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1. 发明授权

US08013347B2 Remote control lighting assembly and use thereof 有权
标题翻译：遥控照明组件及其使用
公开(公告)号：US08013347B2
公开(公告)日：2011-09-06
申请号：US11727714
申请日：2007-03-28
申请人： Zhikuan Zhang , Ming Lu , Lydia Leung , Kelvin Li , Enboa Wu
发明人： Zhikuan Zhang , Ming Lu , Lydia Leung , Kelvin Li , Enboa Wu
IPC分类号： H01L33/00
CPC分类号： H05B33/0803 , F21K9/00 , F21V23/0435 , F21V23/0442 , F21V29/503 , F21V29/86 , F21V29/89 , F21Y2115/10 , H05B33/0857
摘要： A remote-controllable lighting device comprising a first substrate and an adjacent second substrate maintained in a spaced apart relationship to allow airflow therebetween and at least partly overlapping each other, at least the second substrates carrying thereon at least one emission sources, the first substrate being located towards a proximal end of the device and the second substrate being located towards a distal end of the device; said first substrate being arranged so as to allow light generated by the at least one located second light emission source to pass thereby in a direction defining a primary light emission direction and said first light emission source located so as to emit light in said primary light emission direction; said first and second substrate being in thermal communication so as to allow heat generated by the at least one light emission sources to flow between the substrates so as to provide thermal distribution between the substrates, the first and second substrate being formed of a thermally conductive material suitable for convection of the generated heat therefrom; a signal detector for receiving a wirelessly transmitted control signal from a remote control device; said signal receiver being located proximal of the first substrate in the primary light emission direction; and a controller in communication with said signal detector and the light emission sources and for controlling at least one characteristic of at least one light emission source responsive to said control signal.
摘要翻译：遥控照明装置，包括第一基板和相邻的第二基板，所述第一基板和相邻的第二基板保持间隔开的关系，以允许至少部分地彼此重叠的气流，至少在其上承载有至少一个排放源的第二基板，第一基板朝向装置的近端定位，并且第二基板朝向装置的远端定位; 所述第一衬底布置成允许由所述至少一个位于第二发光源产生的光在限定初级发光方向的方向上通过，并且所述第一发光源被定位成在所述初级发光中发光方向; 所述第一和第二基板是热连通的，以便允许至少一个发光源产生的热量在基板之间流动，从而在基板之间提供热分布，第一和第二基板由导热材料适于从其产生的热量对流; 信号检测器，用于从遥控装置接收无线发送的控制信号; 所述信号接收器位于所述第一基板的初始发光方向的近侧; 以及与所述信号检测器和所述发光源通信并用于响应于所述控制信号来控制至少一个发光源的至少一个特性的控制器。

2. 发明申请

US20080211369A1 Remote control lighting assembly and use thereof 有权
标题翻译：遥控照明组件及其使用
公开(公告)号：US20080211369A1
公开(公告)日：2008-09-04
申请号：US11727714
申请日：2007-03-28
申请人： Zhikuan Zhang , Ming Lu , Lydia Leung , Kelvin Ll , Enboa Wu
发明人： Zhikuan Zhang , Ming Lu , Lydia Leung , Kelvin Ll , Enboa Wu
IPC分类号： H01J7/24
CPC分类号： H05B33/0803 , F21K9/00 , F21V23/0435 , F21V23/0442 , F21V29/503 , F21V29/86 , F21V29/89 , F21Y2115/10 , H05B33/0857
摘要： A remote-controllable lighting device comprising a first substrate and an adjacent second substrate maintained in a spaced apart relationship to allow airflow therebetween and at least partly overlapping each other, at least the second substrates carrying thereon at least one emission sources, the first substrate being located towards a proximal end of the device and the second substrate being located towards a distal end of the device; said first substrate being arranged so as to allow light generated by the at least one located second light emission source to pass thereby in a direction defining a primary light emission direction and said first light emission source located so as to emit light in said primary light emission direction; said first and second substrate being in thermal communication so as to allow heat generated by the at least one light emission sources to flow between the substrates so as to provide thermal distribution between the substrates, the first and second substrate being formed of a thermally conductive material suitable for convection of the generated heat therefrom; a signal detector for receiving a wirelessly transmitted control signal from a remote control device; said signal receiver being located proximal of the first substrate in the primary light emission direction; and a controller in communication with said signal detector and the light emission sources and for controlling at least one characteristic of at least one light emission source responsive to said control signal.
摘要翻译：遥控照明装置，包括第一基板和相邻的第二基板，所述第一基板和相邻的第二基板保持间隔开的关系，以允许至少部分地彼此重叠的气流，至少在其上承载有至少一个排放源的第二基板，第一基板朝向装置的近端定位，并且第二基板朝向装置的远端定位; 所述第一衬底布置成允许由所述至少一个位于第二发光源产生的光在限定初级发光方向的方向上通过，并且所述第一发光源被定位成在所述初级发光中发光方向; 所述第一和第二基板是热连通的，以便允许至少一个发光源产生的热量在基板之间流动，从而在基板之间提供热分布，第一和第二基板由导热材料适于从其产生的热量对流; 信号检测器，用于从遥控装置接收无线发送的控制信号; 所述信号接收器位于所述第一基板的初始发光方向的近侧; 以及与所述信号检测器和所述发光源通信并用于响应于所述控制信号来控制至少一个发光源的至少一个特性的控制器。

3. 发明授权

US07482632B2 LED assembly and use thereof 有权
标题翻译： LED组件及其使用
公开(公告)号：US07482632B2
公开(公告)日：2009-01-27
申请号：US11492837
申请日：2006-07-26
申请人： Ming Lu , Kai Chiu Wu , Zhikuan Zhang , Enboa Wu
发明人： Ming Lu , Kai Chiu Wu , Zhikuan Zhang , Enboa Wu
IPC分类号： H01L29/18
CPC分类号： H05K1/144 , F21K9/00 , F21V29/76 , F21V29/83 , F21Y2107/60 , F21Y2115/10 , H01L2924/0002 , H05K1/0203 , H05K1/0272 , H05K2201/042 , H05K2201/09063 , H05K2201/10106 , H05K2201/10242 , H05K2201/2036 , H01L2924/00
摘要： A light emitting diode (LED) assembly includes a first substrate carrying a first plurality of LEDs mounted thereon and a second substrate spaced apart from the first substrate. The second substrate carries a second plurality of LEDs thereon. The first and second substrates are thermally connected for thermal distribution between the substrates.
摘要翻译：发光二极管（LED）组件包括承载安装在其上的第一多个LED的第一基板和与第一基板间隔开的第二基板。第二基板在其上承载第二多个LED。第一和第二基板被热连接用于基板之间的热分布。

4. 发明申请

US20080013334A1 LED assembly and use thereof 有权
标题翻译： LED组件及其使用
公开(公告)号：US20080013334A1
公开(公告)日：2008-01-17
申请号：US11492837
申请日：2006-07-26
申请人： Ming Lu , Kai Chiu Wu , Zhikuan Zhang , Enboa Wu
发明人： Ming Lu , Kai Chiu Wu , Zhikuan Zhang , Enboa Wu
IPC分类号： F21S8/10 , F21V29/00 , H01L33/00
CPC分类号： H05K1/144 , F21K9/00 , F21V29/76 , F21V29/83 , F21Y2107/60 , F21Y2115/10 , H01L2924/0002 , H05K1/0203 , H05K1/0272 , H05K2201/042 , H05K2201/09063 , H05K2201/10106 , H05K2201/10242 , H05K2201/2036 , H01L2924/00
摘要： A light emitting diode (LED) assembly includes a first substrate carrying a first plurality of LEDs mounted thereon and a second substrate spaced apart from the first substrate. The second substrate carries a second plurality of LEDs thereon. The first and second substrates are thermally connected for thermal distribution between the substrates.
摘要翻译：发光二极管（LED）组件包括承载安装在其上的第一多个LED的第一基板和与第一基板间隔开的第二基板。第二基板在其上承载第二多个LED。第一和第二基板被热连接用于基板之间的热分布。

5. 发明授权

US07474287B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07474287B2
公开(公告)日：2009-01-06
申请号：US11318314
申请日：2005-12-23
申请人： Enboa Wu , Ming Lu , Geoffrey Wan Tai Shuy
发明人： Enboa Wu , Ming Lu , Geoffrey Wan Tai Shuy
IPC分类号： G09G3/32
CPC分类号： H05B33/0857 , H05B33/0818
摘要： A light emitting device includes a time delay mechanism in electrical connection with a power source for time shifting at least a portion of a power signal outputted by the power source and a plurality of light emitting units formed by at least a light emitting diode (LED)structure, each light emitting unit being driven alternately and sequentially using the power source and the time delay mechanism.
摘要翻译：一种发光器件包括与电源电连接的时间延迟机构，用于对由电源输出的功率信号的至少一部分进行时移，以及由至少一个发光二极管（LED）形成的多个发光单元，结构，每个发光单元使用电源和时间延迟机构交替地和顺序驱动。

6. 发明申请

US20070146256A1 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US20070146256A1
公开(公告)日：2007-06-28
申请号：US11318314
申请日：2005-12-23
申请人： Enboa Wu , Ming Lu , Geoffrey Wan Tai Shuy
发明人： Enboa Wu , Ming Lu , Geoffrey Wan Tai Shuy
IPC分类号： G09G3/32
CPC分类号： H05B33/0857 , H05B33/0818
摘要： A light emitting device includes a time delay mechanism in electrical connection with a power source for time shifting at least a portion of a power signal outputted by the power source and a plurality of light emitting units formed by at least a light emitting diode (LED)structure, each light emitting unit being driven alternately and sequentially using the power source and the time delay mechanism.
摘要翻译：一种发光器件包括与电源电连接的时间延迟机构，用于对由电源输出的功率信号的至少一部分进行时移，以及由至少一个发光二极管（LED）形成的多个发光单元，结构，每个发光单元使用电源和时间延迟机构交替地和顺序驱动。

7. 发明申请

US20080099772A1 Light emitting diode matrix 审中-公开
标题翻译：发光二极管阵列
公开(公告)号：US20080099772A1
公开(公告)日：2008-05-01
申请号：US11589705
申请日：2006-10-30
申请人： Geoffrey Wen-Tai Shuy , Enboa Wu , Ming Lu
发明人： Geoffrey Wen-Tai Shuy , Enboa Wu , Ming Lu
IPC分类号： H01L33/00 , H01L29/207
CPC分类号： H01L27/156 , H01L33/385 , H01L33/62 , H01L2224/48137 , H01L2224/48139 , H01L2224/49113
摘要： A light source includes a light emitting diode (LED) module having a continuous substrate, a layer of n-type semiconductor material formed above the substrate, and a layer of p-type semiconductor material formed above the n-type semiconductor material. A p-n junction is formed between the p-type and n-type semiconductor materials. The p-type and n-type semiconductor materials are selected to emit light at the p-n junction when an electric current flows through the p-n junction. The LED module includes a plurality of electric contacts connected to the p-type semiconductor material, and at least one electric contact connected to the n-type semiconductor material. The electric contacts are configured to pass electric current through a plurality of regions in the p-n junction such that the plurality of regions have higher electric current densities and emit light brighter than areas outside of the plurality of regions.
摘要翻译：光源包括具有连续衬底的发光二极管（LED）模块，在衬底上形成的n型半导体材料层和形成在n型半导体材料上方的p型半导体材料层。在p型和n型半导体材料之间形成p-n结。当电流流过p-n结时，选择p型和n型半导体材料在p-n结处发光。 LED模块包括连接到p型半导体材料的多个电触点和连接到n型半导体材料的至少一个电触点。电触点被配置为使电流通过p-n结中的多个区域，使得多个区域具有较高的电流密度并且发射比多个区域外的区域更亮的光。

8. 发明申请

US20070145884A1 Light emitting diode die with at least one phosphor layer and method for forming the same 审中-公开
标题翻译：具有至少一个荧光体层的发光二极管管芯及其形成方法
公开(公告)号：US20070145884A1
公开(公告)日：2007-06-28
申请号：US11509509
申请日：2006-08-22
申请人： Enboa Wu , Tun-Yen Kan
发明人： Enboa Wu , Tun-Yen Kan
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H05B33/10
摘要： The present application discloses a light emitting diode die with at least one phosphor layer, comprising a substrate having a first surface and a second surface opposing to the first surface; a light-emitting structure being formed on the first surface and emitting a primary light with a specific wavelength while being driven by a voltage wherein the primary light is capable of passing through the substrate; and, at least one phosphor layer with plate-shaped structure formed on the second surface, wherein at least one phosphor layer comprises at least one type of organic material and at least one type of phosphor substance that absorbs and converts part of the primary light to thereby emit at least a secondary light with a different wavelength from the specific wavelength. In addition, the present invention discloses methods for forming a light emitting diode die with at least one phosphor layer.
摘要翻译：本申请公开了一种具有至少一个磷光体层的发光二极管管芯，其包括具有与第一表面相对的第一表面和第二表面的衬底; 发光结构形成在第一表面上并发射具有特定波长的初级光，同时被初级光能够通过基板的电压驱动; 并且至少一个具有板状结构的磷光体层形成在第二表面上，其中至少一个磷光体层包括至少一种类型的有机材料和至少一种类型的磷光体物质，其吸收并转换部分原始光，从而发射至少具有与特定波长不同波长的二次光。此外，本发明公开了用于形成具有至少一个荧光体层的发光二极管管芯的方法。

9. 发明授权

US08672512B2 Omni reflective optics for wide angle emission LED light bulb 有权
标题翻译：全向反射光学用于广角LED灯泡
公开(公告)号：US08672512B2
公开(公告)日：2014-03-18
申请号：US13426627
申请日：2012-03-22
申请人： Li Zhou , Kai Chiu Wu , Enboa Wu
发明人： Li Zhou , Kai Chiu Wu , Enboa Wu
IPC分类号： F21V14/00
CPC分类号： F21V29/505 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V3/00 , F21V3/063 , F21V3/12 , F21V13/02 , F21V29/773 , F21V29/86 , F21Y2115/10
摘要： A structure is provided to create an efficient light pattern conversion from a narrow angular light beam pattern of a light emitting source to a wide angle light intensity distribution for an omnidirectional lighting assembly. A heat conductive substrate includes an LED array with at least one central and at least one surrounding LED. A hollow light diverting component is positioned over the LED array; a central LED is within the hollow component while surrounding LEDs are positioned outside. Light emitted by the central LED is reflected off inner surfaces of the hollow component to be discharged from an upper opening. The outer component surface is configured to reflect light from the surrounding LEDs in azimuthal and circumferential directions towards a region below the upper opening. In this manner, plural LEDs are used to form a wide angle emission pattern suitable for use in conventional light bulb replacement devices.
摘要翻译：提供一种结构以产生从发光源的窄角度光束图案到全向照明组件的广角光强度分布的有效的光图案转换。导热基板包括具有至少一个中心和至少一个周围LED的LED阵列。中空光转向部件位于LED阵列上方; 中央LED在中空部件内，而周围的LED位于外部。由中央LED发射的光从中空部件的内表面反射，从上部开口排出。外部部件表面被配置为将方位角和圆周方向上的周围LED的光反射到上部开口下方的区域。以这种方式，使用多个LED来形成适用于常规灯泡更换装置的广角发射图案。

10. 发明申请

US20070224728A1 Method for wafer level package of sensor chip 有权
标题翻译：传感器芯片晶圆级封装方法
公开(公告)号：US20070224728A1
公开(公告)日：2007-09-27
申请号：US11385882
申请日：2006-03-22
申请人： Enboa Wu , Rou-Ching Yang
发明人： Enboa Wu , Rou-Ching Yang
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： A method for wafer level package (WLP) of sensor chips is provided, including the steps of: providing a wafer, the wafer including a plurality of die regions, each the die region on a first surface of the wafer comprising an active area and a pad surrounding the active area; bounding a transparent protective layer to the first surface of the wafer; forming a stress buffer on a second surface of the wafer; using etching or laser drill to form a via hole at the location between two neighboring die regions through the stress buffer and the wafer to expose the pad or a conductive line between two neighboring pads; and forming a plurality of bump electrodes on the stress buffer for electrical connection to the pads through the via holes. The method can prevent pollution of the die, improve the convenience of package, reduce the manufacture cost, increase the package reliability, and solve the stress problem caused by attaching the die directly to the PCB.
摘要翻译：提供了一种用于传感器芯片的晶片级封装（WLP）的方法，包括以下步骤：提供晶片，晶片包括多个管芯区域，每个管芯区域在晶片的第一表面上包括有源区和围绕活动区域的垫; 将透明保护层限定在晶片的第一表面上; 在所述晶片的第二表面上形成应力缓冲器; 使用蚀刻或激光钻孔在通过应力缓冲器和晶片的两个相邻管芯区域之间的位置处形成通孔，以暴露焊盘或两个相邻焊盘之间的导电线; 以及在所述应力缓冲器上形成多个凸起电极，以通过所述通孔与所述焊盘电连接。该方法可以防止模具污染，提高包装的便利性，降低制造成本，提高包装可靠性，解决将模具直接连接到PCB所引起的应力问题。

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