专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100062552A1 SILICONE RESIN COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND PROCESS FOR PRODUCING OPTICAL-SEMICONDUCTOR ELECTRONIC PART WITH THE SAME THROUGH POTTING 有权
标题翻译：用于封装发光元件的硅树脂组合物和通过凹槽生产光学半导体电子部件的方法
公开(公告)号：US20100062552A1
公开(公告)日：2010-03-11
申请号：US12449921
申请日：2008-03-10
申请人： Yoshiteru Miyawaki , Osamu Tanaka
发明人： Yoshiteru Miyawaki , Osamu Tanaka
IPC分类号： H01L21/56 , C08K3/34
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08K3/36 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/54 , H01L2924/00
摘要： The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method.More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method. The invention also provides a process for producing an optical semiconductor electronic part, including applying the composition as an encapsulating resin to a substrate with a light-emitting element, thereby molding the encapsulating resin into a lens shape by potting.
摘要翻译：本发明提供了一种用于封装发光元件的硅树脂组合物，通过该有机硅树脂组合物可以容易地实现使用灌封方法的封装，并且可以容易地模制成诸如半球，抛物线等的透镜形状。该组合物可以赋予使用灌封法成型的所得封装透镜高透明度。更具体地说，本发明提供一种用于封装发光元件的有机硅树脂组合物，其包含基于组分（A）和（B）的总量的平均粒径为1至30nm的2至25重量％的二氧化硅; 并且粘度（23℃）大于10Pa·s且小于70Pa·s，触变指数为2.0〜5.5; 该组合物使用灌封方法用于封装。本发明还提供了一种用于制造光学半导体电子部件的方法，包括将组合物作为封装树脂施加到具有发光元件的基板上，从而通过灌封将封装树脂模制成透镜形状。

2. 发明授权

US08202933B2 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting 有权
标题翻译：用于封装发光元件的硅树脂组合物和通过灌封制造具有相同光学半导体电子部件的方法
公开(公告)号：US08202933B2
公开(公告)日：2012-06-19
申请号：US12449921
申请日：2008-03-10
申请人： Yoshiteru Miyawaki , Osamu Tanaka
发明人： Yoshiteru Miyawaki , Osamu Tanaka
IPC分类号： C08L83/04 , H01L23/29
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08K3/36 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/54 , H01L2924/00
摘要： The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method.More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method. The invention also provides a process for producing an optical semiconductor electronic part, including applying the composition as an encapsulating resin to a substrate with a light-emitting element, thereby molding the encapsulating resin into a lens shape by potting.
摘要翻译：本发明提供了一种用于封装发光元件的硅树脂组合物，通过该有机硅树脂组合物可以容易地实现使用灌封方法的封装，并且可以容易地模制成诸如半球，抛物线等的透镜形状。该组合物可以赋予使用灌封法成型的所得封装透镜高透明度。更具体地说，本发明提供一种用于封装发光元件的有机硅树脂组合物，其包含基于组分（A）和（B）的总量的平均粒径为1至30nm的2至25重量％的二氧化硅; 并且粘度（23℃）大于10Pa·s且小于70Pa·s，触变指数为2.0〜5.5; 该组合物使用灌封方法用于封装。本发明还提供了一种用于制造光学半导体电子部件的方法，包括将组合物作为封装树脂施加到具有发光元件的基板上，从而通过灌封将封装树脂模制成透镜形状。

3. 发明申请

US20090186454A1 Method for manufacturing electronic device 有权
标题翻译：电子设备制造方法
公开(公告)号：US20090186454A1
公开(公告)日：2009-07-23
申请号：US12232334
申请日：2008-09-16
申请人： Yoshiteru Miyawaki , Dongxu Wang
发明人： Yoshiteru Miyawaki , Dongxu Wang
IPC分类号： H01L21/56
CPC分类号： H01L23/24 , H01L21/56 , H01L21/565 , H01L24/48 , H01L24/97 , H01L33/005 , H01L33/483 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01055 , H01L2924/01065 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.
摘要翻译：一种用于制造具有多个引线框架的电子设备的方法，所述多个引线框架用于单独地支撑由壳体8包围的电子部件6，该方法包括以下步骤：在基板5上将树脂10装入每个壳体8中，在该基板5上，引线框架被设置，并且将基板5切割成单独的引线框架。对第一树脂充电的步骤包括使用具有通孔1a的掩模1的步骤，该掩模1对应于由壳体8包围的区域的位置，以将树脂10充电到由壳体8包围的区域中。该方法能够提高制造电子设备的生产率，其中引线框架用于单独地支撑被壳体包围的电子部件，并使树脂的形状均匀地覆盖电子部件。

4. 发明授权

US09373730B2 Method and apparatus for manufacturing optical device 有权
标题翻译：光学元件制造方法及装置
公开(公告)号：US09373730B2
公开(公告)日：2016-06-21
申请号：US14113944
申请日：2012-04-19
申请人： Yoshiteru Miyawaki , Jun Oki , Daisuke Kounou , Nobuhiko Iwasaki
发明人： Yoshiteru Miyawaki , Jun Oki , Daisuke Kounou , Nobuhiko Iwasaki
IPC分类号： H01L21/00 , H01L31/0203 , H01L33/54 , H01L33/58
CPC分类号： H01L31/0203 , H01L31/18 , H01L33/483 , H01L33/54 , H01L33/58 , H01L2933/0033 , H01L2933/005
摘要： An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.
摘要翻译：一种光学器件制造装置包括：封装装置，用于通过液晶树脂R以透镜形状封装安装在基板2上的光半导体元件4，以及用于固化液态树脂R的固化装置，其中所述封装装置包括分配器垂直移动用于供给液体树脂R的喷嘴25，并且使喷嘴25的末端靠近光半导体元件4，然后在提升喷嘴25的同时供给液体树脂R.根据该光学装置制造装置，可以迅速且容易地获得具有所需光学特性的光学装置。

5. 发明申请

US20140051196A1 METHOD AND APPARATUS FOR MANUFACTURING OPTICAL DEVICE 有权
标题翻译：制造光学器件的方法和装置
公开(公告)号：US20140051196A1
公开(公告)日：2014-02-20
申请号：US14113944
申请日：2012-04-19
申请人： Yoshiteru Miyawaki , Jun Oki , Daisuke Kounou , Nobuhiko Iwasaki
发明人： Yoshiteru Miyawaki , Jun Oki , Daisuke Kounou , Nobuhiko Iwasaki
IPC分类号： H01L31/0203 , H01L33/54
CPC分类号： H01L31/0203 , H01L31/18 , H01L33/483 , H01L33/54 , H01L33/58 , H01L2933/0033 , H01L2933/005
摘要： An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.
摘要翻译：一种光学器件制造装置包括：封装装置，用于通过液晶树脂R以透镜形状封装安装在基板2上的光半导体元件4，以及用于固化液态树脂R的固化装置，其中所述封装装置包括分配器垂直移动用于供给液体树脂R的喷嘴25，并且使喷嘴25的末端靠近光半导体元件4，然后在提升喷嘴25的同时供给液体树脂R.根据该光学装置制造装置，可以迅速且容易地获得具有所需光学特性的光学装置。

6. 发明授权

US07888189B2 Method for manufacturing electronic device 有权
标题翻译：电子设备制造方法
公开(公告)号：US07888189B2
公开(公告)日：2011-02-15
申请号：US12232334
申请日：2008-09-16
申请人： Yoshiteru Miyawaki , Dongxu Wang
发明人： Yoshiteru Miyawaki , Dongxu Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/24 , H01L21/56 , H01L21/565 , H01L24/48 , H01L24/97 , H01L33/005 , H01L33/483 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01055 , H01L2924/01065 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.
摘要翻译：一种用于制造具有多个引线框架的电子设备的方法，所述多个引线框架用于单独地支撑由壳体8包围的电子部件6，该方法包括以下步骤：在基板5上将树脂10装入每个壳体8中，在该基板5上，引线框架被设置，并且将基板5切割成单独的引线框架。对第一树脂充电的步骤包括使用具有通孔1a的掩模1的步骤，该掩模1对应于由壳体8包围的区域的位置，以将树脂10充电到由壳体8包围的区域中。该方法能够提高制造电子设备的生产率，其中引线框架用于单独地支撑被壳体包围的电子部件，并使树脂的形状均匀地覆盖电子部件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式