,蚀刻来完成。 本公开包括使用具有高分辨率图案发生器的高伽马厚抗蚀剂使用薄抗蚀剂中的被动吸收组分的描述,其使用包括抗蚀剂下半部分中的至少一个焦平面的多个焦平面,以及对抗蚀剂的图案化和调整的迭代模拟 曝光地图。
    • 7. 发明申请
    • Method and apparatus for performing pattern reconnection after individual or multipart alignment
    • 在单独或多对齐之后执行模式重新连接的方法和装置
    • US20110257777A1
    • 2011-10-20
    • US12929981
    • 2011-02-28
    • Mikael WahlstenPer-Erik Gustafsson
    • Mikael WahlstenPer-Erik Gustafsson
    • G06F17/50
    • G03F9/7003G03F7/70383H05K3/4679
    • A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.
    • 一种用于在制造多层系统级封装叠层中的直接写入机中构图工件的第二层的方法。 所述工件具有第一层,所述第一层具有以任意形式的模具形式的多个电气部件。 每个组件具有连接点,其中一些需要在组件之间连接。 包括分布在第一层中的管芯的连接点的不同区域的第一图案与对准的不同要求相关联。 该方法包括以下步骤:a。 检测对于系统级封装堆叠或所放置组件的选定特征的对准要求高的第一模式中的神圣区域; b。 检测第一图案的拉伸区域,其允许对与系统级封装堆叠体的其它特征进行对准的较低要求; C。 通过计算包括原始电路图案的变换的经调整的第一图案数据来变换第一图案,使得:i。 相邻神圣区域中的连接点在可预设的对准偏差参数内对齐; 并且ii。 在拉伸区域的连接点的图案中补偿神圣区域中的相应连接点的位置之间的偏差; d。 根据调整的图案数据在工件的层上写入图案。 第一图案也可以与第二图案同时匹配。