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1. 发明申请

US20200066615A1 ELECTRONIC MODULE AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
公开(公告)号：US20200066615A1
公开(公告)日：2020-02-27
申请号：US16461176
申请日：2017-10-24
申请人： ZF Friedrichshafen AG
发明人： Martin Hermann Hahn , Thomas Preuschl , Roland Friedl
IPC分类号： H01L23/473 , H01L23/367
摘要： An electronics module may include at least one power semiconductor that is connected in a thermally conductive manner to an integral heat sink. The electronics module may further include a turbulence element that can move in a laser sintered cooling channel of the heat sink. The turbulence element may be laser sintered with the heat sink in a common laser sintering process.

2. 发明授权

US09520659B2 Connector device for a printed circuit board of a control device for a vehicle transmission, control system for a vehicle transmission and method for assembling a control system for a vehicle transmission 有权
标题翻译：用于车辆变速器的控制装置的印刷电路板的连接器装置，用于车辆变速器的控制系统和用于组装用于车辆变速器的控制系统的方法
公开(公告)号：US09520659B2
公开(公告)日：2016-12-13
申请号：US14384236
申请日：2013-02-01
申请人： ZF FRIEDRICHSHAFEN AG
发明人： Josef Loibl , Herbert Wallner , Roland Friedl
IPC分类号： H01R24/00 , H01R12/58 , H01R12/75 , H01R13/52 , H05K5/00 , H01R24/28 , H05K7/10
CPC分类号： H01R12/58 , H01R12/75 , H01R13/5219 , H01R24/28 , H01R2201/26 , H05K5/0069 , H05K7/10
摘要： A proposal is made for a plug device for a circuit board of a control unit for a vehicle transmission. The circuit board has at least one contact hole. The plug device has a housing, at least one contact device arranged in the housing for a cable of a peripheral module fed into the housing and at least one contact plug that is electrically connected with the contact device and that protrudes at least partially from the housing for producing an electrical and mechanical connection with the contact hole of the circuit board.
摘要翻译：提出了用于车辆变速器的控制单元的电路板的插头装置。电路板具有至少一个接触孔。插头装置具有壳体，至少一个接触装置，布置在壳体中，用于馈送到壳体中的外围模块的电缆，以及至少一个接触插头，其与接触装置电连接，并且至少部分地从壳体用于与电路板的接触孔产生电气和机械连接。

3. 发明授权

US09769945B2 Covering device for a contacting portion of a printed circuit board, control system for a mechatronic module and method for assembling a control system 有权
公开(公告)号：US09769945B2
公开(公告)日：2017-09-19
申请号：US14385093
申请日：2013-02-01
申请人： ZF Friedrichshafen AG
发明人： Josef Loibl , Herbert Wallner , Roland Friedl
IPC分类号： H05K1/11 , H05K5/03 , H01R13/52 , H05K5/00 , H01R43/20 , H05K7/14 , H01R29/00 , H01R12/00 , H01R13/62 , H01R13/648 , H01R12/50 , H01R12/72 , H01R13/6587 , H01R12/58
CPC分类号： H05K5/03 , H01R12/58 , H01R12/72 , H01R13/5202 , H01R13/521 , H01R13/6587 , H01R23/6886 , H01R23/6893 , H01R23/70 , H01R23/701 , H01R23/7015 , H01R23/7073 , H01R43/205 , H05K5/0082 , H05K7/14 , Y10T29/49147
摘要： A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.

4. 发明申请

US20150098193A1 COVERING DEVICE FOR A CONTACTING PORTION OF A PRINTED CIRCUIT BOARD, CONTROL SYSTEM FOR A MECHATRONIC MODULE AND METHOD FOR ASSEMBLING A CONTROL SYSTEM 有权
标题翻译：打印电路板的接触部分的封装装置，用于组装模块的控制系统和用于组装控制系统的方法
公开(公告)号：US20150098193A1
公开(公告)日：2015-04-09
申请号：US14385093
申请日：2013-02-01
申请人： ZF Friedrichshafen AG
发明人： Josef Loibl , Herbert Wallner , Roland Friedl
IPC分类号： H05K5/03 , H01R43/20 , H05K7/14
CPC分类号： H05K5/03 , H01R12/58 , H01R12/72 , H01R13/5202 , H01R13/521 , H01R13/6587 , H01R23/6886 , H01R23/6893 , H01R23/70 , H01R23/701 , H01R23/7015 , H01R23/7073 , H01R43/205 , H05K5/0082 , H05K7/14 , Y10T29/49147
摘要： A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.
摘要翻译：提出了一种用于机电一体化模块的印刷电路板的接触部分的盖装置。印刷电路板包括具有至少一个连接孔的接触部分，用于将电连接元件连接到印刷电路板。盖装置的特征在于，盖装置具有用于密封至少一个连接孔的电压保护元件和密封元件。密封元件具有至少一个盲孔，用于接收电连接元件的端部。

5. 发明授权

US08770017B2 Method of manufacturing a molded sensor subassembly 有权
标题翻译：制造传感器组件的方法
公开(公告)号：US08770017B2
公开(公告)日：2014-07-08
申请号：US13685806
申请日：2012-11-27
申请人： ZF Friedrichshafen AG
发明人： Herbert Wallner , Roland Friedl
IPC分类号： G01M13/02 , H05K3/28
CPC分类号： H05K3/284 , G01M13/02 , H05K2201/10151 , H05K2201/10303 , H05K2203/1316 , Y10T29/49002
摘要： A method of producing an insert molded sensor assembly having at least one sensor element accommodated on a first side of a circuit board of the sensor assembly. During a first step, a plurality of pins are introduced and penetrate through the circuit board. The circuit board, including the at least one sensor element, is then disposed, during a second step, into a two-part insert mold tool so that the pins are supported on both sides of the circuit board in a direction transverse to a plane defined by the circuit board. A defined spacing distance, between a surface of the sensor element and the insert mold tool, is produced by the pins. During a third step of the method, the insert mold tool is filled with insert molding material, particularly a duroplast.
摘要翻译：一种制造插入模制传感器组件的方法，其具有容纳在传感器组件的电路板的第一侧上的至少一个传感器元件。在第一步骤期间，引入多个引脚并穿过电路板。然后，将包括至少一个传感器元件的电路板在第二步骤期间设置成两部分插入式模具，以使销在横向于所定义的平面的方向上被支撑在电路板的两侧由电路板。在传感器元件的表面和插入模具之间的限定的间隔距离由销钉产生。在该方法的第三步骤期间，插入模具具有嵌入成型材料，特别是硬质塑料。

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