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1. 发明授权

US09646863B2 Multilayer styrenic resin sheet 有权
公开(公告)号：US09646863B2
公开(公告)日：2017-05-09
申请号：US13979422
申请日：2012-01-16
申请人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
发明人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
IPC分类号： H01L21/673 , C08L25/04 , C08L53/02 , B32B27/08 , B32B27/30
CPC分类号： H01L21/673 , B32B27/08 , B32B27/302 , B32B2250/24 , B32B2270/00 , B32B2439/00 , B32B2553/00 , B65D2585/86 , C08L53/02 , C08L2205/02 , H01L21/67336 , Y10T428/1352 , Y10T428/24975 , C08L25/06
摘要： Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).

2. 发明申请

US20130251970A1 SURFACE CONDUCTIVE MULTILAYERED SHEET 审中-公开
标题翻译：表面导电多层板
公开(公告)号：US20130251970A1
公开(公告)日：2013-09-26
申请号：US13877747
申请日：2011-10-06
申请人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
发明人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
IPC分类号： B32B27/08
CPC分类号： B32B27/08 , B32B27/18 , B32B27/302 , B32B27/36 , B32B27/365 , B32B2250/05 , B32B2307/202 , B65D73/02 , B65D2213/02 , Y10T428/24975
摘要： A surface conductive thermoplastic resin sheet and a molded member, such as an embossed carrier tape, using the sheet, in which burr- and flash-related faults are prevented, whatever the molding equipment, by a slitting method or punching when embossing. Provided is a conductive multilayered sheet, and an electronic component package, a carrier tape and a tray consisting of the conductive multilayered sheet, wherein respective layers with a mean thickness of 2 to 50 μm are composed of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and wherein a conductive resin layer consisting of 65 to 95 wt % of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and 5 to 35 wt % of carbon black, on one side or both sides of the base sheet consisting of multiple layers wherein 10 to 50 respective layers are layered.
摘要翻译：使用片材的表面导电性热塑性树脂片材和模压部件，例如使用该片材的压花载带，其中防止毛刺和闪光相关的缺陷，无论成型设备如何，通过切割方法或在压花时冲压。提供一种导电性多层片材，以及由导电性多层片材构成的电子部件封装体，载体带和托盘，其中平均厚度为2〜50μm的各层由热塑性树脂构成，或具有热塑性树脂作为主要成分，并且其中由65至95重量％的热塑性树脂或具有热塑性树脂作为主要成分的树脂组合物和5至35重量％的炭黑组成的导电树脂层在由多层构成的基片的一侧或两面，其中层叠有10〜50层。

3. 发明申请

US20130337202A1 MULTILAYER STYRENIC RESIN SHEET 有权
标题翻译：多层苯乙烯树脂片
公开(公告)号：US20130337202A1
公开(公告)日：2013-12-19
申请号：US13979422
申请日：2012-01-16
申请人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
发明人： Yutaka Aoki , Atsushi Takei , Yasushi Hirokawa , Yusuke Masuda
IPC分类号： H01L21/673
CPC分类号： H01L21/673 , B32B27/08 , B32B27/302 , B32B2250/24 , B32B2270/00 , B32B2439/00 , B32B2553/00 , B65D2585/86 , C08L53/02 , C08L2205/02 , H01L21/67336 , Y10T428/1352 , Y10T428/24975 , C08L25/06
摘要： Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).
摘要翻译：公开了一种多层苯乙烯树脂片，其包含10〜50层叠层，各层由苯乙烯系树脂组合物，苯乙烯/共轭二烯共聚物（A）29〜65质量％，聚苯乙烯树脂（质量％ B）和20〜9质量％的耐冲击性聚苯乙烯树脂（C），平均厚度为2〜50μm; 以及由多层苯乙烯树脂片形成的用于电子部件的包装材料（例如载带或托盘）。苯乙烯树脂组合物在220℃下的熔融张力优选为10〜30mN，相对于共聚物（A）的100质量％，共轭二烯的含量优选为10〜25质量％。

4. 发明申请

US20120094086A1 EMBOSSED CARRIER TAPE AND METHOD OF PRODUCTION THEREOF 审中-公开
标题翻译：嵌入式手提带及其生产方法
公开(公告)号：US20120094086A1
公开(公告)日：2012-04-19
申请号：US13378378
申请日：2010-06-10
申请人： Atsushi Takei , Takenobu Sasakawa , Yasushi Hirokawa , Takashi Hatsuku
发明人： Atsushi Takei , Takenobu Sasakawa , Yasushi Hirokawa , Takashi Hatsuku
IPC分类号： B32B3/28 , B32B3/30 , B32B27/28
CPC分类号： B29B13/023 , B29C35/0266 , B29C51/08 , B29C51/082 , B29C51/225 , B29C51/421 , B29C59/02 , B29C59/04 , H05K13/0084 , Y10T428/24628 , Y10T428/24669
摘要： Provided are an embossed carrier tape having an embossed portion which is excellent in transparency and which has a high shape accuracy and a high buckling strength, and a method of production of the embossed carrier tape. The method of production of an embossed carrier tape comprises (a) a step of slitting a sheet which is obtained by biaxially stretching a styrene-based resin composition and which has an orientation relaxation stress of 0.2 to 0.8 MPa, measured in accordance with ASTM D-1504, into a tape-like form, (b) a step of heating only the reason of the slit tape where the embossed portion is to be formed, and (c) a step of forming an embossed portion in the heated area. Also, an embossed carrier tape manufactured by the method of production is provided.
摘要翻译：提供一种具有透明性优异且具有高形状精度和高屈曲强度的压纹部分的压花载带带以及压花载带的制造方法。制造压花载带的方法包括：（a）通过双轴拉伸苯乙烯基树脂组合物并且具有0.2至0.8MPa的取向松弛应力根据ASTM D测量的片材的切割步骤 -1504，成为带状，（b）仅加热要形成压花部分的切割带的原因的步骤，（c）在加热区域中形成压花部分的步骤。此外，提供了通过制造方法制造的压花载带。

5. 发明申请

US20070231549A1 Conductive Composite Sheeting 有权
标题翻译：导电复合板
公开(公告)号：US20070231549A1
公开(公告)日：2007-10-04
申请号：US11574729
申请日：2005-09-05
申请人： Takeshi Miyakawa , Yasushi Hirokawa , Masahiro Kuramoto
发明人： Takeshi Miyakawa , Yasushi Hirokawa , Masahiro Kuramoto
IPC分类号： B32B27/30
CPC分类号： B32B27/08 , B32B27/18 , B32B27/20 , B32B27/302 , B32B2264/108 , B32B2355/02 , B32B2439/00 , B32B2553/00 , Y10T428/1352 , Y10T428/24612 , Y10T428/31504
摘要： To provide a conductive composite sheet which has a small difference in physical properties between the machine and transverse directions and has high rigidity and folding endurance and which can easily be thermally formed into a tray or an embossed carrier tape. A composite sheet comprising at least one layer each of a substrate layer (layer A) made of a polystyrene resin and an ABS resin as the main components, a reinforcing layer (layer B) made of an ABS resin as the main component, and a surface layer (layer C) made of, as the main component, a polystyrene resin which contains a conductive filler, wherein the surface on at least one side is the above surface layer (layer C). Further, the surface layer (layer C) is preferably made of a composition containing from 2 to 100 parts by mass of carbon black per 100 parts by mass of the polystyrene resin. On the other hand, the substrate layer (layer A) and the reinforcing layer (layer B) preferably contain a specific amount of a styrene/butadiene/butylene/styrene block copolymer resin or the like.
摘要翻译：为了提供在机器和横向之间的物理性质差异小的导电性复合片材，并且具有高刚性和耐折性，并且可以容易地热成型为托盘或压纹载带。 1.一种复合片材，其特征在于，包括由聚苯乙烯树脂制成的基材层（A层）和ABS树脂作为主要成分的至少一层，以ABS树脂为主要成分的增强层（B层）和作为主要成分的含有导电性填料的聚苯乙烯树脂构成的表面层（C层），其中，至少一面的表面为上述表面层（C层）。此外，表层（C层）优选由相对于100质量份聚苯乙烯树脂含有2〜100质量份炭黑的组合物构成。另一方面，基材层（A层）和增强层（B层）优选含有特定量的苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物树脂等。

6. 发明授权

US07794807B2 Conductive composite sheeting 有权
标题翻译：导电复合板材
公开(公告)号：US07794807B2
公开(公告)日：2010-09-14
申请号：US11574729
申请日：2005-09-05
申请人： Takeshi Miyakawa , Yasushi Hirokawa , Masahiro Kuramoto
发明人： Takeshi Miyakawa , Yasushi Hirokawa , Masahiro Kuramoto
IPC分类号： B29D22/00 , B32B3/00 , B32B9/04 , H01B1/06 , C08L9/00
CPC分类号： B32B27/08 , B32B27/18 , B32B27/20 , B32B27/302 , B32B2264/108 , B32B2355/02 , B32B2439/00 , B32B2553/00 , Y10T428/1352 , Y10T428/24612 , Y10T428/31504
摘要： A composite sheet comprising at least one layer each of a substrate layer (layer A) made of a polystyrene resin and an ABS resin as the main components, a reinforcing layer (layer B) made of an ABS resin as the main component, and a surface layer (layer C) made of, as the main component, a polystyrene resin which contains a conductive filler, wherein the surface on at least one side is the above surface layer (layer C) is useful for a conductive composite sheet which has a small difference in physical properties between the machine and transverse directions and has high rigidity and folding endurance and which can easily be thermally formed into a tray or an embossed carrier tape.
摘要翻译： 1.一种复合片材，其特征在于，包括由聚苯乙烯树脂制成的基材层（A层）和ABS树脂作为主要成分的至少一层，以ABS树脂为主要成分的增强层（B层）和作为主要成分的由含有导电性填料的聚苯乙烯树脂构成的表面层（C层），其中，至少一面的表面为上述表面层（C层），可用于具有机器与横向之间的物理性能差异小，具有高刚性和耐折性，并且可以容易地热成型为托盘或压纹载带。

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