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    • 2. 发明授权
    • Exposure apparatus and device manufacturing method using a common path interferometer to form an interference pattern and a processor to calculate optical characteristics of projection optics using the interference pattern
    • 使用公共路径干涉仪形成干涉图案的曝光装置和装置制造方法以及使用干涉图案计算投影光学元件的光学特性的处理器
    • US07675629B2
    • 2010-03-09
    • US11851029
    • 2007-09-06
    • Yumiko OhsakiYasuhiro SawadaKenji YamazoeSeiji Takeuchi
    • Yumiko OhsakiYasuhiro SawadaKenji YamazoeSeiji Takeuchi
    • G01B9/02
    • G03F7/70566G02B27/0025G03F7/706
    • An exposure apparatus including an illumination system which illuminates an original, and projection optics which project a pattern of the original illuminated by the illumination system onto a substrate. The apparatus includes an interferometer which forms an interference pattern including aberration information on the projection optics using a polarized light beam emitted from the illumination system, in which the interferometer is a common path interferometer in which two light beams forming interference pattern pass along a path in the projection optics, and a processor which calculates optical characteristics of the projection optics on the basis of the interference pattern formed by the interferometer. The illumination system including a polarization controller which sequentially generates at least three difference polarized light beams with respective polarization states different from each other. The processor separates first aberration and second aberration from wavefront aberration represented by the interference patterns sequentially formed by the interferometer using the at least three different polarized light beams, by calculating a data of the interference patterns, the first aberration being aberration which does not change dependent on a polarization state of polarized light beam entering the projection optics. The second aberration is aberration which changes dependent on the polarization state of the polarized light beam entering the projection optics.
    • 一种曝光装置,包括照亮原稿的照明系统,以及投影光学元件,其将由照明系统照射的原稿的图案投影到基板上。 该装置包括干涉仪,其使用从照明系统发射的偏振光形成包括投影光学器件上的像差信息的干涉图案,其中干涉仪是公共路径干涉仪,其中形成干涉图案的两个光束沿着路径 投影光学器件和基于由干涉仪形成的干涉图案来计算投影光学元件的光学特性的处理器。 所述照明系统包括偏振控制器,其顺序地产生具有彼此不同的各自偏振状态的至少三个差分偏振光束。 处理器通过计算干涉图案的数据,使用至少三个不同的偏振光束分离由干涉仪顺序形成的干涉图案所表示的波前像差的第一像差和第二像差,第一像差是不依赖于变化的像差 在入射到投影光学器件的偏振光束的偏振状态下。 第二像差是根据进入投影光学器件的偏振光束的偏振状态而变化的像差。
    • 4. 发明申请
    • IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND IMAGE PROCESSING PROGRAM
    • 图像处理设备,图像处理方法和图像处理程序
    • US20100246994A1
    • 2010-09-30
    • US12675671
    • 2008-08-25
    • Yasuhiro Sawada
    • Yasuhiro Sawada
    • G06K9/40
    • H04N9/045H04N5/3572
    • An image processing device, an image processing method, and an image processing program by which deformation such as distortion caused by an imaging optical system can be corrected with high precision without increase in memory capacity and processing time. The image processing device comprises a vertex sampling coordinate computing section (30) for computing a sampling position on an input image by a high-order expression so as to cancel out distortion at the position of a predetermined pixel of an output image, a sampling coordinate interpolation computing section (31) for interpolating the sampling position on the input image, at the position of a pixel other than the position of the predetermined pixel of the output image, from a sampling position of a predetermined output pixel located near the pixel, and a sampling unit (32) for sampling a pixel value of the input image at the sampling position computed via the vertex sampling coordinate computing section (30) and the sampling coordinate interpolation computing section (31).
    • 可以在不增加存储容量和处理时间的情况下,以高精度校正由成像光学系统引起的失真等变形的图像处理装置,图像处理方法和图像处理程序。 该图像处理装置包括顶点采样坐标计算部分(30),用于通过高阶表达式计算输入图像上的采样位置,以抵消输出图像的预定像素的位置处的失真,采样坐标 插值计算部(31),用于在输入图像的除了输出图像的预定像素的位置之外的像素的位置处从输入图像上的取样位置插入位于像素附近的预定输出像素的采样位置;以及 采样单元(32),用于对经由顶点采样坐标运算部(30)计算出的采样位置处的输入图像的像素值和采样坐标插补运算部(31)进行采样。
    • 6. 发明授权
    • Short arc lamp
    • 短弧灯
    • US07312563B2
    • 2007-12-25
    • US11199129
    • 2005-08-09
    • Yasuhiro Sawada
    • Yasuhiro Sawada
    • H01J5/48H01J5/50H01J5/54
    • H01J61/86
    • According to the present invention, a short arc lamp comprises a lamp main body having a reflective surface therein, a first opening on an optical axis thereof, and a second openings, a window member provided so as to close the second opening and to define a discharge space between the lamp main body and the opening, a first electrode and a second electrode that are arranged so as to face each other, wherein a tip portion of each of the electrodes extends into the discharge space, and a base disposed approximately at a back end portion of the lamp main body, wherein a hole is formed in the base, the first electrode is held in a burying portion of the base, and a diameter of the first electrode in the burying portion is larger than that of the tip portion of the first electrode.
    • 根据本发明,短弧灯包括其中具有反射表面的灯主体,在其光轴上的第一开口和第二开口,设置成闭合第二开口并限定一个 灯主体与开口之间的放电空间,彼此相对配置的第一电极和第二电极,其中每个电极的末端部分延伸到放电空间中,并且大致设置在基座上的基座 灯主体的后端部,其中在基座中形成有孔,第一电极保持在基座的埋入部分中,并且埋入部分中的第一电极的直径大于末端部分的直径 的第一电极。
    • 7. 发明授权
    • Semiconductor apparatus
    • 半导体装置
    • US07247945B2
    • 2007-07-24
    • US11300230
    • 2005-12-13
    • Yasuhiro Sawada
    • Yasuhiro Sawada
    • H01L23/48H05K1/18
    • H05K1/181H01L23/49816H01L23/50H01L2224/16H01L2225/107H01L2924/00011H01L2924/00014H01L2924/3511H05K2201/10545H05K2201/10734Y02P70/611H01L2224/0401
    • A semiconductor apparatus includes a printed circuit board, a peripheral type first semiconductor package which has a first group of ball electrodes arranged in a peripheral type first arrangement area and a first group of additional ball electrodes arranged inside the first arrangement area and which is arranged on a first surface of the printed circuit board, and a peripheral type second semiconductor package which has a second group of ball electrodes arranged in a second arrangement area and a second group of additional ball electrodes arranged inside the second arrangement area and which is arranged on a second surface of the printed circuit board. A ball electrode located at at least one corner of the first group of ball electrodes is arranged at a position to oppose a corner of the second arrangement area, and at least one ball electrode of the second group of ball electrodes is arranged at a position to oppose the second group of additional ball electrodes through the printed circuit board.
    • 半导体装置包括印刷电路板,周边型第一半导体封装,其具有布置在周边型第一布置区域中的第一组球形电极和布置在第一布置区域内的第一组额外的球形电极,并且布置在 印刷电路板的第一表面和周边型第二半导体封装,其具有布置在第二布置区域中的第二组球形电极和布置在第二布置区域内的第二组额外的球形电极,并且布置在第二布置区域上 印刷电路板的第二表面。 位于第一组球电极组的至少一个拐角处的球形电极被布置在与第二配置区域的角部相对的位置,并且第二组球形电极组的至少一个球形电极被布置在 反对通过印刷电路板的第二组额外的球形电极。
    • 9. 发明申请
    • Semiconductor apparatus
    • 半导体装置
    • US20060125097A1
    • 2006-06-15
    • US11300230
    • 2005-12-13
    • Yasuhiro Sawada
    • Yasuhiro Sawada
    • H01L23/48
    • H05K1/181H01L23/49816H01L23/50H01L2224/16H01L2225/107H01L2924/00011H01L2924/00014H01L2924/3511H05K2201/10545H05K2201/10734Y02P70/611H01L2224/0401
    • A semiconductor apparatus includes a printed circuit board, a peripheral type first semiconductor package which has a first group of ball electrodes arranged in a peripheral type first arrangement area and a first group of additional ball electrodes arranged inside the first arrangement area and which is arranged on a first surface of the printed circuit board, and a peripheral type second semiconductor package which has a second group of ball electrodes arranged in a second arrangement area and a second group of additional ball electrodes arranged inside the second arrangement area and which is arranged on a second surface of the printed circuit board. A ball electrode located at at least one corner of the first group of ball electrodes is arranged at a position to oppose a corner of the second arrangement area, and at least one ball electrode of the second group of ball electrodes is arranged at a position to oppose the second group of additional ball electrodes through the printed circuit board.
    • 半导体装置包括印刷电路板,周边型第一半导体封装,其具有布置在周边型第一布置区域中的第一组球形电极和布置在第一布置区域内的第一组额外的球形电极,并且布置在 印刷电路板的第一表面和周边型第二半导体封装,其具有布置在第二布置区域中的第二组球形电极和布置在第二布置区域内的第二组额外的球形电极,并且布置在第二布置区域上 印刷电路板的第二表面。 位于第一组球电极组的至少一个拐角处的球形电极被布置在与第二配置区域的角部相对的位置,并且第二组球形电极组的至少一个球形电极被布置在 反对通过印刷电路板的第二组额外的球形电极。