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1. 发明公开

US20230156897A1 OVER-VOLTAGE PROTECTION DEVICE 审中-公开
公开(公告)号：US20230156897A1
公开(公告)日：2023-05-18
申请号：US17674048
申请日：2022-02-17
申请人： INPAQ TECHNOLOGY CO., LTD.
发明人： I-Jang TENG , Chun Peng LIN , Hsiu Lun YEH
IPC分类号： H05F3/04
CPC分类号： H05F3/04
摘要： The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.

2. 发明授权

US10320058B2 Portable electronic device and back cover assembly thereof 有权
公开(公告)号：US10320058B2
公开(公告)日：2019-06-11
申请号：US15628721
申请日：2017-06-21
申请人： INPAQ TECHNOLOGY CO., LTD.
发明人： Po-Kai Hsu , Chih-Ming Su
IPC分类号： H01Q1/24 , H01Q1/38 , H04B5/00 , H01Q1/22 , A45C11/00 , H04B1/3888
摘要： The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

3. 发明授权

US09177710B2 SMD transformer structure and SMD transformer array 有权
标题翻译： SMD变压器结构和SMD变压器阵列
公开(公告)号：US09177710B2
公开(公告)日：2015-11-03
申请号：US14100824
申请日：2013-12-09
申请人： INPAQ TECHNOLOGY CO., LTD.
发明人： Wei-Chih Lee , Cgia-Uch Wu
IPC分类号： H01F27/02 , H01F27/06 , H01F27/26 , H01F27/28
CPC分类号： H01F27/06 , H01F27/027 , H01F27/26 , H01F27/2823 , H01F27/2885 , H01F27/292
摘要： A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).
摘要翻译： SMD变压器结构包括基板单元，磁单元，线圈单元和屏蔽单元。基板单元包括支撑基板。磁性单元包括设置在支撑基板上的至少一个磁性材料芯棒。线圈单元包括缠绕在磁性材料芯棒上的至少一个变压器线圈组件。变压器线圈组件包括缠绕在磁性材料芯棒上的多个变压器线圈，并且每个变压器线圈分别具有两个相对的端部并电连接到相应的第一电极和衬底单元的对应的第二电极。屏蔽单元包括设置在磁性材料芯棒上的至少一个磁屏蔽板。因此，SMD变压器结构不仅可以简化，以减小其尺寸，而且可以自动制造，以提高其生产效率和产品产量（可靠性）。

4. 发明申请

US20140266504A1 WIDE-BAND COMMON MODE FILTERING APPARATUS 有权
标题翻译：宽带通用模式过滤设备
公开(公告)号：US20140266504A1
公开(公告)日：2014-09-18
申请号：US13828756
申请日：2013-03-14
申请人： INPAQ TECHNOLOGY CO., LTD.
发明人： Shin Min TAI , Chien Heng CHEN , Wei Chuan CHEN , Yu Chia CHANG
IPC分类号： H03H7/01
CPC分类号： H03H7/427 , H03H7/0138
摘要： A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand.
摘要翻译：宽带共模滤波装置包括具有不同噪声滤波响应的至少两个级联共模滤波器，其中宽带共模滤波装置的截止频率处于共模的最低截止频率滤波器和宽带共模滤波装置的噪声滤波响应是共模滤波器的噪声滤波响应的叠加。在本发明的一个实施例中，宽带共模滤波装置包括具有第一滤波带的第一共模滤波器和具有与第一滤波带不同的第二滤波带的第二共模滤波器。本技术的公开允许具有不同滤波频带的级联共模滤波器形成具有满足新需求的总体滤波频带的宽带共模滤波装置。

5. 发明授权

US08422200B2 Conductive structure having an embedded electrode, and solid capacitor having an embedded electrode and method of making the same 有权
标题翻译：具有嵌入电极的导电结构和具有嵌入电极的固体电容器及其制造方法
公开(公告)号：US08422200B2
公开(公告)日：2013-04-16
申请号：US13115964
申请日：2011-05-25
申请人： Wei-Chih Lee , Ming-Tsung Chen
发明人： Wei-Chih Lee , Ming-Tsung Chen
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G9/052 , H01G9/15 , Y10T29/435
摘要： A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.
摘要翻译：具有嵌入电极的固体电容器包括基板单元，第一导电单元，第二导电单元，第一绝缘单元，第三导电单元，第二绝缘单元和端电极单元。基板单元包括基板主体和嵌入基板主体中的导电体。基板主体具有侧向开口和多个顶部开口，并且导电体具有从侧向开口暴露的横向导电区域和分别从顶部开口露出的多个顶部导电区域。第一导电单元包括分别覆盖顶部导电区域的多个第一导电层。第二导电单元包括覆盖第一导电层的第二导电层。第二导电层的孔隙率大于每个第一导电层的孔隙率。

6. 发明申请

US20130076456A1 COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有多个螺旋层结构的共模滤波器及其制造方法
公开(公告)号：US20130076456A1
公开(公告)日：2013-03-28
申请号：US13572378
申请日：2012-08-10
申请人： YU CHIA CHANG , CHI LONG LIN , CHENG YI WANG , SHIN MIN TAI
发明人： YU CHIA CHANG , CHI LONG LIN , CHENG YI WANG , SHIN MIN TAI
IPC分类号： H03H7/00 , B05D5/12
CPC分类号： H01F17/0013 , H01F2017/0066 , H01P11/003 , H03H7/09 , H03H7/427 , H03H2001/0085 , H03H2001/0092 , Y10T29/49124
摘要： A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
摘要翻译：具有多螺旋层结构的共模滤波器包括第一线圈，第二线圈，与第一线圈串联连接的第三线圈，与第二线圈串联连接的第四线圈，第一材料层和第二材料层。第二线圈设置在第一和第三线圈之间，第三线圈设置在第二和第四线圈之间。第一和第二材料层中的至少一个包括磁性材料。第一，第二，第三和第四线圈设置在第一和第二材料层之间。

7. 发明授权

US08400360B2 Coupled-loop chip antenna 有权
标题翻译：耦合芯片天线
公开(公告)号：US08400360B2
公开(公告)日：2013-03-19
申请号：US12355147
申请日：2009-01-16
申请人： Yueh-Lin Tsai , Meng Hsueh Tsai , Chin Huang Cheng
发明人： Yueh-Lin Tsai , Meng Hsueh Tsai , Chin Huang Cheng
IPC分类号： H01Q1/38
CPC分类号： H01Q7/00
摘要： A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
摘要翻译：提供了一种用于通信的环形天线，其包括作为六面体的微波基板; 第一导电层，设置在所述基板的上表面上，用于形成第一环; 第二导电层，设置在所述基板的第一侧表面上，并且电连接到馈入点和接地点; 以及第三导电层，设置在用于形成第二环的基板的下表面上。第一导电层和第二导电层在上表面和第一侧表面之间的接合处电连接，并且第二导电层和第三导电层在第一侧表面和下表面之间的接合处电连接。该天线还具有用于无线通信应用的适当带宽。

8. 发明申请

US20130010402A1 SOLID CAPACITOR AND MANUFACTURING METHOD THEREOF 有权
标题翻译：固体电容器及其制造方法
公开(公告)号：US20130010402A1
公开(公告)日：2013-01-10
申请号：US13176736
申请日：2011-07-05
申请人： WEI-CHIH LEE , MING-TSUNG CHEN
发明人： WEI-CHIH LEE , MING-TSUNG CHEN
IPC分类号： H01G9/15 , H01G9/00
CPC分类号： H01G9/15 , H01G9/0032 , H01G9/012 , H01G9/052 , H01G9/08
摘要： A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.
摘要翻译：固体电容器的制造方法包括以下步骤。第一步是在绝缘基板上形成多个分离的粘合剂层。下一步是将阀 - 金属丝布置在粘合剂层上。下一步是在粘合剂层和阀金属线上形成导电层。下一步是在阀 - 金属线和导电层的暴露表面上形成电介质结构。下一步是形成疏水层和导电单元。下一步是将形成的结构作为单独的电容器分离。下一步是包装形成的结构和形成连接到形成的结构的端子。

9. 发明申请

US20120119863A1 COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：共模滤波器及其制造方法
公开(公告)号：US20120119863A1
公开(公告)日：2012-05-17
申请号：US13210495
申请日：2011-08-16
申请人： Liang Chieh WU
发明人： Liang Chieh WU
IPC分类号： H01F27/29 , H05K3/30
CPC分类号： H01F17/0013 , H01F27/292 , H01F2017/0093 , Y10T29/4913
摘要： A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.
摘要翻译：共模滤波器包括至少两个电感单元组。每个电感单元组包括线圈引导层，绝缘基板，至少两个导电柱和线圈主体层。线圈引导层设置在基板的第一表面上，并且包括至少两个导线，至少四个引导端子和至少两个触头。每个引线分别连接一个引线端子和一个触点。线圈主体层设置在基板的第二表面上，并且包括线圈引线及其两个端部。每个导电柱延伸穿过基板，连接一个触点和一个端部。至少两个电感单元组的两个基板和两个线圈主体层通过电绝缘层接合。两个线圈主体层通过电绝缘层彼此电绝缘。

10. 发明申请

US20110025442A1 COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：共模滤波器及其制造方法
公开(公告)号：US20110025442A1
公开(公告)日：2011-02-03
申请号：US12726691
申请日：2010-03-18
申请人： MING LIANG HSIEH , MING YI YANG , LIANG CHIEH WU , SHENG FU SU , CHENG YI WANG
发明人： MING LIANG HSIEH , MING YI YANG , LIANG CHIEH WU , SHENG FU SU , CHENG YI WANG
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/0066 , H01F2017/0093 , Y10T29/49073
摘要： A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.
摘要翻译：共模滤波器包括绝缘基板，下线圈引导层，线圈主体多层和上线圈引导层。上部线圈引导层包括至少一个上部引线，至少一个上部端子和至少一个上部触点，下部线圈引导层包括至少一个下部引线，至少一个下部端子和至少一个下部触点。上引线的两端分别连接到上端子和上触点，上引线围绕上触点。下引线的两端分别连接到下端子和下触点，下引线包围下触点。上线圈引导层和下线圈引线层夹着线圈主体多层，下线圈引导层设置在绝缘基板上。

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