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    • 2. 发明授权
    • GPS module test system for automatically calibrating test signal
    • GPS模块测试系统,用于自动校准测试信号
    • US07826994B2
    • 2010-11-02
    • US12139596
    • 2008-06-16
    • Yu-Bang FuHao-Chih Lin
    • Yu-Bang FuHao-Chih Lin
    • G01D18/00G01C21/00
    • G01S19/235
    • A GPS module test system for automatically calibrating a test signal includes a GPS test fixture, a satellite signal simulator, and a computer. The GPS test fixture carries a GPS module under test and is electrically connected to the same through contact, so as to receive a digital signal generated by the GPS module after the test. The computer receives device information of the GPS module under test through the GPS test fixture, and controls the satellite signal simulator through a GPS signal sample database, so as to generate a GPS analog signal to test the GPS module under test. Thereafter, on receiving the digital signal generated by the GPS module under test and determining the received digital signal is attenuated, the computer automatically gains a transmitted test parameter, so as to transmit the GPS analog signal in a preferable state.
    • 用于自动校准测试信号的GPS模块测试系统包括GPS测试夹具,卫星信号模拟器和计算机。 GPS测试夹具携带被测试的GPS模块,并通过接触电连接,以便在测试后接收GPS模块产生的数字信号。 计算机通过GPS测试夹具接收待测GPS卫星模块的设备信息,并通过GPS信号采样数据库对卫星信号模拟器进行控制,以产生GPS模拟信号,测试被测GPS卫星模块。 此后,在接收到被测GPS系统模块生成的数字信号并确定接收到的数字信号被衰减时,计算机自动获得发送的测试参数,以便将GPS模拟信号发送到优选状态。
    • 4. 发明申请
    • Circuit Board
    • 电路板
    • US20120261180A1
    • 2012-10-18
    • US13176482
    • 2011-07-05
    • Yu-Bang Fu
    • Yu-Bang Fu
    • H05K1/11
    • H05K1/0271H05K1/0278H05K2201/09063H05K2201/10409
    • A circuit board is capable of reduce the effect of bowing. The circuit board comprises a substrate, a plurality of first vias, a plurality of second vias, and a plurality of first blocks. The substrate comprises a conductive layer outside the first blocks. The first vias pass through the substrate and the conductive layer. The first blocks would comprise the second vias, which passes through the substrate. The first vias and the first blocks can be individually or jointly disposed in a central area of the substrate, around a fastening hole, or around a circuit component. The fastening hole can be connected to at least one of the second vias by a conducting wire when the first block with the second vias is disposed around the fastening hole.
    • 电路板能够减少弯曲的影响。 电路板包括衬底,多个第一通孔,多个第二通孔和多个第一块。 衬底包括在第一块之外的导电层。 第一通孔穿过衬底和导电层。 第一块将包括通过基板的第二通孔。 第一通孔和第一块可以单独地或共同地设置在基板的中心区域中,围绕紧固孔或围绕电路部件。 当具有第二通孔的第一块设置在紧固孔周围时,紧固孔可以通过导线连接到第二通孔中的至少一个。