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    • 1. 发明申请
    • Wirless power supply device
    • 无线供电装置
    • US20110062788A1
    • 2011-03-17
    • US12585527
    • 2009-09-17
    • Yung-Hsiang ChenNan-Sheng ChangYung-Hsin Liang
    • Yung-Hsiang ChenNan-Sheng ChangYung-Hsin Liang
    • H02J17/00
    • H02J50/12H02J5/005
    • A wireless power supply device is adapted for providing electric power to an exterior electronic appliance. The wireless power supply includes a transmitting unit and a receiving unit. The transmitting unit includes a power unit for providing power to a voltage-controlled oscillator circuit and a signal amplification unit, the voltage-controlled oscillator circuit for receiving the power and then generating corresponding radio signals, the signal amplification unit for amplifying the radio signals generated by the voltage-controlled oscillator circuit and a transmitting antenna module for transmitting out the radio signals amplified by the signal amplification unit. The receiving unit includes a receiving antenna for wirelessly receiving the radio signals transmitted by the transmitting antenna module and then transforming the radio signals into electric power for being provided to the exterior electronic appliance.
    • 无线供电装置适于向外部电子设备提供电力。 无线电源包括发送单元和接收单元。 发射单元包括用于向压控振荡器电路和信号放大单元提供电力的功率单元,用于接收功率然后产生相应无线电信号的压控振荡器电路,用于放大产生的无线电信号的信号放大单元 通过压控振荡器电路和用于发送由信号放大单元放大的无线电信号的发送天线模块。 接收单元包括用于无线地接收由发送天线模块发送的无线电信号,然后将无线电信号转换成电力以供提供给外部电子设备的接收天线。
    • 3. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20140355190A1
    • 2014-12-04
    • US14079650
    • 2013-11-14
    • Hsin YehYung-Hsiang ChenWei-Han HuTzu-Chien LaiCho-Yao Yen
    • Hsin YehYung-Hsiang ChenWei-Han HuTzu-Chien LaiCho-Yao Yen
    • G06F1/16
    • G06F1/1669
    • An electronic device including a first body and a second body is provided. The first body has a first connection end. The second body has a second connection end, in which the second connection end has a first magnetic component and a first convex arc surface, and the second body is detachably connected to the first body through a magnetic attractive force between the first magnetic component and the first connection end. The first body and the second body are configured to rotate around a rotation axis relatively to each other, and the first convex arc surface faces the first connection end and extends along a direction parallel to the rotation axis.
    • 提供了包括第一主体和第二主体的电子装置。 第一个主体有第一个连接端。 第二主体具有第二连接端,其中第二连接端具有第一磁性部件和第一凸起弧形表面,并且第二主体通过第一磁性部件和第一磁性部件之间的磁性吸引力可拆卸地连接到第一主体 第一连接端。 第一主体和第二主体被构造为围绕彼此相对旋转的轴线旋转,并且第一凸弧面面向第一连接端并沿着平行于旋转轴线的方向延伸。
    • 8. 发明申请
    • STRUCTURE AND METHOD FOR E-BEAM IN-CHIP OVERLAY MARK
    • 电子束芯片覆盖标记的结构和方法
    • US20130147066A1
    • 2013-06-13
    • US13314644
    • 2011-12-08
    • Dong-Hsu ChengMing-Ho TsaiChih-Chung HuangYung-Hsiang ChenChun-Hung Chen
    • Dong-Hsu ChengMing-Ho TsaiChih-Chung HuangYung-Hsiang ChenChun-Hung Chen
    • H01L23/544H01L21/762
    • H01L22/12G03F7/70633
    • The present disclosure provides an integrated circuit structure that includes a semiconductor substrate having a first region and a second region having an area less than about 10 micron×10 micron; a first material layer over the semiconductor substrate and patterned to have a first circuit feature in the first region and a first mark in the second region; and a second material layer over the first material layer and patterned to have a second circuit feature in the first region and a second mark in the second region. The first mark includes first mark features oriented in a first direction, and second mark features oriented in a second direction perpendicular to the first direction. The second mark includes third mark features oriented in the first direction, and fourth mark features oriented in the second direction.
    • 本公开提供了一种集成电路结构,其包括具有第一区域的半导体衬底和具有小于约10微米×10微米的面积的第二区域; 半导体衬底上的第一材料层,并被图案化以具有第一区域中的第一电路特征和第二区域中的第一标记; 以及在所述第一材料层之上的第二材料层,并被图案化以具有所述第一区域中的第二电路特征和所述第二区域中的第二标记。 第一标记包括沿第一方向定向的第一标记特征,以及在垂直于第一方向的第二方向上定向的第二标记特征。 第二标记包括沿第一方向定向的第三标记特征,第四标记特征指向第二方向。