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1. 发明申请

US20190239001A1 DIGITAL MICROPHONE ASSEMBLY WITH IMPROVED FREQUENCY RESPONSE AND NOISE CHARACTERISTICS 审中-公开
公开(公告)号：US20190239001A1
公开(公告)日：2019-08-01
申请号：US16375193
申请日：2019-04-04
申请人： Knowles Electronics, LLC , Knowles Electronics, LLC
发明人： Mohammad SHAJAAN , Claus Erdmann FÜRST , Per Flemming HØVESTEN , Kim Spetzler BERTHELSEN , Henrik THOMSEN
IPC分类号： H04R19/04 , H04R19/00 , H04R3/06 , G06F3/16 , H04R3/02
CPC分类号： H04R19/04 , G06F3/162 , H04R3/02 , H04R3/06 , H04R19/005 , H04R2201/003
摘要： A microphone assembly includes an acoustic filter with a first highpass cut-off frequency. The microphone assembly additionally includes a forward signal path and a feedback signal path. The forward signal path is configured to amplify or buffer an electrical signal generated by a transducer in response to sound and to convert the electrical signal to a digital signal. The feedback signal path is configured to generate a digital control signal based on the digital signal and to generate and output a sequence of variable current pulses based on the digital control signal. The variable current pulses suppress frequencies of the electrical signal below a second highpass cut-off frequency, higher than the first highpass cut-off frequency.

2. 发明公开

US20240223975A1 ELECTRICAL CABLE ASSEMBLY FOR EAR-WORN HEARING DEVICES 审中-公开
公开(公告)号：US20240223975A1
公开(公告)日：2024-07-04
申请号：US18148461
申请日：2022-12-30
申请人： KNOWLES ELECTRONICS, LLC
发明人： MATTHEW MANLEY , RANDALL A. SANECKI
IPC分类号： H04R25/00 , H01B7/40
CPC分类号： H04R25/609 , H01B7/40 , H04R25/604 , H04R25/656 , H04R2225/0216 , H04R2225/57
摘要： An ear-worn hearing device and an electrical cable assembly for such a hearing device are disclosed. The electrical cable assembly includes a discrete retention member rotationally and axially fixing the retention member at least partially about an end portion of an electrical conductor conduit. The retention member also axially and rotationally fixes the cable assembly to a housing. The housing can include an acoustic receiver and be configured for insertion at least partially in the user's ear. Alternatively, the housing can be part of a connector plug that mates with a base unit worn outside the user's ear.

3. 发明公开

US20240214747A1 Microelectromechanical Systems Sensor with Stabilization Circuit 审中-公开
公开(公告)号：US20240214747A1
公开(公告)日：2024-06-27
申请号：US18087327
申请日：2022-12-22
申请人： Knowles Electronics, LLC
发明人： Mark Niederberger
IPC分类号： H04R19/04 , H03F3/183
CPC分类号： H04R19/04 , H03F3/183 , H03F2200/03 , H04R2201/003
摘要： A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes an amplifier including an amplifier input stage having an input, coupled to an output of the MEMS motor, the amplifier input stage having a negative input resistance, where a sum of a series resistance of the MEMS motor at the input and the negative input resistance is less than zero, and wherein application of a signal from the output of the MEMS motor to the input of the amplifier input stage produces a negative real part of input current. The electrical circuit still further includes a stabilization circuit having an output coupled to the input of the amplifier input stage, where the stabilization circuit injects a compensation current at the input of the amplifier input stage that offsets at least a portion of the negative real part of input current.

4. 发明公开

US20240208802A1 MEMS DIE AND MEMS-BASED SENSOR 审中-公开
公开(公告)号：US20240208802A1
公开(公告)日：2024-06-27
申请号：US18600185
申请日：2024-03-08
申请人： Knowles Electronics, LLC
发明人： Peter V. Loeppert , Michael Pedersen , Vahid Naderyan
IPC分类号： B81B3/00
CPC分类号： B81B3/0021 , B81B3/0054 , B81B2201/0257 , B81B2203/0127 , B81B2203/04
摘要： A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.

5. 发明授权

US11968487B2 Adapters for microphones and combinations thereof 有权
公开(公告)号：US11968487B2
公开(公告)日：2024-04-23
申请号：US18135148
申请日：2023-04-15
申请人： Knowles Electronics, LLC
发明人： Janice LoPresti , Steve Kearey , Usha Murthy
IPC分类号： H04R1/04 , H04R19/04
CPC分类号： H04R1/04 , H04R19/04 , H04R2201/003
摘要： A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

6. 发明公开

US20240064479A1 BALANCED ARMATURE RECEIVER HAVING IMPROVED SHOCK RESISTANCE 审中-公开
公开(公告)号：US20240064479A1
公开(公告)日：2024-02-22
申请号：US17889352
申请日：2022-08-16
申请人： Knowles Electronics, LLC
发明人： Christopher L. Monti , Thomas E. Miller , Charles B. King , Kalyan Nadella , Mohammad Mohammadi
IPC分类号： H04R25/00
CPC分类号： H04R25/604 , H04R25/65
摘要： A balanced armature receiver can include a motor disposed in a case. The motor can include an armature having a first portion fixed to and extending from a yoke and a second portion extending through a coil tunnel. The second portion can have a free end-portion movably disposed in a magnet gap. The balanced armature receiver can include a damping compound-locating structure disposed on one or both of the armature and another portion of the receiver proximate the armature. The balanced armature receiver can include damping compound contacting the damping compound-locating structure and located between the armature and another portion of the receiver.

7. 发明公开

US20230417793A1 SUSPENSION FOR A MEMS VIBRATION SENSOR 审中-公开
公开(公告)号：US20230417793A1
公开(公告)日：2023-12-28
申请号：US17847979
申请日：2022-06-23
申请人： Knowles Electronics, LLC
发明人： Faisal Zaman , Shubham Shubham , Ken Deng
IPC分类号： G01P15/125 , G01P1/00
CPC分类号： G01P15/125 , G01P1/00
摘要： An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.

8. 发明授权

US11832054B2 Acoustic receivers with multiple diaphragms 有权
公开(公告)号：US11832054B2
公开(公告)日：2023-11-28
申请号：US18056582
申请日：2022-11-17
申请人： KNOWLES ELECTRONICS, LLC
发明人： Shehab Albahri , Yahui Zhang , Kalyan Nadella , Thomas Miller , Christopher Monti , Charles King , Jose Salazar
IPC分类号： H04R11/02 , H04R1/10 , H04R9/02 , H04R9/04
CPC分类号： H04R11/02 , H04R1/10 , H04R9/027 , H04R9/04
摘要： Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.

9. 发明授权

US11827511B2 Force feedback compensated absolute pressure sensor 有权
公开(公告)号：US11827511B2
公开(公告)日：2023-11-28
申请号：US17286231
申请日：2019-11-18
申请人： Knowles Electronics, LLC
发明人： Peter V. Loeppert , Michael Pedersen
IPC分类号： H04R3/00 , B81B3/00 , H04R1/32
CPC分类号： B81B3/0059 , H04R1/32 , B81B2201/0257 , B81B2201/0264
摘要： A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.

10. 发明授权

US11787688B2 Methods of forming MEMS diaphragms including corrugations 有权
公开(公告)号：US11787688B2
公开(公告)日：2023-10-17
申请号：US17099442
申请日：2020-11-16
申请人： KNOWLES ELECTRONICS, LLC
发明人： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Michael Pedersen
IPC分类号： B81C1/00 , B81B3/00 , H04R31/00 , G01L9/00
CPC分类号： B81C1/00158 , B81B3/0021 , G01L9/0042 , H04R31/003 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C2201/0132 , B81C2201/0133
摘要： A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

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