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    • 2. 发明申请
    • Holographic image shrink film and method for manufacture thereof
    • 全息图像收缩膜及其制造方法
    • US20040188871A1
    • 2004-09-30
    • US10397191
    • 2003-03-27
    • Klaser Technology Inc.
    • Tsung-Ming ShiaoCheng-Hsiu Chen
    • B29D011/00G03H001/02
    • G03H1/028B29C39/148B29C39/18B29D11/00G03H1/0244G03H2001/0055G03H2001/185
    • A holographic image shrinkable film and the manufacture thereof is to spread a UV resin film on a shrinkable film; stick the UV resin film tightly against a metal wheel engraved with a holographic pattern, holographic film or separating type hot stamping film; illuminate the UV resin film with an UV lamp so as to harden the UV resin film instantly; and remove the harden UV resin film from the metal wheel, the holographic film, or separating type hot stamping film; the holographic pattern on the metal wheel or the holographic film is copied onto the UV resin film, or a separating type hot stamping film substrate is combined on the UV resin film. The manufacturing method according to the present invention is rather not dangerous, and a specialist is not need. Therefore, a mass production can be practiced to save production cost can be saved.
    • 全息图像收缩膜,其制造方法是将UV树脂膜铺展在可收缩膜上; 将UV树脂膜紧贴在刻有全息图案,全息膜或分离型热冲压膜的金属轮上; 用UV灯照亮紫外线树脂薄膜,使UV树脂薄膜立即硬化; 并从金属轮,全息膜或分离型热冲压膜中除去硬化的UV树脂膜; 将金属轮或全息膜上的全息图复印到UV树脂膜上,或者在UV树脂膜上组合分离型热冲压膜基板。 根据本发明的制造方法并不危险,不需要专家。 因此,可以实现批量生产节省生产成本节省。
    • 4. 发明申请
    • Manufacturing method for printing circuit
    • 打印电路的制造方法
    • US20070102103A1
    • 2007-05-10
    • US11267496
    • 2005-11-07
    • Tom Ku
    • Tom Ku
    • B44C1/17
    • H05K3/046H05K2203/0522H05K2203/0528Y10T156/19
    • A manufacturing method for a printing circuit uses an adhesive as a printing material to print a line pattern of a printing circuit on a carrier by means of printing, and then cause an adhesive to stick with a mother film with a release type metal to allow a part of the carrier with the adhesive to pull and attach itself with a metal film, and another part without the adhesive does not pull and attach itself with the metal film such that a metal line is formed on the carrier. The manufacturing method can simplify the manufacturing process of the printing circuit, the line fabrication is very fast, the production efficiency can be enhanced and the production cost is low.
    • 印刷电路的制造方法使用粘合剂作为印刷材料,通过印刷在载体上印刷印刷电路的线图案,然后使粘合剂与具有释放型金属的母膜粘合,以允许 具有粘合剂的载体的一部分用金属膜拉伸和附着,而没有粘合剂的另一部分不会拉动并附着在金属膜上,使得在载体上形成金属线。 制造方法可以简化印刷电路的制造工艺,线路制造非常快,生产效率可以提高,生产成本低。
    • 5. 发明申请
    • Mother plate for deep lines pattern impression and manufacturing thereof
    • 母版板深印花图案及其制作
    • US20040201138A1
    • 2004-10-14
    • US10411238
    • 2003-04-11
    • Klaser Technology Inc.
    • Hsing-Mao WangMin-Yi Hsu
    • B29C033/40
    • B29C33/3857B29C33/40B29C33/424B29C2035/0827B29L2031/7224Y10T156/10
    • The UV resin used in the present invention is spread on the surface of a mother mold with lines. Illuminate UV light to harden the UV resin after it penetrated the lines completely. Thereby, to the depth and the shape of the lines of a pattern with deep lines, a complete duplication can be obtained in order to solve the deficiency of mother plate manufacturing technique at present. A seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate. The present invention provides an easy and novel plates assembly technique that gives consideration to both the lines in succeeding electroplating and impression procedures and required flatness for seams. Thereby, a seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate.
    • 用于本发明的UV树脂用母线在母模的表面上分散。 照射紫外线,使紫外线树脂完全穿透线后硬化。 因此,为了深层线的深度和形状,可以获得完全复制以解决目前母板制造技术的缺陷。 当将多个母板组件组装到大母板上时,两个母板之间的接缝更平滑并且对其两侧的线结构的影响较小。 本发明提供了一种容易和新颖的板组装技术,其考虑了后续电镀和印模过程中的两条线以及所需的接缝平面度。 因此,当将多个母板单元组装到大母板上时,两个母板之间的接缝更平滑并且对其两侧的线结构的影响较小。