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1. 发明授权

US07720374B2 Camera module 有权
标题翻译：相机模块
公开(公告)号：US07720374B2
公开(公告)日：2010-05-18
申请号：US11457766
申请日：2006-07-14
申请人： Young-Seok Kim , Hyeok-Hwan Kwon , Hyun-Kyu Choi , Hwan-Chul Lee
发明人： Young-Seok Kim , Hyeok-Hwan Kwon , Hyun-Kyu Choi , Hwan-Chul Lee
IPC分类号： G03B7/26
CPC分类号： H01L27/14636 , H01L27/14621 , H01L27/14625 , H01L27/14634 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要： The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate. Alternatively, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the horizontal portion is formed to be flat such that it is attached to a peripheral portion of a top surface of the translucent substrate. Otherwise, the holder comprises a horizontal portion formed with a through-hole, and a bottom surface of the horizontal portion is attached to at least a peripheral portion of a top surface of the translucent substrate.
摘要翻译：本发明涉及一种照相机模块，其包括封装的图像传感器，IR滤光器，透镜和用于保持这些部件的保持器，并且具有减小的总体尺寸和高度。根据本发明的相机模块包括其上形成有透光性基板的图像传感器封装; 以及具有附接到图像传感器封装的透光性基板的下端的保持器。此时，保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分，并且连接部分的下端的端表面形成有内部台阶部分以便附着到透光性基板的上表面和侧面的周边部。或者，保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分，并且水平部分的下端的端表面形成为平坦的，使得其被附接到透光性基板的顶面的周边部。否则，保持器包括形成有通孔的水平部分，并且水平部分的底表面附接到透光性基板的顶表面的至少周边部分。

2. 发明申请

US20080283952A1 Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor 审中-公开
标题翻译：半导体封装，其制造方法和用于图像传感器的半导体封装模块
公开(公告)号：US20080283952A1
公开(公告)日：2008-11-20
申请号：US12091285
申请日：2006-12-22
申请人： Hyun-Kyu Choi , Chor Hong Koh
发明人： Hyun-Kyu Choi , Chor Hong Koh
IPC分类号： H01L23/28 , H01L23/48 , H01L27/00 , H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L31/0232 , H01L2224/05553 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/12043 , H01L2924/16195 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00
摘要： Provided are a semiconductor package, a method of fabricating the same, and a semiconductor package module for an image sensor The semiconductor package includes a mounting portion on which a semiconductor chip is mounted; a semiconductor chip including a plurality of bonding pads disposed along an edge thereof, wherein the semiconductor chip adhered onto the mounting portion; a plurality of leads spaced apart from a sidewall of the semiconductor chip and having a greater height than the semiconductor chip; an encapsulant for fixing the mounting portion and the leads and encapsulating a bottom surface and a sidewall of the semiconductor package and exposing top and bottom surfaces of the leads; bonding wires for connecting the bonding pads of the semiconductor chip with the exposed top surfaces of the leads; and a transparent plate adhered onto the leads a predetermined space apart from the semiconductor chip.
摘要翻译：提供半导体封装，其制造方法和用于图像传感器的半导体封装模块。半导体封装包括其上安装有半导体芯片的安装部分; 半导体芯片，其包括沿着其边缘设置的多个接合焊盘，其中所述半导体芯片粘附到所述安装部分上; 多个引线与半导体芯片的侧壁间隔开并且具有比半导体芯片更大的高度; 用于固定安装部分和引线并且封装半导体封装的底表面和侧壁并暴露引线的顶表面和底表面的密封剂; 用于将半导体芯片的焊盘与引线的暴露的顶表面连接的接合线; 以及将与半导体芯片隔开的预定空间粘附到引线上的透明板。

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