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2. 发明授权

US6091252A Method, apparatus and system for testing bumped semiconductor components 有权
标题翻译：用于测试碰撞半导体元件的方法，装置和系统
公开(公告)号：US6091252A
公开(公告)日：2000-07-18
申请号：US312381
申请日：1999-05-14
申请人： Salman Akram , Warren M. Farnworth , Alan G. Wood , David R. Hembree
发明人： Salman Akram , Warren M. Farnworth , Alan G. Wood , David R. Hembree
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , G01R1/06 , G01R31/26
CPC分类号： G01R1/0466
摘要： A method, apparatus and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The apparatus includes an interconnect having patterns of contact members adapted to electrically contact the contact bumps. Each contact member includes an array of one or more electrically conductive projections in electrical communication with an associated conductor. The projections form contact members for retaining individual contact bumps on the semiconductor components. The projections can be pillars having angled faces covered with a conductive layer. Alternately the projections can be a material deposited on the substrate, or can be microbumps formed on multi layered tape bonded to the substrate. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare bumped dice or bumped chip scale packages.
摘要翻译：提供了一种用于与具有接触凸块的半导体部件建立临时电连通的方法，装置和系统。该装置包括具有适于电接触接触凸点的接触构件图案的互连。每个接触构件包括与相关导体电连通的一个或多个导电突起的阵列。突起形成接触构件，用于保持半导体部件上的各个接触凸块。突起可以是具有覆盖有导电层的成角度表面的柱。替代地，突起可以是沉积在基底上的材料，或者可以是在结合到基底的多层带上形成的微胶囊。互连可以用于晶片级测试系统中，用于测试包含在晶片上的骰子，或者在用于测试裸露骰子或凸起的芯片级封装的芯片级测试系统中。

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