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1. 发明申请

US20020168923A1 Chemical mechanical polishing slurry useful for copper substrates 有权
公开(公告)号：US20020168923A1
公开(公告)日：2002-11-14
申请号：US10145357
申请日：2002-05-14
申请人： Cabot Microelectronics Corp.
发明人： Vlasta Brusic Kaufman , Rodney C. Kistler , Shumin Wang
IPC分类号： B24B001/00
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463
摘要： A chemical mechanical polishing slurry comprising an oxidizing agent, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, titanium nitride, tantalum and tantalum nitride containing layers from a substrate. The slurry does not include a separate film-forming agent.

2. 发明申请

US20050148289A1 Micromachining by chemical mechanical polishing 审中-公开
标题翻译：微机械化学机械抛光
公开(公告)号：US20050148289A1
公开(公告)日：2005-07-07
申请号：US10752416
申请日：2004-01-06
申请人： David Mikolas , Ian Wylie
发明人： David Mikolas , Ian Wylie
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/042
摘要： Methods of micromachining structures on substrates using chemical mechanical polishing techniques.
摘要翻译：使用化学机械抛光技术在基材上微加工结构的方法。

3. 发明申请

US20040013376A1 Dielectric particles in optical waveguides for improved performance 审中-公开
标题翻译：光波导中的介质颗粒，以提高性能
公开(公告)号：US20040013376A1
公开(公告)日：2004-01-22
申请号：US10196406
申请日：2002-07-16
申请人： Cabot Microelectronics Corp.
发明人： David G. Mikolas
IPC分类号： G02B006/02
CPC分类号： G02B6/0229 , G02B6/14
摘要： A multimode optical waveguide having reduced modal dispersion. The optical waveguide comprises a core, a cladding surrounding the core, and a plurality of optical scattering elements dispersed in the core.
摘要翻译：具有减小的模态色散的多模光波导。光波导包括芯，围绕芯的包层以及分散在芯中的多个光散射元件。

4. 发明申请

US20040007690A1 Methods for polishing fiber optic connectors 审中-公开
标题翻译：抛光光纤连接器的方法
公开(公告)号：US20040007690A1
公开(公告)日：2004-01-15
申请号：US10194390
申请日：2002-07-12
申请人： Cabot Microelectronics Corp.
发明人： Gary W. Snider , J. Scott Steckenrider , Steven K. Grumbine
IPC分类号： C09K013/00
CPC分类号： B24B19/226 , C09G1/02 , C09K3/1463 , C09K3/1472 , G02B6/3863
摘要： Methods for controllably polishing fiber optic connectors that include a ferrule enclosing single or multiple optical fibers by manipulating the ingredients of the polishing composition to control the relative polishing rates of the ferrule material and the optical fiber material to obtain the desired connector end face surface finish and geometry.
摘要翻译：通过操纵抛光组合物的成分以控制套圈材料和光纤材料的相对抛光速率以获得期望的连接器端面表面光洁度的方法，用于可控地抛光光纤连接器，其包括包围单个或多个光纤的套圈，几何。

5. 发明申请

US20050269665A1 Three dimensional integrated circuits 有权
标题翻译：三维集成电路
公开(公告)号：US20050269665A1
公开(公告)日：2005-12-08
申请号：US10861007
申请日：2004-06-04
申请人： Ian Wylie , Heinz Busta , David Schroeder , J. Steckenrider , Yuchun Wang
发明人： Ian Wylie , Heinz Busta , David Schroeder , J. Steckenrider , Yuchun Wang
IPC分类号： H01L21/48 , H01L21/768 , H01L21/98 , H01L23/34 , H01L23/473 , H01L25/065 , H01L29/00 , H01L29/06
CPC分类号： H01L23/473 , H01L21/4882 , H01L21/76898 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06589 , H01L2225/06593 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit comprises two or more electrically connected integrated circuits, separated by a cooling channel.
摘要翻译：一种三维集成电路，可在已知的二维系统上提供缩短的互连信号延迟。三维集成电路还可以改善电路冷却。三维集成电路包括由冷却通道隔开的两个或更多个电连接的集成电路。

6. 发明申请

US20040005769A1 Method and apparatus for endpoint detection 审中-公开
标题翻译：终点检测的方法和装置
公开(公告)号：US20040005769A1
公开(公告)日：2004-01-08
申请号：US10190243
申请日：2002-07-03
申请人： Cabot Microelectronics Corp.
发明人： David G. Mikolas
IPC分类号： H01L021/44 , H01L021/302 , H01L021/461
CPC分类号： B24B37/013 , B24B49/04 , G02B2006/12107 , H01L21/31053
摘要： This invention relates to methods of detecting a planarization endpoint in chemical mechanical planarization of a substrate wherein a detectable target is located at the endpoint and then detected during the CMP planarization. The invention also relates to layered substrates that contain a detectable target located between a first layer of material and a second layer of material. The invention also relates to methods of chemical mechanical planarization of a substrate.
摘要翻译：本发明涉及在衬底的化学机械平面化中检测平面化终点的方法，其中可检测的靶位于端点处，然后在CMP平坦化期间被检测。本发明还涉及包含位于第一材料层和第二材料层之间的可检测靶的分层衬底。本发明还涉及基材的化学机械平面化方法。

7. 发明申请

US20030138201A1 Self-aligned lens formed on a single mode optical fiber using CMP and thin film deposition 审中-公开
标题翻译：使用CMP和薄膜沉积在单模光纤上形成的自对准透镜
公开(公告)号：US20030138201A1
公开(公告)日：2003-07-24
申请号：US10192427
申请日：2002-07-10
申请人： Cabot Microelectronics Corp.
发明人： David G. Mikolas
IPC分类号： G02B006/32 , G02B006/02
CPC分类号： G02B6/4203 , G02B6/241 , G02B6/262 , G02B6/4207
摘要： Methods, including chemical mechanical polishing methods, for creating a focusing surface on the exposed end of one or more single mode fiber cores which focusing surface is self-aligned to the fiber core axis.
摘要翻译：用于在聚焦表面与光纤芯轴自对准的一个或多个单模光纤芯的暴露端上产生聚焦表面的方法，包括化学机械抛光方法。

8. 发明授权

US07438795B2 Electrochemical-mechanical polishing system 失效
标题翻译：电化学机械抛光系统
公开(公告)号：US07438795B2
公开(公告)日：2008-10-21
申请号：US10865027
申请日：2004-06-10
申请人： Ian W. Wylie , Sriram P. Anjur
发明人： Ian W. Wylie , Sriram P. Anjur
IPC分类号： C25F17/00 , C25D17/00 , C25D5/00 , B24B7/22 , B24B37/04 , B24B53/07 , B24B1/00
CPC分类号： B24B37/26 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided having first and second pluralities of unidirectional pores configured to communicate polishing composition between the top and bottom surfaces of the pad. A cyclic flow of composition is established to continuously renew composition to the area of interaction between the pad and the substrate. In another aspect, a polishing apparatus is provided having a polishing composition transfer region between a polishing pad and a platen. Pores disposed through the pad communicate composition from the transfer region to the top surface. To facilitate directing the composition into the pores, the apparatus includes a plurality of protrusions protruding into the transfer region that are aligned with the pores.
摘要翻译：提供了用于抛光基底的抛光装置和抛光垫，并且被设计用于改善抛光组合物与垫和基底之间的相互作用区域的流动和分布。在一个方面，提供了具有第一和第二多个单向孔的抛光垫，其被构造成在衬垫的顶表面和底表面之间连通抛光组合物。建立循环流动的组合物以将组合物连续地更新到衬垫和衬底之间的相互作用区域。另一方面，提供一种抛光装置，其具有在抛光垫和压板之间的抛光组合物转印区域。通过衬垫布置的孔将组合物从转印区域传递到顶表面。为了便于将组合物引导到孔中，该装置包括突出到与孔对准的转移区域中的多个突起。

9. 发明申请

US20050079711A1 Hollow tip array with nanometer size openings and formation thereof 审中-公开
标题翻译：具有纳米尺寸开口的空心尖端阵列及其形成
公开(公告)号：US20050079711A1
公开(公告)日：2005-04-14
申请号：US10683247
申请日：2003-10-10
申请人： Heinz Busta
发明人： Heinz Busta
IPC分类号： B01L3/02 , B41J2/14 , B41J2/16 , B81B1/00 , B81B3/00 , H01L21/302 , H01L21/461
CPC分类号： B01L3/0255 , B01L2200/12 , B01L2300/0809 , B01L2400/0487 , B41J2/14 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B81B1/008 , B81B2201/057 , B81B2201/058 , B81C1/00111
摘要： This invention provides tip assemblies and arrays of tip assemblies useful for nanoscale fluid delivery. The invention also provides methods of fabricating tip assemblies.
摘要翻译：本发明提供了用于纳米流体输送的尖端组件和尖端组件阵列。本发明还提供了制造尖端组件的方法。

10. 发明申请

US20030166337A1 Chemical mechanical polishing systems and methods for their use 有权
标题翻译：化学机械抛光系统及其使用方法
公开(公告)号：US20030166337A1
公开(公告)日：2003-09-04
申请号：US10324634
申请日：2002-12-19
申请人： Cabot Microelectronics, Corp.
发明人： Shumin Wang , Vlasta Brusic Kaufman
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： C23F3/06 , C09G1/02 , C09K3/1463 , H01L21/3212
摘要： Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
摘要翻译：含有α-氨基酸的化学机械抛光组合物和浆料，其可用于抛光包括多层金属或金属和电介质的基底。

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