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    • 4. 发明申请
    • Substrate holder having electrostatic chuck and method of fabricating the same
    • 具有静电卡盘的基板支架及其制造方法
    • US20060016554A1
    • 2006-01-26
    • US11178279
    • 2005-07-12
    • Ho Ahn
    • Ho Ahn
    • C23C16/00B32B37/00B32B38/04
    • H01L21/6831
    • Provided is a substrate holder including a susceptor having edge protrusion formed on edge thereof and an electrostatic chuck mounted inside the edge protrusion and on the susceptor. The electrostatic chuck is attached to the susceptor by a gel adhesive sheet containing a plurality of wires and a silicon or corrosion-resistant epoxy based material is filled between the electrostatic chuck and the edge protrusion. The planarity of the electrostatic chuck can be maintained accurately when the electrostatic chuck is attached to the susceptor and clogging of cooling gas supply holes and leakage of cooling gas through a space between the electrostatic chuck and the susceptor can be prevented.
    • 提供了一种基板保持器,其包括具有形成在其边缘上的边缘突起的基座和安装在边缘突起内部和基座上的静电卡盘。 静电卡盘通过包含多根电线的凝胶粘合片附接到基座,并且在静电卡盘和边缘突起之间填充硅或耐腐蚀的环氧基材料。 当静电卡盘安装在基座上时,可以精确地保持静电卡盘的平面性,并且可以防止冷却气体供应孔的堵塞,并且可以防止冷却气体通过静电卡盘和基座之间的空间的泄漏。
    • 10. 发明申请
    • METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATES
    • 制造多层陶瓷基板的方法
    • US20120061002A1
    • 2012-03-15
    • US13321939
    • 2010-05-26
    • Won-Mook Kim
    • Won-Mook Kim
    • C03B29/00
    • H05K3/4697H05K3/4629H05K2203/0278H05K2203/061H05K2203/1476Y10T156/1082
    • In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.
    • 在制造多层陶瓷基板的方法中,通过分别对多个未烧结的陶瓷片加压来形成第一和第二片叠。 形成孔以穿透第二片叠。 通过将第二纸张堆叠定位在第一纸张堆叠上来形成第三预备纸张堆叠。 第一和第二薄膜分别形成在第三预备片堆叠的顶部和底部。 通过对第一薄膜和第二薄膜和第三预薄片叠加压来形成第三薄片叠层。 将第一和第二薄膜从第三片叠层移除,从而形成预备的多层陶瓷衬底。 预备的多层陶瓷基板被烧结。 因此,由于平模和薄膜,多层陶瓷基板的制造工艺的可靠性和稳定性得到充分改善,成本降低。