专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110050534A1 TRIPLATE LINE INTER-LAYER CONNECTOR, AND PLANAR ARRAY ANTENNA 失效
公开(公告)号：US20110050534A1
公开(公告)日：2011-03-03
申请号：US12869158
申请日：2010-08-26
申请人： Yuuichi Shimayama , Masahiko Oota , Takashi Saitou
发明人： Yuuichi Shimayama , Masahiko Oota , Takashi Saitou
IPC分类号： H01Q1/50
CPC分类号： H01P5/028 , H01Q1/3233 , H01Q21/0006
摘要： Provided is a triplate line inter-layer connector having excellent loss suppression capability and allowing for inter-layer connection at any position, and a planar array antenna having uniform frequency characteristics in a beam direction. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line. A first patch pattern is formed at a connection-side terminal end of a first feeder line. A first feed substrate has a first shield spacer disposed therebeneath, and a second shield spacer disposed just thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics in a respective one of the positions beneath and just above the first feed substrate. A second feeder line is provided on a second feed substrate together with a second patch pattern to extend in two directions from the second patch pattern to respective two output ends of the second feeder line, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns. The planar array antenna has a multi-layer structure comprising an antenna section and a transmission line section. The antenna section includes an antenna substrate and a first ground conductor having a slit. The antenna substrate has an antenna region which comprises a feeder line connected to respective radiation elements of the radiation element array. The feeder line, the slit and the patch pattern are provided at respective positions approximately corresponding to each other. Respective shapes and positions of the slit and the feeder line in a thicknesswise direction of the planar array antenna are adjusted to satisfy the following relation: d1

2. 发明授权

US08643564B2 Triplate line inter-layer connector, and planar array antenna 失效
标题翻译：三板线层间连接器和平面阵列天线
公开(公告)号：US08643564B2
公开(公告)日：2014-02-04
申请号：US12869158
申请日：2010-08-26
申请人： Yuuichi Shimayama , Masahiko Oota , Takashi Saitou
发明人： Yuuichi Shimayama , Masahiko Oota , Takashi Saitou
IPC分类号： H01Q1/50
CPC分类号： H01P5/028 , H01Q1/3233 , H01Q21/0006
摘要： A triplate line inter-layer connector and a planar array antenna are provided. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line, a first patch pattern formed at a connection-side terminal end of a first feeder line, a first feed substrate having a first shield spacer disposed therebeneath, and a second shield spacer disposed thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics. A second feeder line is provided on a second feed substrate together with a second patch pattern, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns.
摘要翻译：提供三板式线路层间连接器和平面阵列天线。三板线层间连接器具有在第一板板线和第二板板线之间的电连接结构，形成在第一馈电线的连接侧终端处的第一贴片图案，具有第一屏蔽间隔件设置在其下方，以及设置在其上方的第二屏蔽间隔件。第一和第二屏蔽间隔物中的每一个具有中空部分，该中空部分被挖空至围绕第一馈电线和第一贴片图案的尺寸，以便限定第一和第二电介质中相应的一个。第二馈电线与第二贴片图案一起设置在第二馈电衬底上，并且第二接地导体具有形成在其位于第一和第二贴片图案之间大致中间的部分中的第一狭缝。

3. 发明授权

US6121553A Circuit boards using heat resistant resin for adhesive layers 失效
标题翻译：使用耐热树脂的电路板用于粘合剂层
公开(公告)号：US6121553A
公开(公告)日：2000-09-19
申请号：US957011
申请日：1997-10-23
申请人： Eiichi Shinada , Masao Kanno , Yuuichi Shimayama , Yoshiyuki Tsuru , Takeshi Horiuchi
发明人： Eiichi Shinada , Masao Kanno , Yuuichi Shimayama , Yoshiyuki Tsuru , Takeshi Horiuchi
IPC分类号： H01L23/498 , H05K3/00 , H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , H05K1/03
CPC分类号： H05K3/4697 , H01L23/49894 , H05K3/103 , H05K3/386 , H05K3/4626 , H05K3/4655 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/3011 , H01L2924/30111 , H05K2201/0154 , H05K2201/0355 , H05K2201/09127 , H05K2201/10287 , H05K2203/063 , H05K3/0035 , H05K3/0094 , H05K3/429 , H05K3/4602 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917
摘要： An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.
摘要翻译：一种粘合剂组合物，其包含（a）优选分子量为80,000以上的聚酰胺 - 酰亚胺树脂和（b）优选包含环氧树脂和固化剂的热固性组分和/或其固化促进剂，用于提供绝缘在300℃下的储能弹性模量为30MPa以上，玻璃化转变温度为180℃以上的粘合剂层。绝缘粘合剂适用于线切割电路板，多层印刷电路板和芯片载体的电路板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式