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1. 发明申请

US20140354318A1 INTERCONNECTS INCLUDING LIQUID METAL 有权
标题翻译：包括液体金属的互连
公开(公告)号：US20140354318A1
公开(公告)日：2014-12-04
申请号：US13903874
申请日：2013-05-28
申请人： Youngseok Oh , Joe F. Walczyk , Jin Yang , Pooya Tadayon , Ting Zhong
发明人： Youngseok Oh , Joe F. Walczyk , Jin Yang , Pooya Tadayon , Ting Zhong
IPC分类号： G01R1/067 , G01R3/00
CPC分类号： G01R1/06783 , G01R1/07307 , Y10T29/49124
摘要： Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.
摘要翻译：本公开的实施例涉及包括液态金属以及相关技术和配置的互连。各个互连可以将印刷电路板（PCB）的触点电耦合到被测器件（DUT）的触点。互连可以设置在PCB中或PCB上。在各种实施例中，互连可以包括限定阱（例如，载体中的开口）的载体，并且液体金属可以设置在阱中。在一些实施例中，DUT或中间装置的触点的接触可以延伸到井中并直接接触液态金属。在其他实施例中，柔性电路可以设置在井上以密封井。柔性电路可以包括用于将液体金属电耦合到DUT的触点的导电焊盘。可以描述和要求保护其他实施例。

2. 发明申请

US20230077939A1 PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DUAL CYLINDRICAL LENS 有权
公开(公告)号：US20230077939A1
公开(公告)日：2023-03-16
申请号：US17476120
申请日：2021-09-15
申请人： Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
发明人： Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
IPC分类号： G02B6/42
摘要： An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a curved surface in a shape of a quarter cylinder that is configured to steer light emitted from the emitting lens in a direction substantially orthogonal to the first surface of the PIC.

3. 发明申请

US20140092505A1 SORT PROBE OVER CURRENT PROTECTION MECHANISM 有权
标题翻译：电流保护机制的分类探索
公开(公告)号：US20140092505A1
公开(公告)日：2014-04-03
申请号：US13630114
申请日：2012-09-28
申请人： Benjamin J. Norris , Pooya Tadayon , Mark W. Dryfuse
发明人： Benjamin J. Norris , Pooya Tadayon , Mark W. Dryfuse
IPC分类号： H02H9/02 , H02H9/04
CPC分类号： G01R1/203 , G01R1/07307 , G01R19/165 , G01R31/024 , G01R31/2601 , H02H3/08 , H02H9/02 , H02H9/045
摘要： An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes.
摘要翻译：一种装置包括探针卡，耦合到探针卡的多个分类探针和检测器电路，用于检测分类探针上的当前发生的实时时间。

4. 发明申请

US20060038576A1 Sort interface unit having probe capacitors 审中-公开
标题翻译：对具有探针电容器的接口单元进行排序
公开(公告)号：US20060038576A1
公开(公告)日：2006-02-23
申请号：US10922323
申请日：2004-08-19
申请人： Pooya Tadayon
发明人： Pooya Tadayon
IPC分类号： G01R31/02
CPC分类号： G01R1/06766
摘要： Briefly, in accordance with one embodiment of the invention, a sort interface unit of a wafer tester may include a micro-electromechanical system (MEMS) capacitor disposed between selected pairs of the probe tips of the sort interface unit, for example between power and ground probes. In one embodiment, the MEMS capacitor may be disposed at the ends of the probe tips nearer the wafer when the wafer is tested by the wafer tester. In another embodiment, a first capacitor having a higher value may be used for higher power circuits on the wafer, and a second capacitor having a lower value may be used for lower power circuits on the wafer. In such an arrangement, the capacitors on the probes of the sort interface unit may be selected according to a spatial power distribution of the power of the circuit or circuits on the wafer.
摘要翻译：简而言之，根据本发明的一个实施例，晶片测试器的分类接口单元可以包括设置在分类接口单元的选定对的探针尖端之间的微机电系统（MEMS）电容器，例如在电源和地之间探针。在一个实施例中，当通过晶片测试器测试晶片时，MEMS电容器可以设置在靠近晶片的探针尖端的端部。在另一个实施例中，具有较高值的第一电容器可用于晶片上的较高功率电路，并且具有较低值的第二电容器可用于晶片上的较低功率电路。在这种布置中，可以根据晶片上的电路或电路的功率的空间功率分布来选择分类接口单元的探针上的电容器。

5. 发明申请

US20230090133A1 DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION 有权
公开(公告)号：US20230090133A1
公开(公告)日：2023-03-23
申请号：US17481027
申请日：2021-09-21
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
IPC分类号： G02B6/42 , H01L25/18 , H01L23/00 , H01L25/00
摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

6. 发明申请

US20190004089A1 CHEVRON INTERCONNECT FOR VERY FINE PITCH PROBING 审中-公开
公开(公告)号：US20190004089A1
公开(公告)日：2019-01-03
申请号：US15640415
申请日：2017-06-30
申请人： Pooya Tadayon
发明人： Pooya Tadayon
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28
摘要： An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.

7. 发明申请

US20050029903A1 Electrical energy-generating heat sink system and method of using same to recharge an energy storage device 失效
标题翻译：电能发电散热器系统及其使用方法为蓄能装置充电
公开(公告)号：US20050029903A1
公开(公告)日：2005-02-10
申请号：US10880989
申请日：2004-06-30
申请人： Pooya Tadayon , Koorosh Zaerpoor
发明人： Pooya Tadayon , Koorosh Zaerpoor
IPC分类号： F01K3/18 , F03G7/00 , H02N2/18 , H02N2/00 , H01M10/44
CPC分类号： H02N2/18 , F01K3/185 , F03G7/00
摘要： An electrical energy-generating heat sink system provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
摘要翻译：一种发电散热器系统为电子设备中的能量存储装置的连续再充电提供了一种便利且经济的方法。

8. 发明授权

US06574963B1 Electrical energy-generating heat sink system and method of using same to recharge an energy storage device 有权
公开(公告)号：US06574963B1
公开(公告)日：2003-06-10
申请号：US09991110
申请日：2001-11-16
申请人： Pooya Tadayon , Franklin G. Monzon , Prateek Dujari
发明人： Pooya Tadayon , Franklin G. Monzon , Prateek Dujari
IPC分类号： F01K2508
CPC分类号： F01K3/185 , F03G7/00
摘要： An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

9. 发明申请

US20230087124A1 DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKAGING 有权
公开(公告)号：US20230087124A1
公开(公告)日：2023-03-23
申请号：US17483013
申请日：2021-09-23
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
IPC分类号： G02B6/42
摘要： Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

10. 发明授权

US09360502B2 Increasing current carrying capability through direct liquid cooling of test contacts 有权
标题翻译：通过测试触点的直接液体冷却来提高载流能力
公开(公告)号：US09360502B2
公开(公告)日：2016-06-07
申请号：US13976013
申请日：2011-12-31
申请人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
发明人： Warren S. Crippen , Brett Grossman , Roy E. Swart , Pooya Tadayon
IPC分类号： G01R31/10 , G01R1/44 , G01R31/28 , G01R1/067
CPC分类号： G01R1/44 , G01R1/067 , G01R31/2877
摘要： Testing methods and systems are described. One method for testing an electronic device includes providing a probe in electrical contact with a device. The method also includes positioning an interface of the probe and the device in a liquid medium. The method also includes transmitting a current from the probe through the interface while the interface is in the liquid medium. Other embodiments are described and claimed.
摘要翻译：描述测试方法和系统。用于测试电子设备的一种方法包括提供与设备电接触的探针。该方法还包括将探针和装置的界面定位在液体介质中。该方法还包括当界面处于液体介质中时通过界面从探针传输电流。描述和要求保护其他实施例。

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